JP5954549B2 - 可撓性薄膜構造の表示セルを取り扱う方法 - Google Patents

可撓性薄膜構造の表示セルを取り扱う方法 Download PDF

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Publication number
JP5954549B2
JP5954549B2 JP2014158102A JP2014158102A JP5954549B2 JP 5954549 B2 JP5954549 B2 JP 5954549B2 JP 2014158102 A JP2014158102 A JP 2014158102A JP 2014158102 A JP2014158102 A JP 2014158102A JP 5954549 B2 JP5954549 B2 JP 5954549B2
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cell
mother board
display cell
carrier tape
motherboard
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Japanese (ja)
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JP2016035507A5 (enExample
JP2016035507A (ja
Inventor
多公歳 中西
多公歳 中西
創矢 徐
創矢 徐
智 小塩
智 小塩
村上　奈穗
奈穗 村上
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Nitto Denko Corp
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Nitto Denko Corp
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Priority to JP2014158102A priority Critical patent/JP5954549B2/ja
Priority to TW104117645A priority patent/TWI632099B/zh
Priority to KR1020150094173A priority patent/KR102374333B1/ko
Priority to CN201510390892.5A priority patent/CN105321862B/zh
Priority to PCT/JP2015/071835 priority patent/WO2016017807A1/ja
Publication of JP2016035507A publication Critical patent/JP2016035507A/ja
Publication of JP2016035507A5 publication Critical patent/JP2016035507A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H41/00—Machines for separating superposed webs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H5/00—Feeding articles separated from piles; Feeding articles to machines
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Feeding Of Articles By Means Other Than Belts Or Rollers (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
JP2014158102A 2014-08-01 2014-08-01 可撓性薄膜構造の表示セルを取り扱う方法 Active JP5954549B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2014158102A JP5954549B2 (ja) 2014-08-01 2014-08-01 可撓性薄膜構造の表示セルを取り扱う方法
TW104117645A TWI632099B (zh) 2014-08-01 2015-06-01 可撓性薄膜構造的顯示單元及光學顯示單元以及單元母板之處理方法
KR1020150094173A KR102374333B1 (ko) 2014-08-01 2015-07-01 가요성 박막 구조의 표시 셀을 취급하는 방법
CN201510390892.5A CN105321862B (zh) 2014-08-01 2015-07-06 处理挠性薄膜结构的显示元件的方法
PCT/JP2015/071835 WO2016017807A1 (ja) 2014-08-01 2015-07-31 可撓性薄膜構造の表示セルを取り扱う方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014158102A JP5954549B2 (ja) 2014-08-01 2014-08-01 可撓性薄膜構造の表示セルを取り扱う方法

Publications (3)

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JP2016035507A JP2016035507A (ja) 2016-03-17
JP2016035507A5 JP2016035507A5 (enExample) 2016-06-09
JP5954549B2 true JP5954549B2 (ja) 2016-07-20

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JP2014158102A Active JP5954549B2 (ja) 2014-08-01 2014-08-01 可撓性薄膜構造の表示セルを取り扱う方法

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JP (1) JP5954549B2 (enExample)
KR (1) KR102374333B1 (enExample)
CN (1) CN105321862B (enExample)
TW (1) TWI632099B (enExample)
WO (1) WO2016017807A1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018072689A (ja) * 2016-11-01 2018-05-10 日東電工株式会社 光学的表示装置を製造する方法
CN106735880A (zh) * 2017-01-13 2017-05-31 武汉华星光电技术有限公司 一种柔性显示面板的切割方法及切割装置
JP6888812B2 (ja) * 2017-04-21 2021-06-16 淀川メデック株式会社 フレキシブルデバイスの製造装置及び製造方法
JP6393362B1 (ja) * 2017-04-25 2018-09-19 住友化学株式会社 有機デバイスの製造方法
JP6284670B1 (ja) * 2017-04-25 2018-02-28 住友化学株式会社 有機デバイスの製造方法
CN109427618A (zh) * 2017-08-31 2019-03-05 财团法人工业技术研究院 分离装置及分离方法
TWI710288B (zh) * 2020-01-22 2020-11-11 頎邦科技股份有限公司 電路板的散熱片貼合方法及其貼合裝置
CN113334467B (zh) * 2021-05-31 2022-09-30 深圳市聚飞光学材料有限公司 一种光学膜卷材加工方法及光学膜卷材

Family Cites Families (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS524200B2 (enExample) 1973-08-16 1977-02-02
US5448264A (en) 1991-03-15 1995-09-05 Hewlett-Packard Company Method and apparatus for separate window clipping and display mode planes in a graphics frame buffer
JPH06312837A (ja) * 1993-04-30 1994-11-08 Ii M Techno:Kk 搬送装置
JP3574865B2 (ja) * 1999-11-08 2004-10-06 株式会社 日立インダストリイズ 基板の組立方法とその装置
JP2003029229A (ja) * 2001-07-12 2003-01-29 Sharp Corp 基板搬送用治具およびそれを用いた液晶表示素子の製造方法
JP4241203B2 (ja) * 2002-06-13 2009-03-18 東レ株式会社 可撓性フィルムのラミネート方法およびラミネート装置並びに回路基板の製造方法
JP2004114585A (ja) * 2002-09-27 2004-04-15 Toray Ind Inc 可撓性フィルムのラミネート方法およびラミネート装置
JP3799378B2 (ja) * 2003-01-27 2006-07-19 株式会社 日立インダストリイズ 基板の組立方法とその装置
JP4274325B2 (ja) * 2004-11-24 2009-06-03 Ｊｐテック株式会社 テープ貼付装置
JP4528923B2 (ja) 2005-12-05 2010-08-25 学校法人金沢工業大学 Ｅｌ素子
JP5112268B2 (ja) * 2007-12-06 2013-01-09 日東電工株式会社 画像表示装置の製造方法
CN102089858B (zh) 2008-02-20 2013-03-13 夏普株式会社 柔性半导体基板的制造方法
JP2010013250A (ja) 2008-07-04 2010-01-21 Asyst Technologies Japan Inc 搬送システム及びコンピュータプログラム
JP5418505B2 (ja) * 2009-02-03 2014-02-19 コニカミノルタ株式会社 有機エレクトロニクス素子及びその製造方法
JP4669087B1 (ja) * 2009-05-15 2011-04-13 日東電工株式会社 光学表示装置の製造システム及び製造方法
JP5010652B2 (ja) * 2009-08-19 2012-08-29 株式会社東芝 シート剥離装置および表示装置の製造方法
JP5737625B2 (ja) 2011-08-04 2015-06-17 大日本印刷株式会社 ガラスフィルム積層体、ガラスフィルム積層体ロール、カラーフィルタ用画素付ガラスフィルム積層体およびガラスフィルム積層体の製造方法
JP6016064B2 (ja) 2011-09-02 2016-10-26 日本電気硝子株式会社 高屈折率ガラス
JP5896669B2 (ja) 2011-09-27 2016-03-30 テルモ株式会社 シリンジ用プランジャー、シリンジおよびプレフィルドシリンジ
JP2013070787A (ja) 2011-09-27 2013-04-22 Equos Research Co Ltd 歩行支援装置
JP5796449B2 (ja) * 2011-10-12 2015-10-21 旭硝子株式会社 電子デバイスの製造方法、樹脂層付きキャリア基板の製造方法
JP2013118319A (ja) * 2011-12-05 2013-06-13 Shibaura Mechatronics Corp 電子部品の実装装置及び実装方法
JP5592587B2 (ja) * 2012-02-29 2014-09-17 住友化学株式会社 光学表示デバイスの生産システム及び光学表示デバイスの生産方法
CN104136968B (zh) * 2012-02-29 2018-01-09 住友化学株式会社 光学显示设备的生产系统以及光学显示设备的生产方法
KR101174834B1 (ko) * 2012-04-05 2012-08-17 주식회사 다보씨앤엠 공정필름을 이용한 필름형 디스플레이 기판의 제조방법 및 이에 사용되는 필름형 디스플레이 기판 제조용 공정필름
WO2013165013A1 (ja) * 2012-05-02 2013-11-07 住友化学株式会社 光学表示デバイスの生産システム及び生産方法
KR101923261B1 (ko) * 2012-07-02 2018-11-28 코닝 인코포레이티드 유리 기판의 가공 방법 및 유리 장치
TWI529101B (zh) * 2012-07-09 2016-04-11 達鴻先進科技股份有限公司 貼合取膜裝置及其方法
KR102060541B1 (ko) * 2012-07-13 2019-12-31 삼성디스플레이 주식회사 표시 패널 제조 방법
JP5946362B2 (ja) * 2012-08-10 2016-07-06 日東電工株式会社 光学表示パネルの製造方法および光学表示パネルの製造システム
JP2014049486A (ja) * 2012-08-29 2014-03-17 Nitto Denko Corp 保護テープ剥離方法および保護テープ剥離装置
JP6037551B2 (ja) * 2012-09-13 2016-12-07 住友化学株式会社 光学部材貼合体の製造装置
JP5744819B2 (ja) * 2012-11-09 2015-07-08 日東電工株式会社 光学表示パネルの連続製造方法および光学表示パネルの連続製造システム
JP6066055B2 (ja) * 2012-12-06 2017-01-25 Ａｉメカテック株式会社 有機ｅｌ封止装置
TWI596388B (zh) * 2013-01-10 2017-08-21 住友化學股份有限公司 光學部件貼合體之製造方法

Also Published As

Publication number Publication date
TW201605706A (zh) 2016-02-16
CN105321862B (zh) 2018-12-18
KR20160016592A (ko) 2016-02-15
TWI632099B (zh) 2018-08-11
CN105321862A (zh) 2016-02-10
WO2016017807A1 (ja) 2016-02-04
KR102374333B1 (ko) 2022-03-15
JP2016035507A (ja) 2016-03-17

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