JP5925961B2 - キャリア箔付銅箔、銅張積層板及びプリント配線板の製造方法 - Google Patents

キャリア箔付銅箔、銅張積層板及びプリント配線板の製造方法 Download PDF

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Publication number
JP5925961B2
JP5925961B2 JP2015516127A JP2015516127A JP5925961B2 JP 5925961 B2 JP5925961 B2 JP 5925961B2 JP 2015516127 A JP2015516127 A JP 2015516127A JP 2015516127 A JP2015516127 A JP 2015516127A JP 5925961 B2 JP5925961 B2 JP 5925961B2
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Prior art keywords
layer
copper
foil
carrier foil
copper foil
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Japanese (ja)
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JPWO2015151935A1 (ja
Inventor
裕昭 津吉
裕昭 津吉
眞 細川
眞 細川
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Mitsui Mining and Smelting Co Ltd
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Mitsui Mining and Smelting Co Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/18—Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials, e.g. fibre reinforced
    • B23K2103/166—Multilayered materials
    • B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/538—Roughness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/748—Releasability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Electrochemistry (AREA)
  • Laser Beam Processing (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Chemical Treatment Of Metals (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
JP2015516127A 2014-03-31 2015-03-24 キャリア箔付銅箔、銅張積層板及びプリント配線板の製造方法 Active JP5925961B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2014073432 2014-03-31
JP2014073432 2014-03-31
JP2014167806 2014-08-20
JP2014167806 2014-08-20
PCT/JP2015/058928 WO2015151935A1 (ja) 2014-03-31 2015-03-24 キャリア箔付銅箔、銅張積層板及びプリント配線板

Publications (2)

Publication Number Publication Date
JP5925961B2 true JP5925961B2 (ja) 2016-05-25
JPWO2015151935A1 JPWO2015151935A1 (ja) 2017-04-13

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Family Applications (1)

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JP2015516127A Active JP5925961B2 (ja) 2014-03-31 2015-03-24 キャリア箔付銅箔、銅張積層板及びプリント配線板の製造方法

Country Status (5)

Country Link
JP (1) JP5925961B2 (zh)
KR (1) KR101713505B1 (zh)
CN (1) CN106103082B (zh)
TW (1) TWI589433B (zh)
WO (1) WO2015151935A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020088716A1 (de) * 2018-11-02 2020-05-07 Klaus Faber AG VERFAHREN ZUR ELEKTRISCHEN MESSUNG UND VERWENDUNG EINER MESSTECHNIK ZUR BESTIMMUNG DES VERSCHLEIßZUSTANDES VON ELEKTRISCHEN LEITUNGEN, SOWIE KABELVERSCHLEIßZUSTANDSMESSVORRICHTUNG

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI616336B (zh) * 2016-03-03 2018-03-01 三井金屬鑛業股份有限公司 Method for manufacturing copper-clad laminate
JP2017199824A (ja) * 2016-04-28 2017-11-02 株式会社ジェイデバイス 半導体パッケージの製造方法
CN107475698B (zh) * 2017-06-23 2020-04-10 安庆师范大学 一种超薄铜箔剥离层Ni-Cr-B-P的制备方法
JP6962803B2 (ja) * 2017-12-11 2021-11-05 Ｄｏｗａホールディングス株式会社 クラッド材およびその製造方法
US10581081B1 (en) 2019-02-01 2020-03-03 Chang Chun Petrochemical Co., Ltd. Copper foil for negative electrode current collector of lithium ion secondary battery
WO2021001905A1 (ja) * 2019-07-01 2021-01-07 三菱電機株式会社 レーザ加工装置、レーザ加工方法、レーザ加工装置の制御装置および機械学習装置
JP2021014623A (ja) * 2019-07-12 2021-02-12 パナソニックＩｐマネジメント株式会社 金属基材付薄膜金属箔、金属張透明基材材料、透視型電極用積層板、及び透視型電極素材
US20230142375A1 (en) * 2019-10-25 2023-05-11 Namics Corporation Composite copper components
KR102454686B1 (ko) * 2020-12-30 2022-10-13 에스케이씨 주식회사 표면 처리 동박 및 이를 포함하는 회로 기판
WO2024043581A1 (ko) * 2022-08-24 2024-02-29 코오롱인더스트리 주식회사 절연 필름 및 이를 포함하는 적층체

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56153797A (en) * 1980-04-28 1981-11-27 Hitachi Chemical Co Ltd Method of manufacturing multilayer printed circuit board substrate
JPS6199596A (ja) * 1984-10-22 1986-05-17 Hitachi Ltd 基板の穴あけ方法
WO2000069238A1 (fr) * 1999-05-06 2000-11-16 Mitsui Mining & Smelting Co., Ltd. Carte imprimee double face et procede de fabrication de carte imprimee multicouche a trois ou plus de trois couches
JP2006022406A (ja) * 2000-09-22 2006-01-26 Furukawa Circuit Foil Kk キャリア付き極薄銅箔
JP2006249519A (ja) * 2005-03-11 2006-09-21 Hitachi Chem Co Ltd 銅の表面処理方法及び銅
JP2006312265A (ja) * 2005-05-09 2006-11-16 Furukawa Circuit Foil Kk キャリア付き極薄銅箔および該極薄銅箔を用いたプリント配線板、多層プリント配線板
JP2014053342A (ja) * 2012-09-05 2014-03-20 Mitsui Mining & Smelting Co Ltd プリント配線板の製造方法及びプリント配線板

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001068816A (ja) * 1999-08-24 2001-03-16 Mitsui Mining & Smelting Co Ltd 銅張積層板及びその銅張積層板を用いたレーザー加工方法
DE20015125U1 (de) * 2000-08-31 2000-12-07 Reitter & Schefenacker Gmbh Außenrückblickspiegel für Fahrzeuge, vorzugsweise für Kraftfahrzeuge
JP2004006612A (ja) * 2002-04-12 2004-01-08 Mitsui Mining & Smelting Co Ltd キャリア箔付銅箔及びそのキャリア箔付銅箔の製造方法並びにそのキャリア箔付銅箔を用いた銅張積層板
WO2014126193A1 (ja) * 2013-02-14 2014-08-21 三井金属鉱業株式会社 表面処理銅箔及び表面処理銅箔を用いて得られる銅張積層板
TWI587757B (zh) * 2013-09-20 2017-06-11 Mitsui Mining & Smelting Co Copper foil, copper foil with carrier foil, and copper clad laminate

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56153797A (en) * 1980-04-28 1981-11-27 Hitachi Chemical Co Ltd Method of manufacturing multilayer printed circuit board substrate
JPS6199596A (ja) * 1984-10-22 1986-05-17 Hitachi Ltd 基板の穴あけ方法
WO2000069238A1 (fr) * 1999-05-06 2000-11-16 Mitsui Mining & Smelting Co., Ltd. Carte imprimee double face et procede de fabrication de carte imprimee multicouche a trois ou plus de trois couches
JP2006022406A (ja) * 2000-09-22 2006-01-26 Furukawa Circuit Foil Kk キャリア付き極薄銅箔
JP2006249519A (ja) * 2005-03-11 2006-09-21 Hitachi Chem Co Ltd 銅の表面処理方法及び銅
JP2006312265A (ja) * 2005-05-09 2006-11-16 Furukawa Circuit Foil Kk キャリア付き極薄銅箔および該極薄銅箔を用いたプリント配線板、多層プリント配線板
JP2014053342A (ja) * 2012-09-05 2014-03-20 Mitsui Mining & Smelting Co Ltd プリント配線板の製造方法及びプリント配線板

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020088716A1 (de) * 2018-11-02 2020-05-07 Klaus Faber AG VERFAHREN ZUR ELEKTRISCHEN MESSUNG UND VERWENDUNG EINER MESSTECHNIK ZUR BESTIMMUNG DES VERSCHLEIßZUSTANDES VON ELEKTRISCHEN LEITUNGEN, SOWIE KABELVERSCHLEIßZUSTANDSMESSVORRICHTUNG

Also Published As

Publication number Publication date
KR20160095178A (ko) 2016-08-10
TWI589433B (zh) 2017-07-01
CN106103082A (zh) 2016-11-09
KR101713505B1 (ko) 2017-03-07
TW201605611A (zh) 2016-02-16
WO2015151935A1 (ja) 2015-10-08
JPWO2015151935A1 (ja) 2017-04-13
CN106103082B (zh) 2019-04-26

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