CN105321862B - 处理挠性薄膜结构的显示元件的方法 - Google Patents

处理挠性薄膜结构的显示元件的方法 Download PDF

Info

Publication number
CN105321862B
CN105321862B CN201510390892.5A CN201510390892A CN105321862B CN 105321862 B CN105321862 B CN 105321862B CN 201510390892 A CN201510390892 A CN 201510390892A CN 105321862 B CN105321862 B CN 105321862B
Authority
CN
China
Prior art keywords
motherboard
conveying direction
display element
carrier band
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201510390892.5A
Other languages
English (en)
Chinese (zh)
Other versions
CN105321862A (zh
Inventor
中西多公岁
徐创矢
小盐智
村上奈穗
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of CN105321862A publication Critical patent/CN105321862A/zh
Application granted granted Critical
Publication of CN105321862B publication Critical patent/CN105321862B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H41/00—Machines for separating superposed webs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H5/00—Feeding articles separated from piles; Feeding articles to machines
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Optics & Photonics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Feeding Of Articles By Means Other Than Belts Or Rollers (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
CN201510390892.5A 2014-08-01 2015-07-06 处理挠性薄膜结构的显示元件的方法 Active CN105321862B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014158102A JP5954549B2 (ja) 2014-08-01 2014-08-01 可撓性薄膜構造の表示セルを取り扱う方法
JP2014-158102 2014-08-01

Publications (2)

Publication Number Publication Date
CN105321862A CN105321862A (zh) 2016-02-10
CN105321862B true CN105321862B (zh) 2018-12-18

Family

ID=55217701

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510390892.5A Active CN105321862B (zh) 2014-08-01 2015-07-06 处理挠性薄膜结构的显示元件的方法

Country Status (5)

Country Link
JP (1) JP5954549B2 (enExample)
KR (1) KR102374333B1 (enExample)
CN (1) CN105321862B (enExample)
TW (1) TWI632099B (enExample)
WO (1) WO2016017807A1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018072689A (ja) * 2016-11-01 2018-05-10 日東電工株式会社 光学的表示装置を製造する方法
CN106735880A (zh) * 2017-01-13 2017-05-31 武汉华星光电技术有限公司 一种柔性显示面板的切割方法及切割装置
JP6888812B2 (ja) * 2017-04-21 2021-06-16 淀川メデック株式会社 フレキシブルデバイスの製造装置及び製造方法
JP6393362B1 (ja) * 2017-04-25 2018-09-19 住友化学株式会社 有機デバイスの製造方法
JP6284670B1 (ja) * 2017-04-25 2018-02-28 住友化学株式会社 有機デバイスの製造方法
CN109427618A (zh) * 2017-08-31 2019-03-05 财团法人工业技术研究院 分离装置及分离方法
TWI710288B (zh) * 2020-01-22 2020-11-11 頎邦科技股份有限公司 電路板的散熱片貼合方法及其貼合裝置
CN113334467B (zh) * 2021-05-31 2022-09-30 深圳市聚飞光学材料有限公司 一种光学膜卷材加工方法及光学膜卷材

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06312837A (ja) * 1993-04-30 1994-11-08 Ii M Techno:Kk 搬送装置
KR101174834B1 (ko) * 2012-04-05 2012-08-17 주식회사 다보씨앤엠 공정필름을 이용한 필름형 디스플레이 기판의 제조방법 및 이에 사용되는 필름형 디스플레이 기판 제조용 공정필름
JP2014056773A (ja) * 2012-09-13 2014-03-27 Sumitomo Chemical Co Ltd 光学部材貼合体の製造装置

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS524200B2 (enExample) 1973-08-16 1977-02-02
US5448264A (en) 1991-03-15 1995-09-05 Hewlett-Packard Company Method and apparatus for separate window clipping and display mode planes in a graphics frame buffer
JP3574865B2 (ja) * 1999-11-08 2004-10-06 株式会社 日立インダストリイズ 基板の組立方法とその装置
JP2003029229A (ja) * 2001-07-12 2003-01-29 Sharp Corp 基板搬送用治具およびそれを用いた液晶表示素子の製造方法
JP4241203B2 (ja) * 2002-06-13 2009-03-18 東レ株式会社 可撓性フィルムのラミネート方法およびラミネート装置並びに回路基板の製造方法
JP2004114585A (ja) * 2002-09-27 2004-04-15 Toray Ind Inc 可撓性フィルムのラミネート方法およびラミネート装置
JP3799378B2 (ja) * 2003-01-27 2006-07-19 株式会社 日立インダストリイズ 基板の組立方法とその装置
JP4274325B2 (ja) * 2004-11-24 2009-06-03 Ｊｐテック株式会社 テープ貼付装置
JP4528923B2 (ja) 2005-12-05 2010-08-25 学校法人金沢工業大学 Ｅｌ素子
JP5112268B2 (ja) * 2007-12-06 2013-01-09 日東電工株式会社 画像表示装置の製造方法
CN102089858B (zh) 2008-02-20 2013-03-13 夏普株式会社 柔性半导体基板的制造方法
JP2010013250A (ja) 2008-07-04 2010-01-21 Asyst Technologies Japan Inc 搬送システム及びコンピュータプログラム
JP5418505B2 (ja) * 2009-02-03 2014-02-19 コニカミノルタ株式会社 有機エレクトロニクス素子及びその製造方法
JP4669087B1 (ja) * 2009-05-15 2011-04-13 日東電工株式会社 光学表示装置の製造システム及び製造方法
JP5010652B2 (ja) * 2009-08-19 2012-08-29 株式会社東芝 シート剥離装置および表示装置の製造方法
JP5737625B2 (ja) 2011-08-04 2015-06-17 大日本印刷株式会社 ガラスフィルム積層体、ガラスフィルム積層体ロール、カラーフィルタ用画素付ガラスフィルム積層体およびガラスフィルム積層体の製造方法
JP6016064B2 (ja) 2011-09-02 2016-10-26 日本電気硝子株式会社 高屈折率ガラス
JP5896669B2 (ja) 2011-09-27 2016-03-30 テルモ株式会社 シリンジ用プランジャー、シリンジおよびプレフィルドシリンジ
JP2013070787A (ja) 2011-09-27 2013-04-22 Equos Research Co Ltd 歩行支援装置
JP5796449B2 (ja) * 2011-10-12 2015-10-21 旭硝子株式会社 電子デバイスの製造方法、樹脂層付きキャリア基板の製造方法
JP2013118319A (ja) * 2011-12-05 2013-06-13 Shibaura Mechatronics Corp 電子部品の実装装置及び実装方法
JP5592587B2 (ja) * 2012-02-29 2014-09-17 住友化学株式会社 光学表示デバイスの生産システム及び光学表示デバイスの生産方法
CN104136968B (zh) * 2012-02-29 2018-01-09 住友化学株式会社 光学显示设备的生产系统以及光学显示设备的生产方法
WO2013165013A1 (ja) * 2012-05-02 2013-11-07 住友化学株式会社 光学表示デバイスの生産システム及び生産方法
KR101923261B1 (ko) * 2012-07-02 2018-11-28 코닝 인코포레이티드 유리 기판의 가공 방법 및 유리 장치
TWI529101B (zh) * 2012-07-09 2016-04-11 達鴻先進科技股份有限公司 貼合取膜裝置及其方法
KR102060541B1 (ko) * 2012-07-13 2019-12-31 삼성디스플레이 주식회사 표시 패널 제조 방법
JP5946362B2 (ja) * 2012-08-10 2016-07-06 日東電工株式会社 光学表示パネルの製造方法および光学表示パネルの製造システム
JP2014049486A (ja) * 2012-08-29 2014-03-17 Nitto Denko Corp 保護テープ剥離方法および保護テープ剥離装置
JP5744819B2 (ja) * 2012-11-09 2015-07-08 日東電工株式会社 光学表示パネルの連続製造方法および光学表示パネルの連続製造システム
JP6066055B2 (ja) * 2012-12-06 2017-01-25 Ａｉメカテック株式会社 有機ｅｌ封止装置
TWI596388B (zh) * 2013-01-10 2017-08-21 住友化學股份有限公司 光學部件貼合體之製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06312837A (ja) * 1993-04-30 1994-11-08 Ii M Techno:Kk 搬送装置
KR101174834B1 (ko) * 2012-04-05 2012-08-17 주식회사 다보씨앤엠 공정필름을 이용한 필름형 디스플레이 기판의 제조방법 및 이에 사용되는 필름형 디스플레이 기판 제조용 공정필름
JP2014056773A (ja) * 2012-09-13 2014-03-27 Sumitomo Chemical Co Ltd 光学部材貼合体の製造装置

Also Published As

Publication number Publication date
TW201605706A (zh) 2016-02-16
KR20160016592A (ko) 2016-02-15
TWI632099B (zh) 2018-08-11
CN105321862A (zh) 2016-02-10
WO2016017807A1 (ja) 2016-02-04
KR102374333B1 (ko) 2022-03-15
JP2016035507A (ja) 2016-03-17
JP5954549B2 (ja) 2016-07-20

Similar Documents

Publication Publication Date Title
CN105321862B (zh) 处理挠性薄膜结构的显示元件的方法
CN105321866B (zh) 向挠性薄膜结构的显示元件贴合光学功能膜的方法
CN105474293B (zh) 在光学显示单元贴合光学膜片材的方法
CN101910925B (zh) 用于连续制造液晶显示元件的方法与装置
JP2013139108A (ja) フィルム貼合装置
JP2011085632A (ja) 連続ウェブ形態の切込線入り光学フィルム積層体の連続ロール並びにその製造方法及び製造装置
KR20150104473A (ko) 필름 부착 시스템 및 필름 부착 방법
JP4415126B2 (ja) 積層フィルム貼合せ装置
CN105321835B (zh) 挠性薄膜结构的显示元件的光学检查方法及虚拟端子单元
KR102166696B1 (ko) 광학필름 라미네이팅 시스템 및 장치
WO2015029998A1 (ja) フィルム貼合装置、光学表示デバイスの生産システム及び光学表示デバイスの生産方法
WO2021026815A1 (zh) 薄膜处理系统以及撕膜装置的撕膜方法
WO2018084043A1 (ja) 光学的表示装置の積層体、その製造方法および製造システム
KR20120113817A (ko) 편광판 접합 장치 및 그 장치를 이용한 편광판 접합 방법

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant