JP5968753B2 - 配線基板 - Google Patents

配線基板 Download PDF

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Publication number
JP5968753B2
JP5968753B2 JP2012228210A JP2012228210A JP5968753B2 JP 5968753 B2 JP5968753 B2 JP 5968753B2 JP 2012228210 A JP2012228210 A JP 2012228210A JP 2012228210 A JP2012228210 A JP 2012228210A JP 5968753 B2 JP5968753 B2 JP 5968753B2
Authority
JP
Japan
Prior art keywords
hole
protrusion
wiring board
capacitor
core substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2012228210A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014082276A5 (https=
JP2014082276A (ja
Inventor
武巳 町田
武巳 町田
大介 滝澤
大介 滝澤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2012228210A priority Critical patent/JP5968753B2/ja
Priority to KR1020130118347A priority patent/KR20140048042A/ko
Priority to US14/050,505 priority patent/US8804361B2/en
Publication of JP2014082276A publication Critical patent/JP2014082276A/ja
Publication of JP2014082276A5 publication Critical patent/JP2014082276A5/ja
Application granted granted Critical
Publication of JP5968753B2 publication Critical patent/JP5968753B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/185—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H10W70/635—Through-vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09854—Hole or via having special cross-section, e.g. elliptical
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP2012228210A 2012-10-15 2012-10-15 配線基板 Active JP5968753B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2012228210A JP5968753B2 (ja) 2012-10-15 2012-10-15 配線基板
KR1020130118347A KR20140048042A (ko) 2012-10-15 2013-10-04 배선 기판
US14/050,505 US8804361B2 (en) 2012-10-15 2013-10-10 Wiring substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012228210A JP5968753B2 (ja) 2012-10-15 2012-10-15 配線基板

Publications (3)

Publication Number Publication Date
JP2014082276A JP2014082276A (ja) 2014-05-08
JP2014082276A5 JP2014082276A5 (https=) 2015-11-05
JP5968753B2 true JP5968753B2 (ja) 2016-08-10

Family

ID=50475136

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012228210A Active JP5968753B2 (ja) 2012-10-15 2012-10-15 配線基板

Country Status (3)

Country Link
US (1) US8804361B2 (https=)
JP (1) JP5968753B2 (https=)
KR (1) KR20140048042A (https=)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102105403B1 (ko) * 2013-11-28 2020-04-28 삼성전기주식회사 전자소자 내장 기판 및 그 제조 방법
JP6384118B2 (ja) * 2014-05-13 2018-09-05 日立化成株式会社 半導体装置の製造方法、半導体装置及び半導体装置製造用部材
KR101591751B1 (ko) 2014-08-13 2016-02-05 주식회사 뉴마이크로 컬러 샤프심 제조용 가공 수지, 및 이의 제조방법
KR101591749B1 (ko) 2014-08-13 2016-02-05 주식회사 뉴마이크로 칼라 샤프심 제조용 식물성 가소제 및 이의 제조방법
KR101591752B1 (ko) 2014-08-13 2016-02-12 주식회사 뉴마이크로 칼라 샤프심
KR101591750B1 (ko) 2014-08-13 2016-02-11 주식회사 뉴마이크로 칼라 샤프심의 제조방법
KR101609264B1 (ko) 2014-12-09 2016-04-05 삼성전기주식회사 전자소자 내장 기판 및 그 제조 방법
JP6639934B2 (ja) * 2016-02-08 2020-02-05 新光電気工業株式会社 配線基板、半導体装置及び配線基板の製造方法
US9743526B1 (en) 2016-02-10 2017-08-22 International Business Machines Corporation Wiring board with stacked embedded capacitors and method of making
JP6678090B2 (ja) * 2016-10-04 2020-04-08 新光電気工業株式会社 電子部品内蔵基板及びその製造方法と電子部品装置
TWI694756B (zh) * 2018-12-27 2020-05-21 欣興電子股份有限公司 一種具有散熱塊的電路板及其製造方法
US11445596B2 (en) * 2018-12-27 2022-09-13 Unimicron Technology Corp. Circuit board having heat-dissipation block and method of manufacturing the same
US20200279814A1 (en) * 2019-02-28 2020-09-03 Advanced Semiconductor Engineering, Inc. Wiring structure and method for manufacturing the same
US10790241B2 (en) 2019-02-28 2020-09-29 Advanced Semiconductor Engineering, Inc. Wiring structure and method for manufacturing the same
KR102950446B1 (ko) * 2020-06-30 2026-04-09 삼성전기주식회사 인쇄회로기판
US20250070001A1 (en) * 2023-08-24 2025-02-27 Qualcomm Incorporated Device including substrate with passive electronic component embedded therein

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6239485B1 (en) * 1998-11-13 2001-05-29 Fujitsu Limited Reduced cross-talk noise high density signal interposer with power and ground wrap
EP2265101B1 (en) * 1999-09-02 2012-08-29 Ibiden Co., Ltd. Printed circuit board and method of manufacturing printed circuit board
JP2005116943A (ja) * 2003-10-10 2005-04-28 Seiko Epson Corp プリント配線基板、実装基板モジュール、プリント配線基板の製造方法、およびそれを用いた電気光学装置、電子機器
JP2006073763A (ja) * 2004-09-01 2006-03-16 Denso Corp 多層基板の製造方法
JP4882880B2 (ja) 2007-06-12 2012-02-22 株式会社デンソー プリント基板の製造方法およびプリント基板
JP2012079994A (ja) * 2010-10-05 2012-04-19 Yamaichi Electronics Co Ltd 部品内蔵プリント配線板およびその製造方法

Also Published As

Publication number Publication date
JP2014082276A (ja) 2014-05-08
KR20140048042A (ko) 2014-04-23
US20140104797A1 (en) 2014-04-17
US8804361B2 (en) 2014-08-12

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