JP6038517B2 - 配線基板及びその製造方法 - Google Patents

配線基板及びその製造方法 Download PDF

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Publication number
JP6038517B2
JP6038517B2 JP2012157907A JP2012157907A JP6038517B2 JP 6038517 B2 JP6038517 B2 JP 6038517B2 JP 2012157907 A JP2012157907 A JP 2012157907A JP 2012157907 A JP2012157907 A JP 2012157907A JP 6038517 B2 JP6038517 B2 JP 6038517B2
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JP
Japan
Prior art keywords
resin
substrate
wiring board
core
wiring
Prior art date
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Active
Application number
JP2012157907A
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English (en)
Japanese (ja)
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JP2014022465A5 (enExample
JP2014022465A (ja
Inventor
小泉　直幸
直幸 小泉
潤 古市
古市　　潤
堀川　泰愛
泰愛 堀川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2012157907A priority Critical patent/JP6038517B2/ja
Priority to US13/939,442 priority patent/US9159648B2/en
Publication of JP2014022465A publication Critical patent/JP2014022465A/ja
Publication of JP2014022465A5 publication Critical patent/JP2014022465A5/ja
Application granted granted Critical
Publication of JP6038517B2 publication Critical patent/JP6038517B2/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H05K3/4605—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated made from inorganic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Ceramic Engineering (AREA)
JP2012157907A 2012-07-13 2012-07-13 配線基板及びその製造方法 Active JP6038517B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2012157907A JP6038517B2 (ja) 2012-07-13 2012-07-13 配線基板及びその製造方法
US13/939,442 US9159648B2 (en) 2012-07-13 2013-07-11 Wiring substrate and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012157907A JP6038517B2 (ja) 2012-07-13 2012-07-13 配線基板及びその製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2016102163A Division JP6148764B2 (ja) 2016-05-23 2016-05-23 配線基板及びその製造方法

Publications (3)

Publication Number Publication Date
JP2014022465A JP2014022465A (ja) 2014-02-03
JP2014022465A5 JP2014022465A5 (enExample) 2015-08-06
JP6038517B2 true JP6038517B2 (ja) 2016-12-07

Family

ID=49913297

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012157907A Active JP6038517B2 (ja) 2012-07-13 2012-07-13 配線基板及びその製造方法

Country Status (2)

Country Link
US (1) US9159648B2 (enExample)
JP (1) JP6038517B2 (enExample)

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US10971476B2 (en) 2014-02-18 2021-04-06 Qualcomm Incorporated Bottom package with metal post interconnections
KR101580287B1 (ko) * 2014-05-02 2015-12-24 삼성전기주식회사 인쇄회로기판, 인쇄회로기판 스트립 및 그 제조방법
KR102281459B1 (ko) * 2014-11-05 2021-07-27 삼성전기주식회사 인쇄회로기판 및 그 제조방법
KR101629435B1 (ko) * 2014-11-10 2016-06-10 삼성전기주식회사 인쇄회로기판 및 그 제조방법
JP2016219452A (ja) * 2015-05-14 2016-12-22 富士通株式会社 多層基板及び多層基板の製造方法
KR20170004260A (ko) 2015-07-01 2017-01-11 삼성전기주식회사 인쇄회로기판 및 그 제조방법
JP2017073424A (ja) * 2015-10-05 2017-04-13 日本特殊陶業株式会社 配線基板及びその製造方法
JP2017073425A (ja) * 2015-10-05 2017-04-13 日本特殊陶業株式会社 配線基板及びその製造方法
JP6449478B2 (ja) * 2015-10-21 2019-01-09 シャープ株式会社 ガラス配線基板およびパワーモジュール
JP6840935B2 (ja) * 2016-05-10 2021-03-10 凸版印刷株式会社 配線回路基板の製造方法
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JP2017220647A (ja) * 2016-06-10 2017-12-14 凸版印刷株式会社 パッケージ用基板
US10794679B2 (en) 2016-06-29 2020-10-06 Corning Incorporated Method and system for measuring geometric parameters of through holes
JP6341245B2 (ja) * 2016-09-05 2018-06-13 大日本印刷株式会社 貫通電極基板の製造方法、貫通電極基板および半導体装置
JP6816486B2 (ja) * 2016-12-07 2021-01-20 凸版印刷株式会社 コア基板、多層配線基板、半導体パッケージ、半導体モジュール、銅張基板、及びコア基板の製造方法
JP6852404B2 (ja) * 2017-01-06 2021-03-31 大日本印刷株式会社 インターポーザー及びその製造方法、並びに、インターポーザーを備える半導体装置
US10580725B2 (en) 2017-05-25 2020-03-03 Corning Incorporated Articles having vias with geometry attributes and methods for fabricating the same
US11078112B2 (en) * 2017-05-25 2021-08-03 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
US12180108B2 (en) 2017-12-19 2024-12-31 Corning Incorporated Methods for etching vias in glass-based articles employing positive charge organic molecules
JP7106875B2 (ja) 2018-01-30 2022-07-27 凸版印刷株式会社 ガラスコアデバイスの製造方法
US11554984B2 (en) 2018-02-22 2023-01-17 Corning Incorporated Alkali-free borosilicate glasses with low post-HF etch roughness
US10470300B1 (en) * 2018-07-24 2019-11-05 AGC Inc. Glass panel for wiring board and method of manufacturing wiring board
TWI771610B (zh) * 2019-09-02 2022-07-21 矽品精密工業股份有限公司 電子封裝件及其承載結構與製法
US12261124B2 (en) 2019-12-23 2025-03-25 Intel Corporation Embedded die architecture and method of making
JP2021108317A (ja) * 2019-12-27 2021-07-29 イビデン株式会社 プリント配線板およびその製造方法
JP7453509B2 (ja) * 2020-01-15 2024-03-21 イビデン株式会社 プリント配線板及びプリント配線板の製造方法
US11901248B2 (en) * 2020-03-27 2024-02-13 Intel Corporation Embedded die architecture and method of making
CN115315803A (zh) * 2020-03-31 2022-11-08 索尼半导体解决方案公司 半导体装置
WO2021200406A1 (ja) * 2020-03-31 2021-10-07 ソニーセミコンダクタソリューションズ株式会社 半導体装置
US20220392832A1 (en) * 2021-06-06 2022-12-08 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor structures and methods of forming the same
US20230092740A1 (en) * 2021-09-21 2023-03-23 Intel Corporation Moat protection to prevent crack propagation in glass core substrates or glass interposers
JP7782220B2 (ja) * 2021-11-18 2025-12-09 Ｔｏｐｐａｎホールディングス株式会社 多層配線基板および多層配線基板の製造方法
TWI806490B (zh) 2022-03-14 2023-06-21 巨擘科技股份有限公司 封裝基板結構
CN119547574A (zh) * 2022-07-01 2025-02-28 凸版控股株式会社 玻璃芯层叠结构体以及玻璃芯层叠结构体的制造方法
KR20240071319A (ko) * 2022-11-15 2024-05-22 앱솔릭스 인코포레이티드 기판 및 반도체 모듈
US20250112136A1 (en) * 2023-09-29 2025-04-03 Intel Corporation Glass core protection using peripheral buffer layers
JP2025088548A (ja) * 2023-11-30 2025-06-11 Ｒａｐｉｄｕｓ株式会社 電子装置
JP2025088549A (ja) * 2023-11-30 2025-06-11 Ｒａｐｉｄｕｓ株式会社 電子装置
WO2025142479A1 (ja) * 2023-12-28 2025-07-03 Ｔｏｐｐａｎホールディングス株式会社 多層配線母材基板、多層配線基板および多層配線基板の製造方法
WO2025142478A1 (ja) * 2023-12-28 2025-07-03 Ｔｏｐｐａｎホールディングス株式会社 多層配線基板、多層配線基板の製造方法および多層配線母材基板
US20260005081A1 (en) * 2024-06-28 2026-01-01 Intel Corporation Hybrid glass and organic substrates

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JP2000124603A (ja) * 1999-08-05 2000-04-28 Ibiden Co Ltd プリント配線板
JP3489113B2 (ja) * 1999-12-20 2004-01-19 関西日本電気株式会社 半導体装置
JP5191074B2 (ja) * 2001-07-10 2013-04-24 イビデン株式会社 多層プリント配線板
JP3926736B2 (ja) * 2002-12-09 2007-06-06 新光電気工業株式会社 配線基板及びその製造方法並びに半導体装置
JP2004288660A (ja) * 2003-01-29 2004-10-14 Kyocera Corp 配線基板
JP2005086071A (ja) 2003-09-10 2005-03-31 Hitachi Chem Co Ltd 多層配線基板、半導体チップ搭載基板及び半導体パッケージ、並びにそれらの製造方法
JP2009099661A (ja) * 2007-10-15 2009-05-07 Shinko Electric Ind Co Ltd 配線基板の個片化方法およびパッケージ用基板
JP5297139B2 (ja) * 2008-10-09 2013-09-25 新光電気工業株式会社 配線基板及びその製造方法
JP5193809B2 (ja) * 2008-11-05 2013-05-08 新光電気工業株式会社 配線基板及びその製造方法
JP2011029488A (ja) * 2009-07-28 2011-02-10 Kyocera Corp 配線基板
JP2011165741A (ja) * 2010-02-05 2011-08-25 Renesas Electronics Corp 半導体装置およびその製造方法

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US9159648B2 (en) 2015-10-13
JP2014022465A (ja) 2014-02-03
US20140015121A1 (en) 2014-01-16

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