JP6782539B2 - 発光装置 - Google Patents
発光装置 Download PDFInfo
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- JP6782539B2 JP6782539B2 JP2015229112A JP2015229112A JP6782539B2 JP 6782539 B2 JP6782539 B2 JP 6782539B2 JP 2015229112 A JP2015229112 A JP 2015229112A JP 2015229112 A JP2015229112 A JP 2015229112A JP 6782539 B2 JP6782539 B2 JP 6782539B2
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- light emitting
- emitting device
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- emitting elements
- semiconductor light
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- 239000000758 substrate Substances 0.000 claims description 47
- 239000004065 semiconductor Substances 0.000 claims description 41
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 22
- 239000010408 film Substances 0.000 claims description 5
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- 239000011229 interlayer Substances 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 239000004020 conductor Substances 0.000 description 6
- 230000002950 deficient Effects 0.000 description 5
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- 229910052737 gold Inorganic materials 0.000 description 5
- 238000010030 laminating Methods 0.000 description 5
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- 229910052697 platinum Inorganic materials 0.000 description 5
- 229910052719 titanium Inorganic materials 0.000 description 5
- 238000000149 argon plasma sintering Methods 0.000 description 4
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- 230000003287 optical effect Effects 0.000 description 4
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- 229910004298 SiO 2 Inorganic materials 0.000 description 3
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- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 238000009751 slip forming Methods 0.000 description 2
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- 229910003564 SiAlON Inorganic materials 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- FNCIDSNKNZQJTJ-UHFFFAOYSA-N alumane;terbium Chemical class [AlH3].[Tb] FNCIDSNKNZQJTJ-UHFFFAOYSA-N 0.000 description 1
- JNDMLEXHDPKVFC-UHFFFAOYSA-N aluminum;oxygen(2-);yttrium(3+) Chemical class [O-2].[O-2].[O-2].[Al+3].[Y+3] JNDMLEXHDPKVFC-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
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- 239000002223 garnet Substances 0.000 description 1
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- 238000000227 grinding Methods 0.000 description 1
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- 238000010438 heat treatment Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
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- 229910019655 synthetic inorganic crystalline material Inorganic materials 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
- XLOMVQKBTHCTTD-UHFFFAOYSA-N zinc oxide Inorganic materials [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Led Device Packages (AREA)
Description
[変形例1]
以下に、発光装置10の発光素子19への給電を、下面電極23を用いずに行う例について説明する。図4Aは、変形例1の発光装置10の発光ユニット15Aの上面図である。図4Bは、図4Aの4B−4B線に沿った断面図である。
[変形例2]
以下に、上記実施例とは支持体17の形状が異なる例について説明する。図5は、変形例2の発光装置10の断面図である。図5に示すように、支持体17は、各側面において底面17Bから切り込まれている切り欠き凹部Cを有しており、支持体17の頂面17Aよりも底面17Bの方が狭くなっている。すなわち、支持体17は、頂部において頂面17Aと平行な方向かつ外方に向かって突出している庇形状の突出部Pを有している。
[発光素子の配置例]
上記実施例においては、1つの発光ユニット15において、支持体17上に同一サイズの発光素子19を2列に5個ずつ配置する場合を例に図示及び説明をした。しかし、発光素子19の他の配列も可能である。例えば、発光素子19を発光ユニット15の配列方向と垂直な方向に1列または3列以上に配列してもよい。また、発光素子19の各々のサイズは異なっていてもよい。例えば、発光ユニット15の配列方向に垂直な方向において、発光素子19の素子長を互いに異ならしめてもよい。
11 実装基板
13 基板接合層
15、15A 発光ユニット
17 支持体
19、19S 発光素子
21 蛍光体層
23 下面電極
25 上面絶縁層
27 個別配線
29 層間絶縁層
31 共通配線
33 貫通配線
35 個別電極
37 半導体構造層
39 pコンタクト電極
41 絶縁層
43 nコンタクト電極
45 p電極
47 n電極
50 照明ユニット
51 金属基板
53 レンズ
C 切り欠き凹部
P 突出部
Claims (6)
- 実装基板と、
前記実装基板上に1の配列方向に沿って配列された複数の支持体と、
前記複数の支持体の各々の上面に貼り合わせられたシンフィルムLED構造を有する複数の半導体発光素子と、を含み、
前記複数の半導体発光素子は、前記複数の支持体の各々の上において前記1の配列方向及び前記1の配列方向に垂直な方向に沿って複数配列されており、
前記支持体上における前記複数の半導体発光素子の各々の配置間隔は、前記1の配列方向における間隔が前記1の配列方向に垂直な方向における間隔よりも広くなっており、
前記複数の半導体発光素子は、前記1の配列方向に垂直な方向において異なる素子長を有していることを特徴とする発光装置。 - 1つの前記支持体上で隣接する半導体発光素子は、隣接する前記支持体間で隣接する半導体発光素子間の間隔と略等しい間隔で前記1の配列方向に沿って配されていることを特徴とする請求項1に記載の発光装置。
- 前記複数の半導体発光素子は、前記1の配列方向に垂直な方向において、前記垂直な方向における素子長が最も小なる半導体発光素子から離れるに従って、前記垂直な方向における素子長が単調に増加することを特徴とする請求項2に記載の発光装置。
- 1つの前記支持体上の前記複数の半導体発光素子は、電気的に互いに並列に接続されていることを特徴とする請求項1乃至3のいずれか1に記載の発光装置。
- 前記複数の半導体発光素子は、その膜厚が10μm以下であることを特徴とする請求項1乃至4のいずれか1に記載の発光装置。
- 前記複数の半導体発光素子の上に、少なくとも1つの前記支持体上の全ての前記複数の半導体発光素子に亘って連続的に形成されている蛍光体層を有することを特徴とする請求項1乃至5のいずれか1に記載の発光装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015229112A JP6782539B2 (ja) | 2015-11-24 | 2015-11-24 | 発光装置 |
EP16200117.6A EP3174095B1 (en) | 2015-11-24 | 2016-11-22 | Light emitting apparatus |
Applications Claiming Priority (1)
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---|---|---|---|
JP2015229112A JP6782539B2 (ja) | 2015-11-24 | 2015-11-24 | 発光装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017098410A JP2017098410A (ja) | 2017-06-01 |
JP6782539B2 true JP6782539B2 (ja) | 2020-11-11 |
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Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015229112A Active JP6782539B2 (ja) | 2015-11-24 | 2015-11-24 | 発光装置 |
Country Status (2)
Country | Link |
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EP (1) | EP3174095B1 (ja) |
JP (1) | JP6782539B2 (ja) |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4585014B2 (ja) | 2002-04-12 | 2010-11-24 | ソウル セミコンダクター カンパニー リミテッド | 発光装置 |
JP4432413B2 (ja) * | 2003-09-05 | 2010-03-17 | 日亜化学工業株式会社 | 光源装置及び車両用前照灯 |
JP2009266434A (ja) * | 2008-04-22 | 2009-11-12 | Koito Mfg Co Ltd | 光源モジュールおよび車両用灯具 |
JP5655302B2 (ja) * | 2009-12-24 | 2015-01-21 | 東芝ライテック株式会社 | 照明装置 |
US8969890B2 (en) * | 2010-11-04 | 2015-03-03 | Koninklijke Philips N.V. | Solid state light emitting devices based on crystallographically relaxed structures |
JP2012169189A (ja) * | 2011-02-15 | 2012-09-06 | Koito Mfg Co Ltd | 発光モジュールおよび車両用灯具 |
DE102011056888A1 (de) * | 2011-12-22 | 2013-06-27 | Osram Opto Semiconductors Gmbh | Anzeigevorrichtung und Verfahren zur Herstellung einer Anzeigevorrichtung |
DE102012222958A1 (de) * | 2012-12-12 | 2014-06-12 | Automotive Lighting Reutlingen Gmbh | Verfahren und Vorrichtung zum Betreiben einer Beleuchtungseinrichtung eines Kraftfahrzeugs |
DE102012112302A1 (de) * | 2012-12-14 | 2014-06-18 | Osram Opto Semiconductors Gmbh | Anzeigevorrichtung und Verfahren zur Herstellung einer Anzeigevorrichtung |
DE102013114691A1 (de) * | 2013-12-20 | 2015-06-25 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauteil und adaptiver Scheinwerfer für ein Kraftfahrzeug |
JP2015177028A (ja) * | 2014-03-14 | 2015-10-05 | スタンレー電気株式会社 | 半導体装置の製造方法 |
-
2015
- 2015-11-24 JP JP2015229112A patent/JP6782539B2/ja active Active
-
2016
- 2016-11-22 EP EP16200117.6A patent/EP3174095B1/en active Active
Also Published As
Publication number | Publication date |
---|---|
EP3174095B1 (en) | 2019-12-04 |
EP3174095A1 (en) | 2017-05-31 |
JP2017098410A (ja) | 2017-06-01 |
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