JP2011243935A - 発光装置及び照明装置 - Google Patents
発光装置及び照明装置 Download PDFInfo
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
- F21V19/0055—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by screwing
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
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- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S8/00—Lighting devices intended for fixed installation
- F21S8/04—Lighting devices intended for fixed installation intended only for mounting on a ceiling or the like overhead structures
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
- F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
- H05K1/0287—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
- H05K1/0289—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns having a matrix lay-out, i.e. having selectively interconnectable sets of X-conductors and Y-conductors in different planes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
Abstract
【解決手段】本発明は、基板10と、この基板10上に実装された複数の発光素子11と、蛍光体を含有する透光性樹脂から形成され、所定数の発光素子11を被覆する略山形の凸状蛍光体層12aを有するとともに、隣接する凸状蛍光体層12aの裾部が連なって形成された蛍光体層12とを備える発光装置1である。
【選択図】図1
Description
本発明及び以下の発明において、特に指定しない限り用語の技術的意味及び解釈は次による。
蛍光体層は、例えば、透明シリコーン樹脂に適量の蛍光体が含有されたものが用いられる。また、蛍光体には、YAG:Ce等の蛍光体が適用できる。
ボンディングワイヤには、例えば、金(Au)の細線を用いることが好ましいが、これ以外の金属細線を用いることもできる。
この発明により、ボンディングワイヤの断線や接合の外れを抑制することができる。
請求項4に記載の照明装置は、装置本体と;装置本体に配設された請求項1乃至請求項3のいずれか一に記載の発光装置と;を具備することを特徴とする。
照明装置には、光源や屋内又は屋外で使用される照明器具、ディスプレイ装置等が含まれる。
請求項2に記載の発明によれば、請求項1に記載の発明の効果に加え、ボンディングワイヤの断線や接合が外れるのを抑制することができる。
請求項3に記載の発明によれば、請求項1に記載の発明の効果に加え、蛍光体層の端部が略R形状に形成されているので出射光のばらつきを軽減できる。
請求項4記載の発明によれば、上記請求項に記載の発明の効果を奏する照明装置を提供することができる。
発光装置1は、図1に示すように、基板10と、複数の発光素子11と、各発光素子11を覆う蛍光体層12とを備えている。
加えて、発光素子11が放射した光のうちで横方向へ向かった光は、反射率の高い白色のレジスト層45の表面で反射され前面側へ放射される。
以上のように本実施形態によれば、第1の実施形態の効果に加え、ボンディングワイヤ17の断線や接合が外れるのを抑制することができる効果を奏する。
次に、本発明の第3の実施形態について図13を参照して説明する。なお、第1の実施形態と同一又は相当部分には、同一符号を付し重複した説明は省略する。
次に、本発明の第4の実施形態について図14を参照して説明する。なお、第1の実施形態と同一又は相当部分には、同一符号を付し重複した説明は省略する。
このような構成によれば、単位蛍光体層12aの量的なばらつきをより緩和でき、全体として光の照射の均一化を高めることができる。
照明装置としては、光源、屋内又は屋外で使用される照明器具、ディスプレイ装置等に適用が可能である。
12・・・蛍光体層、12a・・・凸状蛍光体層(単位蛍光体層)、
12s・・・連続部、14・・・接続パターン、141・・・溝部、
15・・・配線パターン、15a・・・実装パッド、17・・・ボンディングワイヤ、
20・・・照明装置
Claims (4)
- 基板と;
この基板上に実装された複数の発光素子と;
蛍光体を含有する透光性樹脂から形成され、所定数の発光素子を被覆する略山形の凸状蛍光体層を有するとともに、隣接する凸状蛍光体層の裾部が連なって形成された蛍光体層と;
を具備することを特徴とする発光装置。 - 前記複数の発光素子は、基板上に列を形成するように並べられて実装されるとともに、列の延びる方向に配設されたボンディングワイヤにより接続されていることを特徴とする請求項1に記載の発光装置。
- 前記複数の発光素子は、基板上に列を形成するように並べられて実装されるとともに、この複数の発光素子を被覆する前記蛍光体層の端部が略R形状に形成されていることを特徴とする請求項1又は請求項2に記載の発光装置。
- 装置本体と;
装置本体に配設された請求項1乃至請求項3のいずれか一に記載の発光装置と;
を具備することを特徴とする照明装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010138766A JP5522462B2 (ja) | 2010-04-20 | 2010-06-17 | 発光装置及び照明装置 |
EP11162869.9A EP2381157A3 (en) | 2010-04-20 | 2011-04-18 | Luminaire and light-emitting apparatus with light-emitting device |
CN201110102112.4A CN102237350B (zh) | 2010-04-20 | 2011-04-19 | 照明装置以及包括发光元件的发光装置 |
US13/090,645 US8872198B2 (en) | 2010-04-20 | 2011-04-20 | Luminaire and light-emitting apparatus with light-emitting device |
Applications Claiming Priority (3)
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JP2010096744 | 2010-04-20 | ||
JP2010096744 | 2010-04-20 | ||
JP2010138766A JP5522462B2 (ja) | 2010-04-20 | 2010-06-17 | 発光装置及び照明装置 |
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JP2011243935A true JP2011243935A (ja) | 2011-12-01 |
JP5522462B2 JP5522462B2 (ja) | 2014-06-18 |
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JP2010138766A Expired - Fee Related JP5522462B2 (ja) | 2010-04-20 | 2010-06-17 | 発光装置及び照明装置 |
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US (1) | US8872198B2 (ja) |
EP (1) | EP2381157A3 (ja) |
JP (1) | JP5522462B2 (ja) |
CN (1) | CN102237350B (ja) |
Cited By (10)
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JP5216948B1 (ja) * | 2012-03-13 | 2013-06-19 | パナソニック株式会社 | 基板、発光装置及び照明装置 |
WO2013089108A1 (ja) * | 2011-12-14 | 2013-06-20 | 株式会社小糸製作所 | 発光モジュール |
WO2013129071A1 (ja) * | 2012-02-27 | 2013-09-06 | シャープ株式会社 | 発光装置 |
WO2013136389A1 (ja) * | 2012-03-13 | 2013-09-19 | パナソニック株式会社 | 基板、発光装置及び照明装置 |
WO2013183556A1 (ja) * | 2012-06-08 | 2013-12-12 | Idec株式会社 | 光源装置および照明装置 |
JP2014049625A (ja) * | 2012-08-31 | 2014-03-17 | Panasonic Corp | Ledモジュール |
JP2014107477A (ja) * | 2012-11-29 | 2014-06-09 | Panasonic Corp | 発光モジュールおよび当該発光モジュールを用いた照明用光源 |
JP2014107495A (ja) * | 2012-11-29 | 2014-06-09 | Seiwa Electric Mfg Co Ltd | 発光装置 |
JP2014116526A (ja) * | 2012-12-12 | 2014-06-26 | Puratekku:Kk | 基板、ledユニット及び当該基板、ledユニットを備えた照明器具 |
JP5793678B2 (ja) * | 2012-08-23 | 2015-10-14 | パナソニックIpマネジメント株式会社 | 発光装置、照明用光源及び照明装置 |
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JP5250162B1 (ja) * | 2011-11-21 | 2013-07-31 | パナソニック株式会社 | 発光装置及び照明装置 |
CN102543983A (zh) * | 2011-12-09 | 2012-07-04 | 安徽莱德光电技术有限公司 | 一种led集成光源 |
CN102738349A (zh) * | 2011-12-09 | 2012-10-17 | 安徽莱德光电技术有限公司 | 一种封装基板 |
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CN102738320A (zh) * | 2011-12-09 | 2012-10-17 | 安徽莱德光电技术有限公司 | 一种封装框架 |
GB2501758B (en) * | 2012-05-04 | 2016-05-25 | Thorpe F W Plc | Improvements in or relating to LED lighting |
DE102012214887A1 (de) * | 2012-08-22 | 2014-02-27 | Ridi - Leuchten Gmbh | LED-Flächenstrahler |
ITTO20120841A1 (it) * | 2012-09-27 | 2014-03-28 | Osram Ag | Procedimento per montare moduli di illuminazione e relativo equipaggiamento |
US20140264423A1 (en) * | 2013-03-15 | 2014-09-18 | Grote Industries, Llc | Flexible lighting device including a protective conformal coating |
TWI564505B (zh) * | 2013-08-28 | 2017-01-01 | 隆達電子股份有限公司 | 燈條結構 |
KR102430999B1 (ko) * | 2015-06-24 | 2022-08-10 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | 광원 모듈 |
US20170268752A1 (en) * | 2016-03-17 | 2017-09-21 | Amerillum LLC | Illumination Systems with LED-Based Extension Light Source |
US11359797B1 (en) | 2020-11-20 | 2022-06-14 | Advanced Lighting Concepts, LLC | Chip-on-board LED lighting devices |
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WO2013089108A1 (ja) * | 2011-12-14 | 2013-06-20 | 株式会社小糸製作所 | 発光モジュール |
JP2013125808A (ja) * | 2011-12-14 | 2013-06-24 | Koito Mfg Co Ltd | 発光モジュール |
WO2013129071A1 (ja) * | 2012-02-27 | 2013-09-06 | シャープ株式会社 | 発光装置 |
JP5216948B1 (ja) * | 2012-03-13 | 2013-06-19 | パナソニック株式会社 | 基板、発光装置及び照明装置 |
WO2013136389A1 (ja) * | 2012-03-13 | 2013-09-19 | パナソニック株式会社 | 基板、発光装置及び照明装置 |
US8847251B2 (en) | 2012-03-13 | 2014-09-30 | Panasonic Corporation | Substrate, light-emitting device, and lighting apparatus having a largest gap between two lines at light-emitting element mounting position |
JP2013254690A (ja) * | 2012-06-08 | 2013-12-19 | Idec Corp | 光源装置および照明装置 |
WO2013183556A1 (ja) * | 2012-06-08 | 2013-12-12 | Idec株式会社 | 光源装置および照明装置 |
JP5793678B2 (ja) * | 2012-08-23 | 2015-10-14 | パナソニックIpマネジメント株式会社 | 発光装置、照明用光源及び照明装置 |
JPWO2014030313A1 (ja) * | 2012-08-23 | 2016-07-28 | パナソニックIpマネジメント株式会社 | 発光装置、照明用光源及び照明装置 |
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JP2014107477A (ja) * | 2012-11-29 | 2014-06-09 | Panasonic Corp | 発光モジュールおよび当該発光モジュールを用いた照明用光源 |
JP2014107495A (ja) * | 2012-11-29 | 2014-06-09 | Seiwa Electric Mfg Co Ltd | 発光装置 |
JP2014116526A (ja) * | 2012-12-12 | 2014-06-26 | Puratekku:Kk | 基板、ledユニット及び当該基板、ledユニットを備えた照明器具 |
Also Published As
Publication number | Publication date |
---|---|
US8872198B2 (en) | 2014-10-28 |
CN102237350A (zh) | 2011-11-09 |
US20110254023A1 (en) | 2011-10-20 |
EP2381157A3 (en) | 2013-10-16 |
EP2381157A2 (en) | 2011-10-26 |
CN102237350B (zh) | 2014-07-09 |
JP5522462B2 (ja) | 2014-06-18 |
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