CN107475698A - 一种超薄铜箔剥离层Ni‑Cr‑B‑P的制备方法 - Google Patents
一种超薄铜箔剥离层Ni‑Cr‑B‑P的制备方法 Download PDFInfo
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- CN107475698A CN107475698A CN201710486690.XA CN201710486690A CN107475698A CN 107475698 A CN107475698 A CN 107475698A CN 201710486690 A CN201710486690 A CN 201710486690A CN 107475698 A CN107475698 A CN 107475698A
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- China
- Prior art keywords
- copper foil
- thin copper
- peel ply
- extra thin
- plating
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/48—Coating with alloys
- C23C18/50—Coating with alloys with alloys based on iron, cobalt or nickel
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
- Laminated Bodies (AREA)
Abstract
Description
Claims (3)
Priority Applications (1)
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CN201710486690.XA CN107475698B (zh) | 2017-06-23 | 2017-06-23 | 一种超薄铜箔剥离层Ni-Cr-B-P的制备方法 |
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CN201710486690.XA CN107475698B (zh) | 2017-06-23 | 2017-06-23 | 一种超薄铜箔剥离层Ni-Cr-B-P的制备方法 |
Publications (2)
Publication Number | Publication Date |
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CN107475698A true CN107475698A (zh) | 2017-12-15 |
CN107475698B CN107475698B (zh) | 2020-04-10 |
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CN201710486690.XA Active CN107475698B (zh) | 2017-06-23 | 2017-06-23 | 一种超薄铜箔剥离层Ni-Cr-B-P的制备方法 |
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CN (1) | CN107475698B (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020173574A1 (en) * | 2019-02-28 | 2020-09-03 | Circuit Foil Luxembourg | Composite copper foil and method of fabricating the same |
CN115058711A (zh) * | 2022-06-17 | 2022-09-16 | 山东大学 | 一种易剥离的超薄载体铜箔的制备方法 |
CN115948773A (zh) * | 2023-01-04 | 2023-04-11 | 山东大学 | 一种基于晶态-非晶复合剥离层的超薄铜箔的制备方法 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2259106A1 (de) * | 1972-12-02 | 1974-06-20 | Langbein Pfanhauser Werke Ag | Verfahren zum metallisieren von kunstharzleiterplatten |
CN1178259A (zh) * | 1997-08-26 | 1998-04-08 | 北京科技大学 | 化学镀镍铬磷非晶态合金的溶液及其镀覆方法 |
CN102296286A (zh) * | 2011-08-17 | 2011-12-28 | 程绍鹏 | 一种长效纳微米复合层合成液及其制备方法 |
CN104868128A (zh) * | 2009-12-04 | 2015-08-26 | 三井金属矿业株式会社 | 多孔金属箔及其制备方法 |
CN106103082A (zh) * | 2014-03-31 | 2016-11-09 | 三井金属矿业株式会社 | 带有载体箔的铜箔、覆铜层压板及印刷线路板 |
CN106460212A (zh) * | 2014-05-07 | 2017-02-22 | 三井金属矿业株式会社 | 带有载体的铜箔、带有载体的铜箔的制造方法、用该铜箔得到的覆铜层压板及印刷线路板 |
CN106498467A (zh) * | 2016-11-16 | 2017-03-15 | 山东金宝电子股份有限公司 | 一种可稳定剥离的超薄载体铜箔的制备方法 |
-
2017
- 2017-06-23 CN CN201710486690.XA patent/CN107475698B/zh active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2259106A1 (de) * | 1972-12-02 | 1974-06-20 | Langbein Pfanhauser Werke Ag | Verfahren zum metallisieren von kunstharzleiterplatten |
CN1178259A (zh) * | 1997-08-26 | 1998-04-08 | 北京科技大学 | 化学镀镍铬磷非晶态合金的溶液及其镀覆方法 |
CN104868128A (zh) * | 2009-12-04 | 2015-08-26 | 三井金属矿业株式会社 | 多孔金属箔及其制备方法 |
CN102296286A (zh) * | 2011-08-17 | 2011-12-28 | 程绍鹏 | 一种长效纳微米复合层合成液及其制备方法 |
CN106103082A (zh) * | 2014-03-31 | 2016-11-09 | 三井金属矿业株式会社 | 带有载体箔的铜箔、覆铜层压板及印刷线路板 |
CN106460212A (zh) * | 2014-05-07 | 2017-02-22 | 三井金属矿业株式会社 | 带有载体的铜箔、带有载体的铜箔的制造方法、用该铜箔得到的覆铜层压板及印刷线路板 |
CN106498467A (zh) * | 2016-11-16 | 2017-03-15 | 山东金宝电子股份有限公司 | 一种可稳定剥离的超薄载体铜箔的制备方法 |
Non-Patent Citations (1)
Title |
---|
闫洪: "《现代化学镀镍和复合镀新技术》", 28 February 1999, 国防工业出版社 * |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020173574A1 (en) * | 2019-02-28 | 2020-09-03 | Circuit Foil Luxembourg | Composite copper foil and method of fabricating the same |
CN111629525A (zh) * | 2019-02-28 | 2020-09-04 | 卢森堡电路箔片股份有限公司 | 复合铜箔及其制造方法 |
JP2020180366A (ja) * | 2019-02-28 | 2020-11-05 | サーキット フォイル ルクセンブルグ | 複合銅箔、プリント配線板、電子機器及び複合銅箔の製造方法 |
JP7012107B2 (ja) | 2019-02-28 | 2022-01-27 | サーキット フォイル ルクセンブルグ | 複合銅箔、プリント配線板、電子機器及び複合銅箔の製造方法 |
US20220127743A1 (en) * | 2019-02-28 | 2022-04-28 | Circuit Foil Luxembourg | Composite copper foil and method of fabricating the same |
US11639557B2 (en) * | 2019-02-28 | 2023-05-02 | Circuit Foil Luxembourg | Composite copper foil and method of fabricating the same |
CN111629525B (zh) * | 2019-02-28 | 2023-07-18 | 卢森堡电路箔片股份有限公司 | 复合铜箔及其制造方法 |
CN115058711A (zh) * | 2022-06-17 | 2022-09-16 | 山东大学 | 一种易剥离的超薄载体铜箔的制备方法 |
CN115058711B (zh) * | 2022-06-17 | 2022-12-27 | 山东大学 | 一种易剥离的超薄载体铜箔的制备方法 |
CN115948773A (zh) * | 2023-01-04 | 2023-04-11 | 山东大学 | 一种基于晶态-非晶复合剥离层的超薄铜箔的制备方法 |
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Effective date of registration: 20200306 Address after: 246133 Anhui city of Anqing province Jixian Yixiu District Road No. 1318 Applicant after: Anqing Normal University Applicant after: Anhui Tong Guan Copper Foil company limited Address before: 246133 Anhui city of Anqing province Jixian Yixiu District Road No. 1318 Applicant before: Anqing Normal University |
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Address after: 246133 Anhui city of Anqing province Jixian Yixiu District Road No. 1318 Co-patentee after: Anhui Tongguan copper foil Group Co., Ltd Patentee after: ANQING NORMAL University Address before: 246133 Anhui city of Anqing province Jixian Yixiu District Road No. 1318 Co-patentee before: ANHUI TONGGUAN COPPER FOIL Co.,Ltd. Patentee before: ANQING NORMAL University |