JP5895504B2 - 撮像パネルおよび撮像処理システム - Google Patents
撮像パネルおよび撮像処理システム Download PDFInfo
- Publication number
- JP5895504B2 JP5895504B2 JP2011274780A JP2011274780A JP5895504B2 JP 5895504 B2 JP5895504 B2 JP 5895504B2 JP 2011274780 A JP2011274780 A JP 2011274780A JP 2011274780 A JP2011274780 A JP 2011274780A JP 5895504 B2 JP5895504 B2 JP 5895504B2
- Authority
- JP
- Japan
- Prior art keywords
- light receiving
- light
- wiring layer
- unit
- receiving unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
- G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
- G01T1/16—Measuring radiation intensity
- G01T1/20—Measuring radiation intensity with scintillation detectors
- G01T1/2006—Measuring radiation intensity with scintillation detectors using a combination of a scintillator and photodetector which measures the means radiation intensity
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
- G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
- G01T1/16—Measuring radiation intensity
- G01T1/20—Measuring radiation intensity with scintillation detectors
- G01T1/2018—Scintillation-photodiode combinations
- G01T1/20185—Coupling means between the photodiode and the scintillator, e.g. optical couplings using adhesives with wavelength-shifting fibres
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
- G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
- G01T1/16—Measuring radiation intensity
- G01T1/20—Measuring radiation intensity with scintillation detectors
- G01T1/2018—Scintillation-photodiode combinations
- G01T1/20188—Auxiliary details, e.g. casings or cooling
- G01T1/2019—Shielding against direct hits
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
- G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
- G01T1/16—Measuring radiation intensity
- G01T1/20—Measuring radiation intensity with scintillation detectors
- G01T1/202—Measuring radiation intensity with scintillation detectors the detector being a crystal
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
- G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
- G01T1/16—Measuring radiation intensity
- G01T1/20—Measuring radiation intensity with scintillation detectors
- G01T1/202—Measuring radiation intensity with scintillation detectors the detector being a crystal
- G01T1/2023—Selection of materials
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
- G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
- G01T1/16—Measuring radiation intensity
- G01T1/24—Measuring radiation intensity with semiconductor detectors
- G01T1/247—Detector read-out circuitry
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/18—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
- H10F39/189—X-ray, gamma-ray or corpuscular radiation imagers
- H10F39/1898—Indirect radiation image sensors, e.g. using luminescent members
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/811—Interconnections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Physics & Mathematics (AREA)
- High Energy & Nuclear Physics (AREA)
- Molecular Biology (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Measurement Of Radiation (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Light Receiving Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Priority Applications (8)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011274780A JP5895504B2 (ja) | 2011-12-15 | 2011-12-15 | 撮像パネルおよび撮像処理システム |
| US14/362,240 US9164182B2 (en) | 2011-12-15 | 2012-12-07 | Image pickup panel and image pickup processing system |
| KR1020147015137A KR102090343B1 (ko) | 2011-12-15 | 2012-12-07 | 촬상 패널 |
| CN201280060473.XA CN103988306B (zh) | 2011-12-15 | 2012-12-07 | 图像拾取面板和图像拾取处理系统 |
| PCT/JP2012/082436 WO2013089209A2 (en) | 2011-12-15 | 2012-12-07 | Image pickup panel and image pickup processing system |
| TW101146436A TWI491058B (zh) | 2011-12-15 | 2012-12-10 | 影像拾取面板及影像拾取處理系統 |
| US14/818,518 US9651683B2 (en) | 2011-12-15 | 2015-08-05 | Image pickup panel and image pickup processing system |
| US15/450,524 US10663604B2 (en) | 2011-12-15 | 2017-03-06 | Image pickup panel and image pickup processing system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011274780A JP5895504B2 (ja) | 2011-12-15 | 2011-12-15 | 撮像パネルおよび撮像処理システム |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013124976A JP2013124976A (ja) | 2013-06-24 |
| JP2013124976A5 JP2013124976A5 (enExample) | 2014-12-04 |
| JP5895504B2 true JP5895504B2 (ja) | 2016-03-30 |
Family
ID=47844421
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011274780A Active JP5895504B2 (ja) | 2011-12-15 | 2011-12-15 | 撮像パネルおよび撮像処理システム |
Country Status (6)
| Country | Link |
|---|---|
| US (3) | US9164182B2 (enExample) |
| JP (1) | JP5895504B2 (enExample) |
| KR (1) | KR102090343B1 (enExample) |
| CN (1) | CN103988306B (enExample) |
| TW (1) | TWI491058B (enExample) |
| WO (1) | WO2013089209A2 (enExample) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5895504B2 (ja) | 2011-12-15 | 2016-03-30 | ソニー株式会社 | 撮像パネルおよび撮像処理システム |
| JP6352687B2 (ja) * | 2013-08-28 | 2018-07-04 | ソニーセミコンダクタソリューションズ株式会社 | 放射線検出器およびその製造方法、撮像装置、ならびに撮像表示システム |
| WO2016132764A1 (ja) * | 2015-02-19 | 2016-08-25 | ソニー株式会社 | 放射線検出器、放射線検出器の製造方法および撮像装置 |
| JP2017009725A (ja) * | 2015-06-19 | 2017-01-12 | ソニー株式会社 | 表示装置 |
| WO2017041221A1 (en) * | 2015-09-08 | 2017-03-16 | Shenzhen Xpectvision Technology Co., Ltd. | Methods for making an x-ray detector |
| US11018180B2 (en) | 2015-10-09 | 2021-05-25 | Shenzhen Xpectvision Technology Co., Ltd. | Packaging methods of semiconductor x-ray detectors |
| US10192646B2 (en) * | 2016-04-25 | 2019-01-29 | General Electric Company | Radiation shielding system |
| CN109416406B (zh) * | 2016-07-05 | 2023-06-20 | 深圳帧观德芯科技有限公司 | 具有不同热膨胀系数的接合材料 |
| TWI613804B (zh) * | 2017-09-04 | 2018-02-01 | 友達光電股份有限公司 | 光感測裝置 |
| DE102018200845B4 (de) * | 2018-01-19 | 2021-05-06 | Siemens Healthcare Gmbh | Montageverfahren für die Herstellung eines Röntgendetektors, Röntgendetektor und Röntgengerät |
| JP2019191018A (ja) * | 2018-04-26 | 2019-10-31 | ソニー株式会社 | 測距装置及び測距モジュール |
| CN111134705B (zh) * | 2020-01-21 | 2023-10-13 | 上海奕瑞光电子科技股份有限公司 | 一种放射线图像探测器及其制作方法 |
| US20230147897A1 (en) * | 2021-11-09 | 2023-05-11 | Innocare Optoelectronics Corporation | Detection device |
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| JPS63262580A (ja) * | 1987-04-21 | 1988-10-28 | Toshiba Corp | X線検出器 |
| AU1983199A (en) * | 1999-01-21 | 2000-08-07 | Hamamatsu Photonics K.K. | Electron tube |
| JP2000253313A (ja) | 1999-02-26 | 2000-09-14 | Konica Corp | X線撮像パネルおよびその製造方法 |
| JP2001027673A (ja) * | 1999-07-15 | 2001-01-30 | Hitachi Medical Corp | X線検出器及びこれを用いるx線ct装置 |
| AU6022400A (en) * | 1999-07-23 | 2001-02-13 | Nikon Corporation | Exposure method, exposure system, light source, and method of device manufacture |
| JP2001318155A (ja) * | 2000-02-28 | 2001-11-16 | Toshiba Corp | 放射線検出器、およびx線ct装置 |
| US6901159B2 (en) * | 2001-01-31 | 2005-05-31 | General Electric Company | Communication of image data from image detector to host computer |
| US6828545B1 (en) * | 2001-05-15 | 2004-12-07 | Raytheon Company | Hybrid microelectronic array structure having electrically isolated supported islands, and its fabrication |
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| GB2426576A (en) | 2005-05-27 | 2006-11-29 | Sensl Technologies Ltd | Light sensor module comprising a plurality of elements in a close-tiled arrangement |
| TWI429066B (zh) * | 2005-06-02 | 2014-03-01 | 新力股份有限公司 | Semiconductor image sensor module and manufacturing method thereof |
| JP4865291B2 (ja) * | 2005-10-11 | 2012-02-01 | 株式会社日立メディコ | X線撮像装置 |
| JP2007228347A (ja) * | 2006-02-24 | 2007-09-06 | Mitsubishi Electric Corp | 真空パッケージおよびその製造方法 |
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| JP2008200358A (ja) * | 2007-02-21 | 2008-09-04 | Konica Minolta Medical & Graphic Inc | X線撮影システム、プログラム及びx線撮影方法 |
| RU2472180C2 (ru) * | 2007-04-12 | 2013-01-10 | Конинклейке Филипс Электроникс Н.В. | Уменьшение эффектов захвата в сцинтилляторе за счет применения вторичного излучения |
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| JP2013005017A (ja) | 2011-06-13 | 2013-01-07 | Sony Corp | 撮像装置、および撮像装置制御方法、並びにプログラム |
| US8798229B2 (en) * | 2011-09-30 | 2014-08-05 | General Electric Company | Detector modules and methods of manufacturing |
| JP5935284B2 (ja) | 2011-10-18 | 2016-06-15 | ソニー株式会社 | 撮像装置および撮像表示システム |
| JP5935285B2 (ja) | 2011-10-19 | 2016-06-15 | ソニー株式会社 | 撮像装置および撮像表示システム |
| JP5935286B2 (ja) | 2011-10-19 | 2016-06-15 | ソニー株式会社 | 撮像装置および撮像表示システム |
| JP5935287B2 (ja) | 2011-10-21 | 2016-06-15 | ソニー株式会社 | 撮像装置および撮像表示システム |
| JP5935291B2 (ja) | 2011-11-01 | 2016-06-15 | ソニー株式会社 | 撮像装置および撮像表示システム |
| JP5935293B2 (ja) | 2011-11-02 | 2016-06-15 | ソニー株式会社 | 撮像装置および撮像表示システム |
| JP5895504B2 (ja) | 2011-12-15 | 2016-03-30 | ソニー株式会社 | 撮像パネルおよび撮像処理システム |
| JP2013150167A (ja) | 2012-01-19 | 2013-08-01 | Sony Corp | 撮像装置、色補正方法、および色補正プログラム |
| JP5999921B2 (ja) | 2012-02-24 | 2016-09-28 | ソニーセミコンダクタソリューションズ株式会社 | 撮像装置および撮像表示システム |
| JP5895650B2 (ja) | 2012-03-28 | 2016-03-30 | ソニー株式会社 | 撮像装置および撮像表示システム |
| CN107529624A (zh) * | 2012-05-22 | 2018-01-02 | Analogic公司 | 计算机断层照相检测器、方法及设备 |
| US9835733B2 (en) * | 2015-04-30 | 2017-12-05 | Zhengrong Ying | Apparatus for detecting X-rays |
-
2011
- 2011-12-15 JP JP2011274780A patent/JP5895504B2/ja active Active
-
2012
- 2012-12-07 CN CN201280060473.XA patent/CN103988306B/zh not_active Expired - Fee Related
- 2012-12-07 KR KR1020147015137A patent/KR102090343B1/ko not_active Expired - Fee Related
- 2012-12-07 WO PCT/JP2012/082436 patent/WO2013089209A2/en not_active Ceased
- 2012-12-07 US US14/362,240 patent/US9164182B2/en active Active
- 2012-12-10 TW TW101146436A patent/TWI491058B/zh not_active IP Right Cessation
-
2015
- 2015-08-05 US US14/818,518 patent/US9651683B2/en active Active
-
2017
- 2017-03-06 US US15/450,524 patent/US10663604B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| US9651683B2 (en) | 2017-05-16 |
| CN103988306A (zh) | 2014-08-13 |
| CN103988306B (zh) | 2017-03-08 |
| US9164182B2 (en) | 2015-10-20 |
| US20140326892A1 (en) | 2014-11-06 |
| TWI491058B (zh) | 2015-07-01 |
| US20170219722A1 (en) | 2017-08-03 |
| KR102090343B1 (ko) | 2020-03-17 |
| WO2013089209A2 (en) | 2013-06-20 |
| US20160033655A1 (en) | 2016-02-04 |
| US10663604B2 (en) | 2020-05-26 |
| JP2013124976A (ja) | 2013-06-24 |
| WO2013089209A3 (en) | 2013-08-15 |
| TW201330303A (zh) | 2013-07-16 |
| KR20140113638A (ko) | 2014-09-24 |
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