CN107475698B - 一种超薄铜箔剥离层Ni-Cr-B-P的制备方法 - Google Patents
一种超薄铜箔剥离层Ni-Cr-B-P的制备方法 Download PDFInfo
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- CN107475698B CN107475698B CN201710486690.XA CN201710486690A CN107475698B CN 107475698 B CN107475698 B CN 107475698B CN 201710486690 A CN201710486690 A CN 201710486690A CN 107475698 B CN107475698 B CN 107475698B
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- copper foil
- stripping layer
- sodium
- ultrathin copper
- plating
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/48—Coating with alloys
- C23C18/50—Coating with alloys with alloys based on iron, cobalt or nickel
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
- Laminated Bodies (AREA)
Abstract
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CN201710486690.XA CN107475698B (zh) | 2017-06-23 | 2017-06-23 | 一种超薄铜箔剥离层Ni-Cr-B-P的制备方法 |
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CN201710486690.XA CN107475698B (zh) | 2017-06-23 | 2017-06-23 | 一种超薄铜箔剥离层Ni-Cr-B-P的制备方法 |
Publications (2)
Publication Number | Publication Date |
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CN107475698A CN107475698A (zh) | 2017-12-15 |
CN107475698B true CN107475698B (zh) | 2020-04-10 |
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CN201710486690.XA Active CN107475698B (zh) | 2017-06-23 | 2017-06-23 | 一种超薄铜箔剥离层Ni-Cr-B-P的制备方法 |
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Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3930996B1 (en) * | 2019-02-28 | 2023-10-25 | Circuit Foil Luxembourg | Composite copper foil and method of fabricating the same |
CN115058711B (zh) * | 2022-06-17 | 2022-12-27 | 山东大学 | 一种易剥离的超薄载体铜箔的制备方法 |
CN115948773B (zh) * | 2023-01-04 | 2024-09-20 | 山东大学 | 一种基于晶态-非晶复合剥离层的超薄铜箔的制备方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2259106A1 (de) * | 1972-12-02 | 1974-06-20 | Langbein Pfanhauser Werke Ag | Verfahren zum metallisieren von kunstharzleiterplatten |
CN1050865C (zh) * | 1997-08-26 | 2000-03-29 | 北京科技大学 | 化学镀镍铬磷非晶态合金的溶液及其镀覆方法 |
WO2011067957A1 (ja) * | 2009-12-04 | 2011-06-09 | 三井金属鉱業株式会社 | 多孔質金属箔およびその製造方法 |
CN102296286B (zh) * | 2011-08-17 | 2013-06-19 | 程绍鹏 | 一种长效纳微米复合层合成液及其制备方法 |
WO2015151935A1 (ja) * | 2014-03-31 | 2015-10-08 | 三井金属鉱業株式会社 | キャリア箔付銅箔、銅張積層板及びプリント配線板 |
WO2015170715A1 (ja) * | 2014-05-07 | 2015-11-12 | 三井金属鉱業株式会社 | キャリア付銅箔、キャリア付銅箔の製造方法、キャリア付銅箔を用いて得られる銅張積層板及びプリント配線板 |
CN106498467B (zh) * | 2016-11-16 | 2018-09-11 | 山东金宝电子股份有限公司 | 一种可稳定剥离的超薄载体铜箔的制备方法 |
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Effective date of registration: 20200306 Address after: 246133 Anhui city of Anqing province Jixian Yixiu District Road No. 1318 Applicant after: Anqing Normal University Applicant after: Anhui Tong Guan Copper Foil company limited Address before: 246133 Anhui city of Anqing province Jixian Yixiu District Road No. 1318 Applicant before: Anqing Normal University |
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Address after: 246133 Anhui city of Anqing province Jixian Yixiu District Road No. 1318 Co-patentee after: Anhui Tongguan copper foil Group Co., Ltd Patentee after: ANQING NORMAL University Address before: 246133 Anhui city of Anqing province Jixian Yixiu District Road No. 1318 Co-patentee before: ANHUI TONGGUAN COPPER FOIL Co.,Ltd. Patentee before: ANQING NORMAL University |
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CP01 | Change in the name or title of a patent holder |