JP5985201B2 - 発光装置および照明装置 - Google Patents

発光装置および照明装置 Download PDF

Info

Publication number
JP5985201B2
JP5985201B2 JP2012034517A JP2012034517A JP5985201B2 JP 5985201 B2 JP5985201 B2 JP 5985201B2 JP 2012034517 A JP2012034517 A JP 2012034517A JP 2012034517 A JP2012034517 A JP 2012034517A JP 5985201 B2 JP5985201 B2 JP 5985201B2
Authority
JP
Japan
Prior art keywords
layer
electrode
light emitting
emitting device
insulating substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2012034517A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013171952A5 (enExample
JP2013171952A (ja
Inventor
英賀谷　誠
誠 英賀谷
松田　誠
誠 松田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP2012034517A priority Critical patent/JP5985201B2/ja
Priority to PCT/JP2013/054045 priority patent/WO2013125539A1/ja
Priority to US14/376,578 priority patent/US9577153B2/en
Priority to CN201380007510.5A priority patent/CN104081548B/zh
Priority to EP13751422.0A priority patent/EP2819191A4/en
Publication of JP2013171952A publication Critical patent/JP2013171952A/ja
Publication of JP2013171952A5 publication Critical patent/JP2013171952A5/ja
Application granted granted Critical
Publication of JP5985201B2 publication Critical patent/JP5985201B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/83—Electrodes
    • H10H20/832—Electrodes characterised by their material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/032—Manufacture or treatment of electrodes

Landscapes

  • Led Device Packages (AREA)
  • Led Devices (AREA)
JP2012034517A 2012-02-20 2012-02-20 発光装置および照明装置 Expired - Fee Related JP5985201B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2012034517A JP5985201B2 (ja) 2012-02-20 2012-02-20 発光装置および照明装置
PCT/JP2013/054045 WO2013125539A1 (ja) 2012-02-20 2013-02-19 発光装置および照明装置
US14/376,578 US9577153B2 (en) 2012-02-20 2013-02-19 Light emission device and illumination device
CN201380007510.5A CN104081548B (zh) 2012-02-20 2013-02-19 发光装置以及照明装置
EP13751422.0A EP2819191A4 (en) 2012-02-20 2013-02-19 LIGHT EMISSIONING DEVICE AND LIGHTING DEVICE

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012034517A JP5985201B2 (ja) 2012-02-20 2012-02-20 発光装置および照明装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2015246758A Division JP6411320B2 (ja) 2015-12-17 2015-12-17 発光装置および照明装置

Publications (3)

Publication Number Publication Date
JP2013171952A JP2013171952A (ja) 2013-09-02
JP2013171952A5 JP2013171952A5 (enExample) 2014-10-16
JP5985201B2 true JP5985201B2 (ja) 2016-09-06

Family

ID=49005724

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012034517A Expired - Fee Related JP5985201B2 (ja) 2012-02-20 2012-02-20 発光装置および照明装置

Country Status (5)

Country Link
US (1) US9577153B2 (enExample)
EP (1) EP2819191A4 (enExample)
JP (1) JP5985201B2 (enExample)
CN (1) CN104081548B (enExample)
WO (1) WO2013125539A1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD791089S1 (en) * 2015-10-23 2017-07-04 Citizen Electronics Co., Ltd. Light-emitting diode
JP6520663B2 (ja) * 2015-11-27 2019-05-29 日亜化学工業株式会社 素子載置用基板及び発光装置
EP3491679B1 (en) 2016-07-26 2023-02-22 CreeLED, Inc. Light emitting diodes, components and related methods
US11024785B2 (en) * 2018-05-25 2021-06-01 Creeled, Inc. Light-emitting diode packages
USD902448S1 (en) 2018-08-31 2020-11-17 Cree, Inc. Light emitting diode package
US11335833B2 (en) 2018-08-31 2022-05-17 Creeled, Inc. Light-emitting diodes, light-emitting diode arrays and related devices
US11233183B2 (en) 2018-08-31 2022-01-25 Creeled, Inc. Light-emitting diodes, light-emitting diode arrays and related devices
US11101411B2 (en) 2019-06-26 2021-08-24 Creeled, Inc. Solid-state light emitting devices including light emitting diodes in package structures

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0419571Y2 (enExample) * 1986-04-02 1992-05-01
JPH05243420A (ja) * 1992-02-28 1993-09-21 Nippondenso Co Ltd 厚膜回路基板およびこれを用いた半導体装置
JPH05243240A (ja) 1992-02-28 1993-09-21 Nec Corp 熱処理装置
JP2797951B2 (ja) 1994-02-22 1998-09-17 住友金属工業株式会社 銀−パラジウム合金めっき方法およびめっき浴
JP3164276B2 (ja) 1995-08-02 2001-05-08 スズキ株式会社 スキーキャリア取付構造
JP2004047247A (ja) * 2002-07-11 2004-02-12 Canon Inc 電極構造、加熱体、加熱装置、及び画像形成装置
JP2004183077A (ja) * 2002-12-05 2004-07-02 Matsushita Electric Ind Co Ltd 電気摺動接点材料およびそれを有する小型直流モータ
JP2007188971A (ja) * 2006-01-11 2007-07-26 Taiyosha Electric Co Ltd ジャンパーチップ部品
JP4873963B2 (ja) 2006-02-27 2012-02-08 京セラ株式会社 発光装置およびそれを用いた照明装置
JP5233087B2 (ja) 2006-06-28 2013-07-10 日亜化学工業株式会社 発光装置およびその製造方法、パッケージ、発光素子実装用の基板
JP5084324B2 (ja) 2007-03-29 2012-11-28 シャープ株式会社 発光装置および照明装置
JP4758976B2 (ja) * 2007-12-03 2011-08-31 日立ケーブルプレシジョン株式会社 半導体発光素子搭載用リードフレーム及びその製造方法並びに発光装置
JP5289835B2 (ja) * 2008-06-25 2013-09-11 シャープ株式会社 発光装置およびその製造方法
CN102257647B (zh) 2008-12-19 2014-07-23 古河电气工业株式会社 光半导体装置用引线框及其制造方法
KR101586523B1 (ko) * 2008-12-26 2016-01-18 후루카와 덴키 고교 가부시키가이샤 광반도체 장치용 리드 프레임, 그 제조방법 및 광반도체 장치
JP5623062B2 (ja) 2009-11-13 2014-11-12 シャープ株式会社 発光装置およびその製造方法
JP2011151268A (ja) 2010-01-22 2011-08-04 Sharp Corp 発光装置
US9263315B2 (en) * 2010-03-30 2016-02-16 Dai Nippon Printing Co., Ltd. LED leadframe or LED substrate, semiconductor device, and method for manufacturing LED leadframe or LED substrate
JP5481277B2 (ja) * 2010-06-04 2014-04-23 シャープ株式会社 発光装置
JP5442534B2 (ja) 2010-06-04 2014-03-12 シャープ株式会社 発光装置
JP2012023078A (ja) 2010-07-12 2012-02-02 Toshiba Lighting & Technology Corp 発光装置および照明装置
JP2012028130A (ja) 2010-07-22 2012-02-09 Hirose Electric Co Ltd 照明装置用コネクタ
JP3164276U (ja) 2010-09-10 2010-11-18 日亜化学工業株式会社 半導体発光装置
CN107087343B (zh) * 2011-05-27 2019-04-19 夏普株式会社 发光装置以及照明装置
JP5730711B2 (ja) 2011-08-25 2015-06-10 シャープ株式会社 発光装置

Also Published As

Publication number Publication date
US9577153B2 (en) 2017-02-21
CN104081548B (zh) 2017-08-29
EP2819191A4 (en) 2015-10-21
US20150048409A1 (en) 2015-02-19
JP2013171952A (ja) 2013-09-02
WO2013125539A1 (ja) 2013-08-29
EP2819191A1 (en) 2014-12-31
CN104081548A (zh) 2014-10-01

Similar Documents

Publication Publication Date Title
JP5985201B2 (ja) 発光装置および照明装置
JP4932064B2 (ja) 発光モジュール、光源装置、液晶表示装置および発光モジュールの製造方法
JP4928046B2 (ja) 光電素子
JP2011146353A (ja) 照明装置
JP2015111620A (ja) 発光デバイス及びその製造方法
JPWO2012081258A1 (ja) 照明光源及び照明装置
CN101176216B (zh) 发光元件安装用珐琅基板、发光元件模块、照明装置、显示装置及交通信号机
CN100583472C (zh) 发光元件安装用基板、发光模块及照明装置
JP2013171952A5 (enExample)
JP2011134912A (ja) 照明装置
JP6104946B2 (ja) 発光装置およびその製造方法
JP6411320B2 (ja) 発光装置および照明装置
KR101363980B1 (ko) 광 모듈 및 그 제조 방법
JP3884057B2 (ja) 発光素子実装用基板、発光モジュール及び照明装置
CN108011005B (zh) 半导体发光器件及其制造方法
CN106465537B (zh) 印刷电路板和包括该印刷电路板的光发射器件
JP2012156476A (ja) 光源モジュール及びその製造方法
JP2018507566A (ja) リードフレーム及びこれを含む半導体パッケージ
JP2009289441A (ja) Ｌｅｄランプおよびその製造方法
CN110881243A (zh) 一种带倒装芯片的线路板结构
CN101752471A (zh) 光电元件
CN110649141A (zh) 一种led封装结构
CN210778590U (zh) 一种无极性插脚式led灯珠
CN107146837B (zh) 一种双面侧发光的led光源单元及其制造方法
JP2013149636A (ja) Ｌｅｄ実装基板およびその製造方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20140901

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20140901

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20150616

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20150729

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20151013

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20151217

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20151228

A912 Re-examination (zenchi) completed and case transferred to appeal board

Free format text: JAPANESE INTERMEDIATE CODE: A912

Effective date: 20160226

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20160803

R150 Certificate of patent or registration of utility model

Ref document number: 5985201

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

LAPS Cancellation because of no payment of annual fees