JP6058959B2 - 硬化性アミン、カルボン酸フラックス組成物およびはんだ付け方法 - Google Patents
硬化性アミン、カルボン酸フラックス組成物およびはんだ付け方法 Download PDFInfo
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- JP6058959B2 JP6058959B2 JP2012210449A JP2012210449A JP6058959B2 JP 6058959 B2 JP6058959 B2 JP 6058959B2 JP 2012210449 A JP2012210449 A JP 2012210449A JP 2012210449 A JP2012210449 A JP 2012210449A JP 6058959 B2 JP6058959 B2 JP 6058959B2
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3618—Carboxylic acids or salts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
- B23K1/203—Fluxing, i.e. applying flux onto surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C211/00—Compounds containing amino groups bound to a carbon skeleton
- C07C211/01—Compounds containing amino groups bound to a carbon skeleton having amino groups bound to acyclic carbon atoms
- C07C211/02—Compounds containing amino groups bound to a carbon skeleton having amino groups bound to acyclic carbon atoms of an acyclic saturated carbon skeleton
- C07C211/09—Diamines
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- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C215/00—Compounds containing amino and hydroxy groups bound to the same carbon skeleton
- C07C215/02—Compounds containing amino and hydroxy groups bound to the same carbon skeleton having hydroxy groups and amino groups bound to acyclic carbon atoms of the same carbon skeleton
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
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- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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- H01L24/92—Specific sequence of method steps
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
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Description
2,6−ジアミノ−2,5,6−トリメチルヘプタン−3−オール アミンフラックス剤が以下の手順を使用して製造された。最初に、2,5,6−トリメチル−2,6−ジニトロヘプタン−3−オール中間体が以下の合成方法を使用して製造された。
2,6−ジアミノ−2,6−ジメチル−5−フェニルヘプタン−3−オール アミンフラックス剤が以下の手順を使用して製造された。最初に、2,6−ジメチル−2,6−ジニトロ−5−フェニルヘプタン−3−オール中間体が以下の合成方法を使用して製造された。
下記式
下記式
実施例3に示された手順に従って製造されたアミンフラックス剤(4g)が、周囲条件下で、1,3−ジオキソラン(1.5g)中の1,4−ジヒドロキシ−2−ナフトエ酸(0.37g)と手作業で混合されて、約2:1のアミンフラックス剤アミン窒素:カルボン酸酸含量(−COOH)当量比を有するフラックス複合体を形成した。80℃で30分間加熱することによって、フラックス複合体から1,3−ジオキソランが除去された。
実施例4に示された手順に従って製造されたアミンフラックス剤(4g)が、周囲条件下で、スパチュラを用いて1,4−ジヒドロキシ−2−ナフトエ酸(0.37g)と手作業で混合されて、1.8:1のアミンフラックス剤アミン窒素:カルボン酸酸含量(−COOH)当量比を有するフラックス複合体を形成した。
実施例6に従って製造されたフラックス複合体が、エピクロロヒドリンとビスフェノールAとの液体エポキシ樹脂反応生成物(ザダウケミカルカンパニーからD.E.R.商標331商標として入手可能)と1:1重量比で一緒にされて硬化性フラックス組成物を形成した。
実施例7に従って製造された硬化性フラックス組成物のフラックス能力が、以下の手順を用いて評価された。はんだ付けされる電気接点として銅クーポンが使用された。この銅クーポンのはんだ付けされる表面上に、実施例7に従って製造された硬化性フラックス組成物の小滴が分配された。鉛を含まないはんだ(95.5重量%Sn/4.0重量%Ag/0.5重量%Cu)の直径0.381mmのボール4つが、銅クーポン上のフラックス複合体の小滴中に配置された。使用されたこの鉛を含まないはんだの溶融範囲は217〜221℃であった。次いで、この銅クーポンは、145℃に予備加熱されたホットプレート上に置かれ、そこで2分間保持された。次いで、この銅クーポンは260℃に予備加熱された別のホットプレート上に配置され、そこではんだがリフロー条件に到達するまで保持された。次いで、この銅クーポンは熱源から取り外され、(a)元々配置された4つのはんだボールの融合および合体の程度、(b)フローおよび広がりを評価するための得られた合体したはんだのサイズ、並びに(c)銅クーポンの表面へのはんだの結合によって評価された。この硬化性フラックス組成物のフラックス能力は以下の0〜4の等級で、4であったと決定された:
1、2=はんだ滴どうしの部分的〜完全な融合、しかしはんだは銅クーポンと結合せず;
3=はんだ滴どうしの完全な融合、しかし最小限のはんだの広がりおよびフロー;
4=はんだ滴どうしの完全な融合、銅クーポンの表面上での良好なはんだの広がりおよびフロー、並びに銅クーポンへのはんだの結合。
Claims (10)
- 分子あたり少なくとも2つのオキシラン基を有する樹脂成分;
カルボン酸;
式I:
場合によっては硬化剤;
を当初成分として含む硬化性フラックス組成物。 - 前記カルボン酸がC8−20脂肪族モノカルボン酸、C2−20脂肪族ジカルボン酸、C6−20芳香族カルボン酸、並びにこれらの混合物からなる群から選択される、請求項1に記載の硬化性フラックス組成物。
- 前記カルボン酸が、オクタン酸、ノナン酸、ウンデカン酸、ドデカン酸、トリデカン酸、テトラデカン酸、ペンタデカン酸、ヘキサデカン酸、ヘプタデカン酸、ステアリン酸、ヒドロキシステアリン酸、オレイン酸、リノール酸、α−リノレン酸、イコサン酸、シュウ酸、マロン酸、コハク酸、リンゴ酸、グルタル酸、アジピン酸、ピメリン酸、スベリン酸、安息香酸、フタル酸、イソフタル酸、テレフタル酸、ヘミメリット酸、トリメリット酸、トリメシン酸、メロファン酸、プレーニト酸、ピロメリット酸、メリット酸、トルイル酸、キシリル酸、ヘメリト酸、メシチレン酸、プレーニト酸、ケイ皮酸、サリチル酸、安息香酸、ナフトエ酸、フェノールフタリン、ジフェノール酸およびこれらの混合物からなる群から選択される請求項2に記載の硬化性フラックス組成物。
- 当該フラックス組成物が、1:1〜20:1のフラックス剤アミン窒素:カルボン酸酸含量(−COOH)当量比を示す、請求項1に記載の硬化性フラックス組成物。
- R1、R2、R3およびR4の置換C1−80アルキル基および置換C7−80アリールアルキル基における置換が、−OH基、−OR5基、−COR 5’ −基、−COR5基、−C(O)R5基、−CHO基、−C(O)OR5基、−OC(O)OR5基、−S(O)(O)R5基、−S(O)R5基、−S(O)(O)NR5 2基、−OC(O)NR6 2基、−C(O)NR6 2基、−CN基、−N(R6)−基、および−NO2基の少なくとも1種から選択され;R5がC1−28アルキル基、C3−28シクロアルキル基、C6−15アリール基、C7−28アリールアルキル基、およびC7−28アルキルアリール基から選択され;R 5’ がC 1−28 アルキレン基、C 3−28 シクロアルキレン基、C 6−15 アリーレン基、C 7−28 アリールアルキレン基、およびC 7−28 アルキルアリーレン基から選択され;R6が、水素、C1−28アルキル基、C3−28シクロアルキル基、C6−15アリール基、C7−28アリールアルキル基、およびC7−28アルキルアリール基から選択される;
請求項1に記載の硬化性フラックス組成物。 - R1、R2、R3およびR4の1〜3つが水素である請求項1に記載の硬化性フラックス組成物。
- R1、R2、R3およびR4が独立して水素、−CH2CH(OH)R18、および−CH2CH(OH)CH2−O−R18基から選択され;R18が水素、C1−28アルキル基、C3−28シクロアルキル基、C6−28アリール基、C7−28アリールアルキル基、およびC7−28アルキルアリール基から選択され;R7およびR8は両方ともメチル基であり;R10およびR11は両方ともメチル基であり;並びにR9はメチル基およびフェニル基から選択され;並びにR1、R2、R3およびR4の0〜3つが水素である請求項1に記載の硬化性フラックス組成物。
- R1およびR2の一方が水素であり、かつR3およびR4の一方が水素である請求項4に記載の硬化性フラックス組成物。
- はんだ粉体をさらに含む請求項1に記載の硬化性フラックス組成物。
- 請求項1に記載の硬化性フラックス組成物を提供し;
複数の第1の電気接点を提供し;
対応する複数の第2の電気接点を提供し;
はんだを提供し;
前記複数の第1の電気接点および前記対応する複数の第2の電気接点の少なくとも一方に前記硬化性フラックス組成物を適用し;
前記複数の第1の電気接点を前記対応する複数の第2の電気接点の近くに配置し;
前記はんだをそのリフロー温度より高く加熱し、溶融したはんだを形成し、そして前記複数の第1の電気接点および前記対応する複数の第2の電気接点を前記溶融したはんだに曝し;
前記複数の第1の電気接点および前記対応する複数の第2の電気接点における前記硬化性フラックス組成物を前記溶融したはんだで置き換えて、そして前記複数の第1の電気接点と前記対応する複数の第2の電気接点との間の複数の電気的相互接続を形成し;並びに
前記樹脂成分を硬化させ、前記複数の電気的相互接続を封止する;
ことを含む、封止された金属接続を形成する方法。
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US13/250,125 | 2011-09-30 | ||
US13/250,125 US8430293B2 (en) | 2011-09-30 | 2011-09-30 | Curable amine, carboxylic acid flux composition and method of soldering |
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JP6058959B2 true JP6058959B2 (ja) | 2017-01-11 |
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CN (1) | CN103071950B (ja) |
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-
2011
- 2011-09-30 US US13/250,125 patent/US8430293B2/en not_active Expired - Fee Related
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2012
- 2012-09-25 JP JP2012210449A patent/JP6058959B2/ja not_active Expired - Fee Related
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- 2012-09-28 FR FR1259146A patent/FR2980726B1/fr not_active Expired - Fee Related
- 2012-09-28 DE DE102012019259A patent/DE102012019259A1/de not_active Withdrawn
- 2012-09-28 KR KR1020120108917A patent/KR101992637B1/ko active IP Right Grant
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KR20130035954A (ko) | 2013-04-09 |
FR2980726B1 (fr) | 2014-06-13 |
TWI438177B (zh) | 2014-05-21 |
US8430293B2 (en) | 2013-04-30 |
KR101992637B1 (ko) | 2019-06-25 |
US20130082092A1 (en) | 2013-04-04 |
CN103071950A (zh) | 2013-05-01 |
DE102012019259A1 (de) | 2013-04-04 |
FR2980726A1 (fr) | 2013-04-05 |
TW201323376A (zh) | 2013-06-16 |
CN103071950B (zh) | 2014-10-01 |
JP2013079376A (ja) | 2013-05-02 |
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