JP5979994B2 - 電子装置 - Google Patents

電子装置 Download PDF

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Publication number
JP5979994B2
JP5979994B2 JP2012133235A JP2012133235A JP5979994B2 JP 5979994 B2 JP5979994 B2 JP 5979994B2 JP 2012133235 A JP2012133235 A JP 2012133235A JP 2012133235 A JP2012133235 A JP 2012133235A JP 5979994 B2 JP5979994 B2 JP 5979994B2
Authority
JP
Japan
Prior art keywords
lid
plating layer
metal film
housing
current
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2012133235A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013258281A5 (https=
JP2013258281A (ja
Inventor
村山　啓
啓 村山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2012133235A priority Critical patent/JP5979994B2/ja
Priority to US13/914,660 priority patent/US9179568B2/en
Publication of JP2013258281A publication Critical patent/JP2013258281A/ja
Publication of JP2013258281A5 publication Critical patent/JP2013258281A5/ja
Application granted granted Critical
Publication of JP5979994B2 publication Critical patent/JP5979994B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0091—Housing specially adapted for small components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Micromachines (AREA)
JP2012133235A 2012-06-12 2012-06-12 電子装置 Expired - Fee Related JP5979994B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2012133235A JP5979994B2 (ja) 2012-06-12 2012-06-12 電子装置
US13/914,660 US9179568B2 (en) 2012-06-12 2013-06-11 Electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012133235A JP5979994B2 (ja) 2012-06-12 2012-06-12 電子装置

Publications (3)

Publication Number Publication Date
JP2013258281A JP2013258281A (ja) 2013-12-26
JP2013258281A5 JP2013258281A5 (https=) 2015-07-23
JP5979994B2 true JP5979994B2 (ja) 2016-08-31

Family

ID=49715156

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012133235A Expired - Fee Related JP5979994B2 (ja) 2012-06-12 2012-06-12 電子装置

Country Status (2)

Country Link
US (1) US9179568B2 (https=)
JP (1) JP5979994B2 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103837145B (zh) * 2012-11-26 2018-12-28 精工爱普生株式会社 电子器件及其制造方法、盖体、电子设备以及移动体
JP6943130B2 (ja) * 2017-10-11 2021-09-29 セイコーエプソン株式会社 Ｍｅｍｓデバイス、慣性計測装置、移動体測位装置、携帯型電子機器、電子機器、および移動体

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL136562C (https=) * 1963-10-24
EP1445798B1 (en) * 2001-11-12 2009-12-30 Neomax Materials Co., Ltd. Package for electronic parts, lid thereof, material for the lid and method for producing the lid material
JP3850787B2 (ja) * 2001-11-12 2006-11-29 株式会社Ｎｅｏｍａｘマテリアル 電子部品用パッケージ、その蓋体、その蓋体用の蓋材およびその蓋材の製造方法
JP5025471B2 (ja) * 2005-06-08 2012-09-12 株式会社Ｎｅｏｍａｘマテリアル 電子部品パッケージ、その製造方法及び電子部品パッケージ用蓋材
JP2007017199A (ja) * 2005-07-05 2007-01-25 Sharp Corp チップスケールパッケージおよびその製造方法
JP4955349B2 (ja) * 2006-09-07 2012-06-20 新光電気工業株式会社 半導体装置
JP2008107215A (ja) * 2006-10-26 2008-05-08 Mitsubishi Electric Corp イメージセンサおよびその製造方法
JP2010239180A (ja) * 2009-03-30 2010-10-21 Citizen Finetech Miyota Co Ltd 圧電デバイスの製造方法
JP5568786B2 (ja) * 2009-12-24 2014-08-13 新光電気工業株式会社 半導体パッケージの製造方法及び半導体パッケージ
JP5629926B2 (ja) * 2010-08-11 2014-11-26 新光電気工業株式会社 半導体パッケージおよびその製造方法

Also Published As

Publication number Publication date
US9179568B2 (en) 2015-11-03
JP2013258281A (ja) 2013-12-26
US20130329385A1 (en) 2013-12-12

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