TWI632099B - 可撓性薄膜構造的顯示單元及光學顯示單元以及單元母板之處理方法 - Google Patents

可撓性薄膜構造的顯示單元及光學顯示單元以及單元母板之處理方法 Download PDF

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TWI632099B
TWI632099B TW104117645A TW104117645A TWI632099B TW I632099 B TWI632099 B TW I632099B TW 104117645 A TW104117645 A TW 104117645A TW 104117645 A TW104117645 A TW 104117645A TW I632099 B TWI632099 B TW I632099B
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display unit
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substrate
carrier tape
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TW104117645A
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TW201605706A (zh
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中西多公歲
徐創矢
小塩智
村上奈穗
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日商日東電工股份有限公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H41/00—Machines for separating superposed webs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H5/00—Feeding articles separated from piles; Feeding articles to machines
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Feeding Of Articles By Means Other Than Belts Or Rollers (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
TW104117645A 2014-08-01 2015-06-01 可撓性薄膜構造的顯示單元及光學顯示單元以及單元母板之處理方法 TWI632099B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014158102A JP5954549B2 (ja) 2014-08-01 2014-08-01 可撓性薄膜構造の表示セルを取り扱う方法
JP2014-158102 2014-08-01

Publications (2)

Publication Number Publication Date
TW201605706A TW201605706A (zh) 2016-02-16
TWI632099B true TWI632099B (zh) 2018-08-11

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TW104117645A TWI632099B (zh) 2014-08-01 2015-06-01 可撓性薄膜構造的顯示單元及光學顯示單元以及單元母板之處理方法

Country Status (5)

Country Link
JP (1) JP5954549B2 (enExample)
KR (1) KR102374333B1 (enExample)
CN (1) CN105321862B (enExample)
TW (1) TWI632099B (enExample)
WO (1) WO2016017807A1 (enExample)

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JP2018072689A (ja) * 2016-11-01 2018-05-10 日東電工株式会社 光学的表示装置を製造する方法
CN106735880A (zh) * 2017-01-13 2017-05-31 武汉华星光电技术有限公司 一种柔性显示面板的切割方法及切割装置
JP6888812B2 (ja) * 2017-04-21 2021-06-16 淀川メデック株式会社 フレキシブルデバイスの製造装置及び製造方法
JP6393362B1 (ja) * 2017-04-25 2018-09-19 住友化学株式会社 有機デバイスの製造方法
JP6284670B1 (ja) * 2017-04-25 2018-02-28 住友化学株式会社 有機デバイスの製造方法
CN109427618A (zh) * 2017-08-31 2019-03-05 财团法人工业技术研究院 分离装置及分离方法
TWI710288B (zh) * 2020-01-22 2020-11-11 頎邦科技股份有限公司 電路板的散熱片貼合方法及其貼合裝置
CN113334467B (zh) * 2021-05-31 2022-09-30 深圳市聚飞光学材料有限公司 一种光学膜卷材加工方法及光学膜卷材

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JP2013118319A (ja) * 2011-12-05 2013-06-13 Shibaura Mechatronics Corp 電子部品の実装装置及び実装方法
TW201402407A (zh) * 2012-07-09 2014-01-16 Cando Corp 貼合取膜裝置及其方法
TW201408610A (zh) * 2012-07-02 2014-03-01 Corning Inc 處理玻璃基板的方法及玻璃裝置
JP2014056773A (ja) * 2012-09-13 2014-03-27 Sumitomo Chemical Co Ltd 光学部材貼合体の製造装置
TW201430408A (zh) * 2007-12-06 2014-08-01 Nitto Denko Corp 偏光板及圖像顯示裝置

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Publication number Priority date Publication date Assignee Title
JPH06312837A (ja) * 1993-04-30 1994-11-08 Ii M Techno:Kk 搬送装置
JP2006143453A (ja) * 2004-11-24 2006-06-08 Jptec Kk テープ貼付装置
TW201430408A (zh) * 2007-12-06 2014-08-01 Nitto Denko Corp 偏光板及圖像顯示裝置
TW201315593A (zh) * 2011-10-12 2013-04-16 Asahi Glass Co Ltd 電子裝置之製造方法、附樹脂層之載體基板之製造方法
JP2013118319A (ja) * 2011-12-05 2013-06-13 Shibaura Mechatronics Corp 電子部品の実装装置及び実装方法
TW201408610A (zh) * 2012-07-02 2014-03-01 Corning Inc 處理玻璃基板的方法及玻璃裝置
TW201402407A (zh) * 2012-07-09 2014-01-16 Cando Corp 貼合取膜裝置及其方法
JP2014056773A (ja) * 2012-09-13 2014-03-27 Sumitomo Chemical Co Ltd 光学部材貼合体の製造装置

Also Published As

Publication number Publication date
TW201605706A (zh) 2016-02-16
CN105321862B (zh) 2018-12-18
KR20160016592A (ko) 2016-02-15
CN105321862A (zh) 2016-02-10
WO2016017807A1 (ja) 2016-02-04
KR102374333B1 (ko) 2022-03-15
JP2016035507A (ja) 2016-03-17
JP5954549B2 (ja) 2016-07-20

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