JP5960384B2 - 静電チャック用基板及び静電チャック - Google Patents
静電チャック用基板及び静電チャック Download PDFInfo
- Publication number
- JP5960384B2 JP5960384B2 JP2010207515A JP2010207515A JP5960384B2 JP 5960384 B2 JP5960384 B2 JP 5960384B2 JP 2010207515 A JP2010207515 A JP 2010207515A JP 2010207515 A JP2010207515 A JP 2010207515A JP 5960384 B2 JP5960384 B2 JP 5960384B2
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- Prior art keywords
- electrode layer
- substrate
- electrostatic chuck
- electrode
- electrode layers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
- B23Q3/15—Devices for holding work using magnetic or electric force acting directly on the work
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Drying Of Semiconductors (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010207515A JP5960384B2 (ja) | 2009-10-26 | 2010-09-16 | 静電チャック用基板及び静電チャック |
| US12/910,493 US8441772B2 (en) | 2009-10-26 | 2010-10-22 | Substrate for electrostatic chuck and electrostatic chuck |
| KR1020100103213A KR101731017B1 (ko) | 2009-10-26 | 2010-10-22 | 정전 척용 기판 및 정전 척 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009245268 | 2009-10-26 | ||
| JP2009245268 | 2009-10-26 | ||
| JP2010207515A JP5960384B2 (ja) | 2009-10-26 | 2010-09-16 | 静電チャック用基板及び静電チャック |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011119654A JP2011119654A (ja) | 2011-06-16 |
| JP2011119654A5 JP2011119654A5 (enExample) | 2013-07-18 |
| JP5960384B2 true JP5960384B2 (ja) | 2016-08-02 |
Family
ID=43898254
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010207515A Active JP5960384B2 (ja) | 2009-10-26 | 2010-09-16 | 静電チャック用基板及び静電チャック |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US8441772B2 (enExample) |
| JP (1) | JP5960384B2 (enExample) |
| KR (1) | KR101731017B1 (enExample) |
Families Citing this family (99)
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| JP5896595B2 (ja) * | 2010-10-20 | 2016-03-30 | ラム リサーチ コーポレーションLam Research Corporation | 2層rf構造のウエハ保持体 |
| WO2014073554A1 (ja) * | 2012-11-06 | 2014-05-15 | 日本碍子株式会社 | サセプタ |
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| JP5938716B2 (ja) | 2013-11-01 | 2016-06-22 | パナソニックIpマネジメント株式会社 | プラズマ処理装置及びプラズマ処理方法 |
| JP6356516B2 (ja) * | 2014-07-22 | 2018-07-11 | 東芝メモリ株式会社 | プラズマ処理装置およびプラズマ処理方法 |
| US10002782B2 (en) * | 2014-10-17 | 2018-06-19 | Lam Research Corporation | ESC assembly including an electrically conductive gasket for uniform RF power delivery therethrough |
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| US10550469B2 (en) * | 2015-09-04 | 2020-02-04 | Lam Research Corporation | Plasma excitation for spatial atomic layer deposition (ALD) reactors |
| US10083853B2 (en) * | 2015-10-19 | 2018-09-25 | Lam Research Corporation | Electrostatic chuck design for cooling-gas light-up prevention |
| JP2019504481A (ja) * | 2015-12-07 | 2019-02-14 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 静電チャックを使用した基板の固定と開放のための方法及び装置 |
| CN106898574A (zh) * | 2015-12-17 | 2017-06-27 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 静电卡盘机构以及半导体加工设备 |
| US11532497B2 (en) * | 2016-06-07 | 2022-12-20 | Applied Materials, Inc. | High power electrostatic chuck design with radio frequency coupling |
| KR102162949B1 (ko) * | 2016-07-14 | 2020-10-07 | 도쿄엘렉트론가부시키가이샤 | 다중 구역 전극 어레이에서의 rf 전력 분배 방법 |
| JP2018046179A (ja) * | 2016-09-15 | 2018-03-22 | 株式会社東芝 | 静電チャック及び半導体製造装置 |
| KR102644272B1 (ko) * | 2016-10-31 | 2024-03-06 | 삼성전자주식회사 | 정전척 어셈블리 |
| WO2018163935A1 (ja) * | 2017-03-06 | 2018-09-13 | 日本碍子株式会社 | ウエハ支持台 |
| US11289355B2 (en) * | 2017-06-02 | 2022-03-29 | Lam Research Corporation | Electrostatic chuck for use in semiconductor processing |
| US11469084B2 (en) | 2017-09-05 | 2022-10-11 | Lam Research Corporation | High temperature RF connection with integral thermal choke |
| US10811296B2 (en) * | 2017-09-20 | 2020-10-20 | Applied Materials, Inc. | Substrate support with dual embedded electrodes |
| US10510575B2 (en) | 2017-09-20 | 2019-12-17 | Applied Materials, Inc. | Substrate support with multiple embedded electrodes |
| WO2019065233A1 (ja) * | 2017-09-29 | 2019-04-04 | 住友大阪セメント株式会社 | 静電チャック装置 |
| JP7374103B2 (ja) | 2018-01-31 | 2023-11-06 | ラム リサーチ コーポレーション | 静電チャック(esc)ペデスタル電圧分離 |
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| JP5133750B2 (ja) * | 2008-03-25 | 2013-01-30 | 東京エレクトロン株式会社 | プラズマ処理装置及びプラズマ処理装置のフィードバック制御方法 |
-
2010
- 2010-09-16 JP JP2010207515A patent/JP5960384B2/ja active Active
- 2010-10-22 US US12/910,493 patent/US8441772B2/en active Active
- 2010-10-22 KR KR1020100103213A patent/KR101731017B1/ko active Active
Also Published As
| Publication number | Publication date |
|---|---|
| US20110096461A1 (en) | 2011-04-28 |
| JP2011119654A (ja) | 2011-06-16 |
| KR101731017B1 (ko) | 2017-04-27 |
| KR20110046301A (ko) | 2011-05-04 |
| US8441772B2 (en) | 2013-05-14 |
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