JP2011134912A - 照明装置 - Google Patents
照明装置 Download PDFInfo
- Publication number
- JP2011134912A JP2011134912A JP2009293411A JP2009293411A JP2011134912A JP 2011134912 A JP2011134912 A JP 2011134912A JP 2009293411 A JP2009293411 A JP 2009293411A JP 2009293411 A JP2009293411 A JP 2009293411A JP 2011134912 A JP2011134912 A JP 2011134912A
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- heat dissipation
- power supply
- emitting elements
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Led Devices (AREA)
- Circuit Arrangement For Electric Light Sources In General (AREA)
Abstract
【解決手段】本発明は、接地電位にある導電性を有する装置本体8と、装置本体8に配設され、絶縁層22とこの絶縁層22に積層された熱伝導性を有しかつ電気的に非導通の放熱層23とが設けられた基板2と、前記放熱層23に実装された複数の発光素子3と、各発光素子3を電気的に接続する給電用配線手段4とを備えた発光装置1と、交流電源に接続され前記発光装置1に電力を供給する点灯装置7とを備える照明装置である。
【選択図】図3
Description
給電用配線手段とは、各発光素子を電気的に接続するボンディングワイヤや配線パターン等の導体を意味する。
照明装置には、屋内又は屋外で使用される照明器具、ディスプレイ装置等が含まれる。
接続導体は、少なくとも放熱層の面積より小さく、ボンディングワイヤを接続するための最小限の面積で形成することが好ましい。
正極側給電導体24及び負極側給電導体25は、電気的に接続され導通される層であり、これに対し、放熱層23は、電気的に接続されない非導通の層である。
発光素子3の具体的な接続関係は、以下に説明するとおりである。
したがって、発光装置1を複数接続して照明装置を構成する場合には、各発光装置を並列に接続することが誤点灯を抑制するためには有効となる。
4・・・給電用配線手段、6・・・封止部材、7・・・点灯装置、
8・・・本体、22・・・絶縁層、23・・・放熱層、
32・・・発光素子のプラス側電極、33・・・発光素子のマイナス側電極、
41・・・ボンディングワイヤ、42・・・接続導体
Claims (3)
- 接地電位にある導電性を有する装置本体と;
装置本体に配設され、絶縁層とこの絶縁層に積層された熱伝導性を有しかつ電気的に非導通の放熱層とが設けられた基板と、前記放熱層に実装された複数の発光素子と、各発光素子を電気的に接続する給電用配線手段とを備えた発光装置と;
交流電源に接続され前記発光装置に電力を供給する点灯装置と;
を具備することを特徴とする照明装置。 - 前記各発光素子を電気的に接続する給電用配線手段は、隣接する発光素子の電極同士を相互に接続するボンディングワイヤであることを特徴とする請求項1に記載の照明装置。
- 前記各発光素子を電気的に接続する給電用配線手段は、隣接する発光素子間に形成された少なくとも放熱層の面積より小さい接続導体と、この接続導体を介して隣接する発光素子の電極同士を相互に接続するボンディングワイヤとから構成されていることを特徴とする請求項1に記載の照明装置。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009293411A JP5655302B2 (ja) | 2009-12-24 | 2009-12-24 | 照明装置 |
EP10195070A EP2341536A3 (en) | 2009-12-24 | 2010-12-15 | Lighting apparatus |
BRPI1005339-5A BRPI1005339A2 (pt) | 2009-12-24 | 2010-12-16 | aparelho de iluminaÇço |
US12/973,992 US20110156613A1 (en) | 2009-12-24 | 2010-12-21 | Lighting apparatus |
RU2010152844/28A RU2456704C1 (ru) | 2009-12-24 | 2010-12-23 | Устройство освещения |
CN201010608493.9A CN102109126B (zh) | 2009-12-24 | 2010-12-23 | 照明装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009293411A JP5655302B2 (ja) | 2009-12-24 | 2009-12-24 | 照明装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011134912A true JP2011134912A (ja) | 2011-07-07 |
JP5655302B2 JP5655302B2 (ja) | 2015-01-21 |
Family
ID=43859689
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009293411A Expired - Fee Related JP5655302B2 (ja) | 2009-12-24 | 2009-12-24 | 照明装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20110156613A1 (ja) |
EP (1) | EP2341536A3 (ja) |
JP (1) | JP5655302B2 (ja) |
CN (1) | CN102109126B (ja) |
BR (1) | BRPI1005339A2 (ja) |
RU (1) | RU2456704C1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016104970A1 (ko) * | 2014-12-23 | 2016-06-30 | 서울반도체 주식회사 | 발광 장치 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013201256A (ja) * | 2012-03-23 | 2013-10-03 | Toshiba Lighting & Technology Corp | 配線基板装置、発光モジュール、照明装置および配線基板装置の製造方法 |
CN102691935A (zh) * | 2012-05-22 | 2012-09-26 | 深圳市华星光电技术有限公司 | 背光系统、背光系统的制造方法及平板显示装置 |
CN103175013A (zh) * | 2013-03-05 | 2013-06-26 | 福建省锐驰电子科技有限公司 | 一种散热型led灯条 |
DE102013218541A1 (de) | 2013-09-16 | 2015-03-19 | Osram Gmbh | Leuchtmodul mit Halbleiterlichtquellen und Trägerplatte |
WO2015192425A1 (zh) * | 2014-06-18 | 2015-12-23 | 黄欣 | 双面散热的发光二极管(led)显示屏的电路板 |
KR102305233B1 (ko) * | 2014-11-24 | 2021-09-27 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | 발광 모듈 및 이를 포함하는 조명 장치 |
JP6782539B2 (ja) * | 2015-11-24 | 2020-11-11 | スタンレー電気株式会社 | 発光装置 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008130438A (ja) * | 2006-11-22 | 2008-06-05 | Matsushita Electric Works Ltd | 電源別置型のled点灯装置 |
JP2009164157A (ja) * | 2007-12-28 | 2009-07-23 | Nichia Corp | 発光装置 |
WO2009104645A1 (ja) * | 2008-02-18 | 2009-08-27 | 東芝ライテック株式会社 | 照明装置 |
JP2009206383A (ja) * | 2008-02-29 | 2009-09-10 | Sharp Corp | Ledモジュール及びそれを備えるled点灯装置 |
JP2009212126A (ja) * | 2008-02-29 | 2009-09-17 | Toshiba Lighting & Technology Corp | 照明装置 |
JP2009218371A (ja) * | 2008-03-10 | 2009-09-24 | Toshiba Lighting & Technology Corp | 照明装置 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
RU2142146C1 (ru) * | 1997-08-26 | 1999-11-27 | Всероссийский научный центр "Государственный оптический институт им.С.И.Вавилова" | Способ регистрации воздушного радиоактивного выброса по оптической флюоресценции |
DE10051159C2 (de) * | 2000-10-16 | 2002-09-19 | Osram Opto Semiconductors Gmbh | LED-Modul, z.B. Weißlichtquelle |
RU2200358C1 (ru) * | 2001-06-05 | 2003-03-10 | Хан Владимир Александрович | Полупроводниковый излучающий диод |
CN100504146C (zh) * | 2001-08-09 | 2009-06-24 | 松下电器产业株式会社 | Led照明装置和led照明光源 |
RU2303833C2 (ru) * | 2005-07-26 | 2007-07-27 | Самсунг Электро-Меканикс Ко., Лтд. | Осветительное устройство |
TWI344708B (en) * | 2007-04-30 | 2011-07-01 | Jin Chyuan Biar | Package structure of lighting element and lighting device thereof |
JP2009054989A (ja) * | 2007-07-31 | 2009-03-12 | Sharp Corp | 発光装置、照明装置及び当該照明装置を備えたクリーンルーム |
WO2009029804A2 (en) * | 2007-08-31 | 2009-03-05 | Reactive Nanotechnologies, Inc. | Method for low temperature bonding of electronic components |
CN201242052Y (zh) * | 2007-10-31 | 2009-05-20 | 泰硕电子股份有限公司 | Led与导热装置的组合构件 |
JP5345363B2 (ja) * | 2008-06-24 | 2013-11-20 | シャープ株式会社 | 発光装置 |
US8567988B2 (en) * | 2008-09-29 | 2013-10-29 | Bridgelux, Inc. | Efficient LED array |
-
2009
- 2009-12-24 JP JP2009293411A patent/JP5655302B2/ja not_active Expired - Fee Related
-
2010
- 2010-12-15 EP EP10195070A patent/EP2341536A3/en not_active Withdrawn
- 2010-12-16 BR BRPI1005339-5A patent/BRPI1005339A2/pt not_active IP Right Cessation
- 2010-12-21 US US12/973,992 patent/US20110156613A1/en not_active Abandoned
- 2010-12-23 RU RU2010152844/28A patent/RU2456704C1/ru not_active IP Right Cessation
- 2010-12-23 CN CN201010608493.9A patent/CN102109126B/zh not_active Expired - Fee Related
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008130438A (ja) * | 2006-11-22 | 2008-06-05 | Matsushita Electric Works Ltd | 電源別置型のled点灯装置 |
JP2009164157A (ja) * | 2007-12-28 | 2009-07-23 | Nichia Corp | 発光装置 |
WO2009104645A1 (ja) * | 2008-02-18 | 2009-08-27 | 東芝ライテック株式会社 | 照明装置 |
JP2009206383A (ja) * | 2008-02-29 | 2009-09-10 | Sharp Corp | Ledモジュール及びそれを備えるled点灯装置 |
JP2009212126A (ja) * | 2008-02-29 | 2009-09-17 | Toshiba Lighting & Technology Corp | 照明装置 |
JP2009218371A (ja) * | 2008-03-10 | 2009-09-24 | Toshiba Lighting & Technology Corp | 照明装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016104970A1 (ko) * | 2014-12-23 | 2016-06-30 | 서울반도체 주식회사 | 발광 장치 |
Also Published As
Publication number | Publication date |
---|---|
EP2341536A3 (en) | 2012-08-22 |
RU2456704C1 (ru) | 2012-07-20 |
US20110156613A1 (en) | 2011-06-30 |
BRPI1005339A2 (pt) | 2013-04-02 |
CN102109126A (zh) | 2011-06-29 |
EP2341536A2 (en) | 2011-07-06 |
CN102109126B (zh) | 2014-03-12 |
JP5655302B2 (ja) | 2015-01-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5655302B2 (ja) | 照明装置 | |
JP2011146353A (ja) | 照明装置 | |
US8390021B2 (en) | Semiconductor light-emitting device, light-emitting module, and illumination device | |
JP5788149B2 (ja) | 発光装置及び照明装置 | |
JP2011243935A (ja) | 発光装置及び照明装置 | |
JP2012004391A (ja) | 発光装置及び照明装置 | |
JP2011192703A (ja) | 発光装置及び照明装置 | |
JP5516956B2 (ja) | 発光装置及び照明装置 | |
EP2434201A2 (en) | Light-emitting device and lighting apparatus | |
JP2009158872A (ja) | 照明装置 | |
WO2012057163A1 (ja) | 発光装置及び照明装置 | |
JP2011192704A (ja) | 発光装置及び照明装置 | |
JP2012094661A (ja) | 発光装置及び照明装置 | |
JP5656051B2 (ja) | 発光装置及び照明装置 | |
TWI581399B (zh) | 發光二極體 | |
JP2011096876A (ja) | 発光装置及び照明装置 | |
JP2012015226A (ja) | 発光装置及び照明装置 | |
JP2011166036A (ja) | 発光装置及び照明装置 | |
TWI420713B (zh) | 發光二極體封裝結構及其製造方法 | |
JP2012134306A (ja) | 発光装置及びそれを用いた照明装置 | |
JP2010287749A (ja) | 発光体および照明器具 | |
JP2018530152A (ja) | 電子回路を備えるled光源 | |
KR101205528B1 (ko) | 다수의 셀이 결합된 발광 소자 및 이의 제조 방법 | |
JP2011090972A (ja) | 発光装置及び照明装置 | |
JP2012009631A (ja) | 発光装置及び照明装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20120920 |
|
RD03 | Notification of appointment of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7423 Effective date: 20121106 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20130513 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20130528 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130729 |
|
RD03 | Notification of appointment of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7423 Effective date: 20130809 |
|
RD07 | Notification of extinguishment of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7427 Effective date: 20140205 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20140331 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20140527 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20141028 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20141110 |
|
LAPS | Cancellation because of no payment of annual fees |