JP2013258281A5 - - Google Patents

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Publication number
JP2013258281A5
JP2013258281A5 JP2012133235A JP2012133235A JP2013258281A5 JP 2013258281 A5 JP2013258281 A5 JP 2013258281A5 JP 2012133235 A JP2012133235 A JP 2012133235A JP 2012133235 A JP2012133235 A JP 2012133235A JP 2013258281 A5 JP2013258281 A5 JP 2013258281A5
Authority
JP
Japan
Prior art keywords
metal film
lid
electronic device
recess
plan
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2012133235A
Other languages
English (en)
Japanese (ja)
Other versions
JP5979994B2 (ja
JP2013258281A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2012133235A priority Critical patent/JP5979994B2/ja
Priority claimed from JP2012133235A external-priority patent/JP5979994B2/ja
Priority to US13/914,660 priority patent/US9179568B2/en
Publication of JP2013258281A publication Critical patent/JP2013258281A/ja
Publication of JP2013258281A5 publication Critical patent/JP2013258281A5/ja
Application granted granted Critical
Publication of JP5979994B2 publication Critical patent/JP5979994B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2012133235A 2012-06-12 2012-06-12 電子装置 Expired - Fee Related JP5979994B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2012133235A JP5979994B2 (ja) 2012-06-12 2012-06-12 電子装置
US13/914,660 US9179568B2 (en) 2012-06-12 2013-06-11 Electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012133235A JP5979994B2 (ja) 2012-06-12 2012-06-12 電子装置

Publications (3)

Publication Number Publication Date
JP2013258281A JP2013258281A (ja) 2013-12-26
JP2013258281A5 true JP2013258281A5 (https=) 2015-07-23
JP5979994B2 JP5979994B2 (ja) 2016-08-31

Family

ID=49715156

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012133235A Expired - Fee Related JP5979994B2 (ja) 2012-06-12 2012-06-12 電子装置

Country Status (2)

Country Link
US (1) US9179568B2 (https=)
JP (1) JP5979994B2 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103837145B (zh) * 2012-11-26 2018-12-28 精工爱普生株式会社 电子器件及其制造方法、盖体、电子设备以及移动体
JP6943130B2 (ja) * 2017-10-11 2021-09-29 セイコーエプソン株式会社 Ｍｅｍｓデバイス、慣性計測装置、移動体測位装置、携帯型電子機器、電子機器、および移動体

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL136562C (https=) * 1963-10-24
EP1445798B1 (en) * 2001-11-12 2009-12-30 Neomax Materials Co., Ltd. Package for electronic parts, lid thereof, material for the lid and method for producing the lid material
JP3850787B2 (ja) * 2001-11-12 2006-11-29 株式会社Ｎｅｏｍａｘマテリアル 電子部品用パッケージ、その蓋体、その蓋体用の蓋材およびその蓋材の製造方法
JP5025471B2 (ja) * 2005-06-08 2012-09-12 株式会社Ｎｅｏｍａｘマテリアル 電子部品パッケージ、その製造方法及び電子部品パッケージ用蓋材
JP2007017199A (ja) * 2005-07-05 2007-01-25 Sharp Corp チップスケールパッケージおよびその製造方法
JP4955349B2 (ja) * 2006-09-07 2012-06-20 新光電気工業株式会社 半導体装置
JP2008107215A (ja) * 2006-10-26 2008-05-08 Mitsubishi Electric Corp イメージセンサおよびその製造方法
JP2010239180A (ja) * 2009-03-30 2010-10-21 Citizen Finetech Miyota Co Ltd 圧電デバイスの製造方法
JP5568786B2 (ja) * 2009-12-24 2014-08-13 新光電気工業株式会社 半導体パッケージの製造方法及び半導体パッケージ
JP5629926B2 (ja) * 2010-08-11 2014-11-26 新光電気工業株式会社 半導体パッケージおよびその製造方法

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