JP6012956B2 - アミンフラックス組成物およびはんだ付け方法 - Google Patents
アミンフラックス組成物およびはんだ付け方法 Download PDFInfo
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- JP6012956B2 JP6012956B2 JP2011260174A JP2011260174A JP6012956B2 JP 6012956 B2 JP6012956 B2 JP 6012956B2 JP 2011260174 A JP2011260174 A JP 2011260174A JP 2011260174 A JP2011260174 A JP 2011260174A JP 6012956 B2 JP6012956 B2 JP 6012956B2
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-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C211/00—Compounds containing amino groups bound to a carbon skeleton
- C07C211/01—Compounds containing amino groups bound to a carbon skeleton having amino groups bound to acyclic carbon atoms
- C07C211/02—Compounds containing amino groups bound to a carbon skeleton having amino groups bound to acyclic carbon atoms of an acyclic saturated carbon skeleton
- C07C211/09—Diamines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3615—N-compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
- B23K1/203—Fluxing, i.e. applying flux onto surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/365—Selection of non-metallic compositions of coating materials either alone or conjoint with selection of soldering or welding materials
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C215/00—Compounds containing amino and hydroxy groups bound to the same carbon skeleton
- C07C215/02—Compounds containing amino and hydroxy groups bound to the same carbon skeleton having hydroxy groups and amino groups bound to acyclic carbon atoms of the same carbon skeleton
- C07C215/04—Compounds containing amino and hydroxy groups bound to the same carbon skeleton having hydroxy groups and amino groups bound to acyclic carbon atoms of the same carbon skeleton the carbon skeleton being saturated
- C07C215/06—Compounds containing amino and hydroxy groups bound to the same carbon skeleton having hydroxy groups and amino groups bound to acyclic carbon atoms of the same carbon skeleton the carbon skeleton being saturated and acyclic
- C07C215/18—Compounds containing amino and hydroxy groups bound to the same carbon skeleton having hydroxy groups and amino groups bound to acyclic carbon atoms of the same carbon skeleton the carbon skeleton being saturated and acyclic with hydroxy groups and at least two amino groups bound to the carbon skeleton
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C215/00—Compounds containing amino and hydroxy groups bound to the same carbon skeleton
- C07C215/02—Compounds containing amino and hydroxy groups bound to the same carbon skeleton having hydroxy groups and amino groups bound to acyclic carbon atoms of the same carbon skeleton
- C07C215/22—Compounds containing amino and hydroxy groups bound to the same carbon skeleton having hydroxy groups and amino groups bound to acyclic carbon atoms of the same carbon skeleton the carbon skeleton being unsaturated
- C07C215/28—Compounds containing amino and hydroxy groups bound to the same carbon skeleton having hydroxy groups and amino groups bound to acyclic carbon atoms of the same carbon skeleton the carbon skeleton being unsaturated and containing six-membered aromatic rings
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C217/00—Compounds containing amino and etherified hydroxy groups bound to the same carbon skeleton
- C07C217/02—Compounds containing amino and etherified hydroxy groups bound to the same carbon skeleton having etherified hydroxy groups and amino groups bound to acyclic carbon atoms of the same carbon skeleton
- C07C217/04—Compounds containing amino and etherified hydroxy groups bound to the same carbon skeleton having etherified hydroxy groups and amino groups bound to acyclic carbon atoms of the same carbon skeleton the carbon skeleton being acyclic and saturated
- C07C217/28—Compounds containing amino and etherified hydroxy groups bound to the same carbon skeleton having etherified hydroxy groups and amino groups bound to acyclic carbon atoms of the same carbon skeleton the carbon skeleton being acyclic and saturated having one amino group and at least two singly-bound oxygen atoms, with at least one being part of an etherified hydroxy group, bound to the carbon skeleton, e.g. ethers of polyhydroxy amines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/38—Conductors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
Description
2,6−ジアミノ−2,5,6−トリメチルヘプタン−3−オール アミンフラックス剤が以下の手順を使用して製造された。最初に、2,5,6−トリメチル−2,6−ジニトロヘプタン−3−オール中間体が以下の合成方法を使用して製造された。
2,6−ジアミノ−2,6−ジメチル−5−フェニルヘプタン−3−オール アミンフラックス剤が以下の手順を使用して製造された。最初に、2,6−ジメチル−2,6−ジニトロ−5−フェニルヘプタン−3−オール中間体が以下の合成方法を使用して製造された。
下記式
下記式
実施例3〜4に従って製造されたアミンフラックス組成物のフラックス能力が、以下の手順を用いて評価され、ヒドロキシステアリン酸参照材料と比較された。各評価において、はんだ付けされる電気接点として銅クーポンが使用された。この銅クーポンのそれぞれについてはんだ付けされる表面は(1)まず、微細紙やすり(600グリット)で研磨し、(2)次いで、5%過硫酸アンモニウム溶液でクリーニングし、(3)次いで脱イオン水ですすぎ、(4)次いで、30秒間1%ベンゾトリアゾール溶液中に浸漬し、並びに(5)次いで、窒素でブロー乾燥させることによって前処理された。銅クーポンの前処理の後で、それぞれ1種類のアミンフラックス組成物の小滴が個々に、1枚の銅クーポンのはんだ付けされる表面上に分配された。鉛を含まないはんだ(95.5重量%Sn/4.0重量%Ag/0.5重量%Cu)の直径0.381mmのボール4つが、各銅クーポン上のアミンフラックス組成物の液滴中に配置された。使用されたこの鉛を含まないはんだの溶融範囲は217〜221℃である。次いで、この銅クーポンは、145℃に予備加熱されたホットプレート上に置かれ、そこで2分間保持された。次いで、この銅クーポンは260℃に予備加熱された別のホットプレート上に配置され、そこではんだがリフロー条件(存在するアミンフラックス組成物に応じて45秒〜3分)に到達するまで保持した。次いで、この銅クーポンは加熱から取り外され、(a)元々配置された4つのはんだボールの融合および合体の程度、(b)フローおよび広がりを評価するための得られた合体したはんだのサイズ、並びに(c)銅クーポンの表面へのはんだの結合によって評価された。これらアミンフラックス組成物およびヒドロキシステアリン酸参照材料のアミンフラックス能力を説明するために、以下のような0〜4の等級が使用された:
1、2=はんだ滴どうしの部分的〜完全な融合、しかしはんだは銅クーポンと結合せず;
3=はんだ滴どうしの完全な融合、しかし最小限のはんだの広がりおよびフロー;
4=はんだ滴どうしの完全な融合、銅クーポンの表面上での良好なはんだの広がりおよびフロー、並びに銅クーポンへのはんだの結合。
Claims (9)
- 式Iで表されるアミンフラックス剤を含むアミンフラックス組成物:
R7およびR8は独立してC1−20アルキル基、置換C1−20アルキル基、C6−20アリール基および置換C6−20アリール基から選択されるか、またはR7とR8はそれらが結合している炭素と一緒になってC3−20シクロアルキル環を形成するか、もしくはC1−6アルキル基で置換されているC3−20シクロアルキル環を形成し;R10およびR11は独立してC1−20アルキル基、置換C1−20アルキル基、C6−20アリール基および置換C6−20アリール基から選択されるか、またはR10とR11はそれらが結合している炭素と一緒になってC3−20シクロアルキル環を形成するか、もしくはC1−6アルキル基で置換されているC3−20シクロアルキル環を形成し;R7およびR8での前記置換C1−20アルキル基および前記置換C6−20アリール基における置換は、−OH基、−OR12基、−COR 12’ −基、−COR12基、−C(O)R12基、−CHO基、−C(O)OR 12 基、−OC(O)OR12基、−S(O)(O)R12基、−S(O)R12基、−S(O)(O)NR13 2基、−OC(O)NR13 2基、−C(O)NR13 2基、−CN基、−N(R13)−基、および−NO2基の少なくとも1種から選択され;R10およびR11での前記置換C1−20アルキル基および前記置換C6−20アリール基における置換は、−OH基、−OR12基、−COR 12’ −基、−COR12基、−C(O)R12基、−CHO基、−C(O)OR 12 基、−OC(O)OR12基、−S(O)(O)R12基、−S(O)R12基、−S(O)(O)NR12 2基、−OC(O)NR13 2基、−C(O)NR13 2基、−CN基、−N(R13)−基、および−NO2基の少なくとも1種から選択され;R12はC1−19アルキル基、C3−19シクロアルキル基、C6−19アリール基、C7−19アリールアルキル基、およびC7−19アルキルアリール基から選択され;R 12’ はC 1−19 アルキレン基、C 3−19 シクロアルキレン基、C 6−19 アリーレン基、C 7−19 アリールアルキレン基、およびC 7−19 アルキルアリーレン基から選択され;R13は、水素、C1−19アルキル基、C3−19シクロアルキル基、C6−19アリール基、C7−19アリールアルキル基、およびC7−19アルキルアリール基から選択され;並びに、
R9は水素、C1−30アルキル基、置換C1−30アルキル基、C6−30アリール基および置換C6−30アリール基から選択され;R9での前記置換C1−30アルキル基および前記置換C6−30アリール基における置換は、−OH基、−OR14基、−COR 14’ −基、−COR14基、−C(O)R14基、−CHO基、−C(O)OR 14 基、−OC(O)OR14基、−S(O)(O)R14基、−S(O)R14基、−S(O)(O)NR14 2基、−OC(O)NR15 2基、−C(O)NR15 2基、−CN基、−N(R15)−基、および−NO2基の少なくとも1種から選択され;R14はC1−29アルキル基、C3−29シクロアルキル基、C6−29アリール基、C7−29アリールアルキル基、およびC7−29アルキルアリール基から選択され;R 14’ はC 1−29 アルキレン基、C 3−29 シクロアルキレン基、C 6−29 アリーレン基、C 7−29 アリールアルキレン基、およびC 7−29 アルキルアリーレン基から選択され;R15は、水素、C1−29アルキル基、C3−29シクロアルキル基、C6−29アリール基、C7−29アリールアルキル基、およびC7−29アルキルアリール基から選択される)。 - R1、R2、R3およびR4が独立して水素、−CH2CH(OH)R18、および−CH2CH(OH)CH2−O−R18基から選択され;R18が水素、C1−28アルキル基、C3−28シクロアルキル基、C6−28アリール基、C7−28アリールアルキル基、およびC7−28アルキルアリール基から選択され;R7およびR8が両方ともメチル基であり;R10およびR11が両方ともメチル基であり;並びにR9がメチル基およびフェニル基から選択され;R1、R2、R3およびR4の0〜3つが水素である請求項1に記載のアミンフラックス組成物。
- R1、R2、R3およびR4の0〜3つが水素である請求項2に記載のアミンフラックス組成物。
- 溶媒をさらに含み、当該溶媒が炭化水素、芳香族炭化水素、ケトン、エーテル、アルコール、エステル、アミド、グリコール、グリコールエーテル、グリコール誘導体および石油溶媒から選択される有機溶媒である、請求項1に記載のアミンフラックス組成物。
- 無機充填剤、チキソトロープ剤および酸化防止剤の少なくとも1種をさらに含む、請求項1に記載のアミンフラックス組成物。
- 艶消し剤、着色剤、脱泡剤、分散安定化剤、キレート化剤、熱可塑性粒子、UV不透過剤、難燃剤および還元剤から選択される添加剤をさらに含む、請求項1に記載のアミンフラックス組成物。
- 0〜95重量%の溶媒、
0〜30重量%の増粘剤、
0〜30重量%のチキソトロープ剤、および
0〜30重量%の酸化防止剤
をさらに含む、請求項1に記載のアミンフラックス組成物。 - はんだ粉体をさらに含む請求項1に記載のアミンフラックス組成物。
- 電気接点を提供し;
請求項1に記載のアミンフラックス組成物を提供し;
前記アミンフラックス組成物を前記電気接点に適用し;
はんだを提供し;
前記はんだを溶融させ;並びに
前記電気接点に適用された前記アミンフラックス組成物を、溶融したはんだで置き換え、前記溶融したはんだが前記電気接点との物理的接触を形成し、そして前記電気接点に結合する
ことを含む、電気接点にはんだを適用する方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/958,493 | 2010-12-02 | ||
US12/958,493 US8070046B1 (en) | 2010-12-02 | 2010-12-02 | Amine flux composition and method of soldering |
Publications (3)
Publication Number | Publication Date |
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JP2012148337A JP2012148337A (ja) | 2012-08-09 |
JP2012148337A5 JP2012148337A5 (ja) | 2015-01-22 |
JP6012956B2 true JP6012956B2 (ja) | 2016-10-25 |
Family
ID=45034316
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Application Number | Title | Priority Date | Filing Date |
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JP2011260174A Expired - Fee Related JP6012956B2 (ja) | 2010-12-02 | 2011-11-29 | アミンフラックス組成物およびはんだ付け方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US8070046B1 (ja) |
JP (1) | JP6012956B2 (ja) |
KR (1) | KR101885575B1 (ja) |
CN (1) | CN102642101B (ja) |
DE (1) | DE102011120521A1 (ja) |
FR (1) | FR2968229B1 (ja) |
TW (1) | TWI444355B (ja) |
Families Citing this family (4)
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US20120002386A1 (en) * | 2010-07-01 | 2012-01-05 | Nokia Corporation | Method and Apparatus for Improving the Reliability of Solder Joints |
US8070045B1 (en) * | 2010-12-02 | 2011-12-06 | Rohm And Haas Electronic Materials Llc | Curable amine flux composition and method of soldering |
US8430294B2 (en) * | 2011-09-30 | 2013-04-30 | Rohm And Haas Electronic Materials Llc | Amine, carboxylic acid flux composition and method of soldering |
US8430293B2 (en) * | 2011-09-30 | 2013-04-30 | Rohm And Haas Electronic Materials Llc | Curable amine, carboxylic acid flux composition and method of soldering |
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FR2968229B1 (fr) | 2014-05-02 |
CN102642101A (zh) | 2012-08-22 |
CN102642101B (zh) | 2015-05-13 |
FR2968229A1 (fr) | 2012-06-08 |
KR20120060773A (ko) | 2012-06-12 |
TW201229008A (en) | 2012-07-16 |
US8070046B1 (en) | 2011-12-06 |
DE102011120521A1 (de) | 2012-06-06 |
JP2012148337A (ja) | 2012-08-09 |
KR101885575B1 (ko) | 2018-08-06 |
TWI444355B (zh) | 2014-07-11 |
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