JP5788149B2 - 発光装置及び照明装置 - Google Patents
発光装置及び照明装置 Download PDFInfo
- Publication number
- JP5788149B2 JP5788149B2 JP2010139367A JP2010139367A JP5788149B2 JP 5788149 B2 JP5788149 B2 JP 5788149B2 JP 2010139367 A JP2010139367 A JP 2010139367A JP 2010139367 A JP2010139367 A JP 2010139367A JP 5788149 B2 JP5788149 B2 JP 5788149B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- power supply
- light emitting
- mounting member
- surface side
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
- F21V19/0055—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by screwing
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
- F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/89—Metals
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Description
図1及び図3に示すように、これら複数の発光素子3は、マトリクス状に並べられて複数の列、例えば、6列の発光素子列を形成している。
この照明装置によれば、上記発光装置1が奏する効果を有する照明装置を提供することができる。
また、発光素子は、LED等の固体発光素子を適用できる。さらに、発光素子の実装個数には特段制限はない。
Claims (2)
- 裏面側が取付部材に配設される基板と;
この基板の表面側に実装された複数の発光素子と;
前記基板の表面側に設けられ、前記発光素子と電気的に接続された平面状の給電端子と;
前記基板の表面側に設けられ、前記基板の表面側から取付部材側へ向かう方向の弾性的押圧力によって前記給電端子に接続される電気的接続手段と;
前記基板の表面側に前記電気的接続手段とは別体となるように設けられ、前記基板の表面側に接触する押圧部を有し、この押圧部の前記基板の表面側から取付部材側へ向かう方向の弾性的押圧力によって前記基板を取付部材に固定する機械的固定手段と;を具備し、
前記電気的接続手段は、前記給電端子と接触する湾曲状の接触部を先端に有する接圧式の給電コネクタであり、前記給電端子に対して接続される弾性的押圧力が前記機械的固定手段により前記基板を取付部材に固定する弾性的押圧力より小さくなるように取付部材に対して固定されており、
前記基板は、セラミックス製であり、取付部材の上面に設けられた凹部内に周囲に隙間を有して落とし込み配置され、
前記機械的固定手段は、取付部材の上面に固定され、押圧部が取付部材の上面よりも下側で基板の表面側に接触している
ことを特徴とする発光装置。 - 装置本体と;
装置本体に配設された請求項1に記載の発光装置と;
を具備することを特徴とする照明装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010139367A JP5788149B2 (ja) | 2010-06-18 | 2010-06-18 | 発光装置及び照明装置 |
CN201110162141.XA CN102313170B (zh) | 2010-06-18 | 2011-06-16 | 发光装置以及照明装置 |
EP20110170187 EP2397752A3 (en) | 2010-06-18 | 2011-06-16 | Light emitting device and illumination apparatus |
US13/162,668 US8641232B2 (en) | 2010-06-18 | 2011-06-17 | Light emitting device and illumination apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010139367A JP5788149B2 (ja) | 2010-06-18 | 2010-06-18 | 発光装置及び照明装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012004420A JP2012004420A (ja) | 2012-01-05 |
JP5788149B2 true JP5788149B2 (ja) | 2015-09-30 |
Family
ID=44712937
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010139367A Expired - Fee Related JP5788149B2 (ja) | 2010-06-18 | 2010-06-18 | 発光装置及び照明装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US8641232B2 (ja) |
EP (1) | EP2397752A3 (ja) |
JP (1) | JP5788149B2 (ja) |
CN (1) | CN102313170B (ja) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5487396B2 (ja) | 2010-07-29 | 2014-05-07 | 東芝ライテック株式会社 | 発光装置及び照明装置 |
US9570666B2 (en) * | 2011-01-29 | 2017-02-14 | Gerald Ho Kim | Silicon-based cooling package for light-emitting devices |
WO2012103508A2 (en) * | 2011-01-29 | 2012-08-02 | Kim Gerald Ho | Silicon-based cooling package for light-emitting devices |
AT512588B1 (de) * | 2012-03-12 | 2014-12-15 | Zizala Lichtsysteme Gmbh | Lichtquellenmodul mit Laserlichtquelle sowie Fahrzeugscheinwerfer |
JP6024957B2 (ja) * | 2012-09-24 | 2016-11-16 | 東芝ライテック株式会社 | 発光装置および照明装置 |
JP2014086299A (ja) * | 2012-10-24 | 2014-05-12 | Minebea Co Ltd | 光源モジュール固定具及び照明装置 |
WO2014115443A1 (ja) * | 2013-01-24 | 2014-07-31 | シャープ株式会社 | 電子装置およびその製造方法 |
WO2015056567A1 (ja) * | 2013-10-18 | 2015-04-23 | 株式会社小糸製作所 | 回路モジュール、発光モジュールおよび押圧部材 |
EP2950168B1 (fr) * | 2014-05-27 | 2016-10-12 | The Swatch Group Research and Development Ltd. | Jeu d'aiguilles d'affichage lumineuses pour objet portable tel qu'une montre ou un instrument de mesure |
DE102015117936A1 (de) * | 2015-10-21 | 2017-04-27 | Osram Opto Semiconductors Gmbh | Optoelektronische Leuchtvorrichtung |
JP7493484B2 (ja) * | 2021-06-23 | 2024-05-31 | 株式会社遠藤照明 | 安全装置を備えた照明装置 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ATE474443T1 (de) * | 2003-02-07 | 2010-07-15 | Panasonic Corp | Beleuchtungseinrichtung, einen sockel verwendend, um ein flaches led-modul auf einen kühlkörper zu montieren |
JP4095463B2 (ja) * | 2003-02-13 | 2008-06-04 | 松下電器産業株式会社 | Led光源用ソケット |
EP1819963B1 (en) * | 2004-11-01 | 2010-04-21 | Panasonic Corporation | Light emitting module, lighting device, and display device |
JP4943930B2 (ja) * | 2007-04-24 | 2012-05-30 | パナソニック株式会社 | 立体回路部品の取付構造 |
US9086213B2 (en) | 2007-10-17 | 2015-07-21 | Xicato, Inc. | Illumination device with light emitting diodes |
CN201110514Y (zh) * | 2007-11-22 | 2008-09-03 | 王正国 | 可固定式照明装置 |
CN101452977B (zh) * | 2007-12-05 | 2010-06-02 | 亿光电子工业股份有限公司 | 发光结构及发光二极管芯片固定装置 |
JP5320560B2 (ja) | 2008-05-20 | 2013-10-23 | 東芝ライテック株式会社 | 光源ユニット及び照明装置 |
JP5232555B2 (ja) * | 2008-07-23 | 2013-07-10 | スタンレー電気株式会社 | 光半導体装置モジュール |
-
2010
- 2010-06-18 JP JP2010139367A patent/JP5788149B2/ja not_active Expired - Fee Related
-
2011
- 2011-06-16 EP EP20110170187 patent/EP2397752A3/en not_active Withdrawn
- 2011-06-16 CN CN201110162141.XA patent/CN102313170B/zh not_active Expired - Fee Related
- 2011-06-17 US US13/162,668 patent/US8641232B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US8641232B2 (en) | 2014-02-04 |
CN102313170B (zh) | 2014-05-07 |
JP2012004420A (ja) | 2012-01-05 |
US20110310609A1 (en) | 2011-12-22 |
EP2397752A3 (en) | 2012-10-03 |
EP2397752A2 (en) | 2011-12-21 |
CN102313170A (zh) | 2012-01-11 |
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