JP5888465B2 - 半導体装置とその製造方法 - Google Patents
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- 239000004065 semiconductor Substances 0.000 title claims description 217
- 238000004519 manufacturing process Methods 0.000 title claims description 17
- 239000004020 conductor Substances 0.000 claims description 62
- 239000012535 impurity Substances 0.000 claims description 51
- 239000000758 substrate Substances 0.000 claims description 26
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 25
- 229920005591 polysilicon Polymers 0.000 claims description 24
- 238000000034 method Methods 0.000 claims description 18
- 230000005684 electric field Effects 0.000 description 34
- 150000002500 ions Chemical class 0.000 description 17
- 239000000969 carrier Substances 0.000 description 9
- 230000015556 catabolic process Effects 0.000 description 9
- 230000000694 effects Effects 0.000 description 8
- 238000001514 detection method Methods 0.000 description 7
- 238000009792 diffusion process Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 230000007423 decrease Effects 0.000 description 5
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- 238000011109 contamination Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000005040 ion trap Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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- H01L29/739—Transistor-type devices, i.e. able to continuously respond to applied control signals controlled by field-effect, e.g. bipolar static induction transistors [BSIT]
- H01L29/7393—Insulated gate bipolar mode transistors, i.e. IGBT; IGT; COMFET
- H01L29/7395—Vertical transistors, e.g. vertical IGBT
- H01L29/7396—Vertical transistors, e.g. vertical IGBT with a non planar surface, e.g. with a non planar gate or with a trench or recess or pillar in the surface of the emitter, base or collector region for improving current density or short circuiting the emitter and base regions
- H01L29/7397—Vertical transistors, e.g. vertical IGBT with a non planar surface, e.g. with a non planar gate or with a trench or recess or pillar in the surface of the emitter, base or collector region for improving current density or short circuiting the emitter and base regions and a gate structure lying on a slanted or vertical surface or formed in a groove, e.g. trench gate IGBT
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Description
Claims (6)
- 半導体装置の基板の平面視において、半導体素子が形成されている活性領域を囲んでいる複数のフィールドリミティングリングと、
前記基板の主面上に設けられており、複数のフィールドリミティングリングを覆っている絶縁層と、
前記絶縁層内に設けられており、前記活性領域を囲んでおり、前記フィールドリミティングリングと平行な半導体層と、
を備えており、
前記半導体層は、リサーフ条件の面密度よりも低い面密度で不純物を含んでいるとともに、平面視において、隣接する前記フィールドリミティングリングの間の範囲(リング間範囲)の一部とオーバーラップしており、リング間範囲の残部とオーバーラップしていないことを特徴とする半導体装置。 - 平面視において、前記半導体層は、
一つのフィールドリミティングリングと対向するとともに、一つのフィールドリミティングリングに隣接するリング間範囲の上方まで伸びており、
前記リング間範囲とオーバーラップする部分に、リサーフ条件の面密度よりも低い面密度で不純物を含む低面密度領域を有するとともに、前記一つのフィールドリミティングリングと対向する部分に、リサーフ条件の面密度よりも高い面密度で不純物を含む高面密度領域を有する、ことを特徴とする請求項1に記載の半導体装置。 - 前記半導体層が前記一つのフィールドリミティングリングと導通していることを特徴とする請求項2に記載の半導体装置。
- 前記絶縁層内に形成されており、一つのフィールドリミティングリングに対向するとともに活性領域を囲んでいる導体層をさらに備えており、
前記半導体層が、前記一つのフィールドリミティングリング、及び、前記導体層よりも隣接するフィールドリミティングリングの近くまで伸びている、
ことを特徴とする請求項1に記載の半導体装置。 - 前記半導体層と前記導体層と一つのフィールドリミティングリングが導通していることを特徴とする請求項4に記載の半導体装置。
- 請求項4又は5に記載の半導体装置の製造方法であり、
基板にトレンチゲートを形成するのと同時に前記導体層を形成する工程と、
基板に温度検出用の素子のベースとなるポリシリコン層を形成するのと同時に半導体層のベースとなるポリシリコン層を形成する工程と、
を含むことを特徴とする半導体装置の製造方法。
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PCT/JP2013/053724 WO2014125626A1 (ja) | 2013-02-15 | 2013-02-15 | 半導体装置とその製造方法 |
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US (1) | US9412809B2 (ja) |
JP (1) | JP5888465B2 (ja) |
CN (1) | CN104995736B (ja) |
DE (1) | DE112013006681B4 (ja) |
WO (1) | WO2014125626A1 (ja) |
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US11798997B2 (en) | 2021-03-19 | 2023-10-24 | Kabushiki Kaisha Toshiba | Semiconductor device |
Families Citing this family (8)
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CN106489208B (zh) | 2015-01-29 | 2019-11-01 | 富士电机株式会社 | 半导体装置 |
JP6287958B2 (ja) * | 2015-05-27 | 2018-03-07 | トヨタ自動車株式会社 | 半導体装置 |
JP6834156B2 (ja) * | 2016-03-16 | 2021-02-24 | 富士電機株式会社 | 半導体装置および製造方法 |
JP2018067690A (ja) | 2016-10-21 | 2018-04-26 | トヨタ自動車株式会社 | 半導体装置とその製造方法 |
JP2018186142A (ja) * | 2017-04-25 | 2018-11-22 | 株式会社村田製作所 | 半導体装置 |
JP7268330B2 (ja) * | 2018-11-05 | 2023-05-08 | 富士電機株式会社 | 半導体装置および製造方法 |
WO2023154046A1 (en) * | 2022-02-10 | 2023-08-17 | Vishay Siliconix Llc | Adaptive edge termination by design for efficient and rugged high voltage silicon carbide power device |
CN117116974A (zh) * | 2023-08-31 | 2023-11-24 | 海信家电集团股份有限公司 | 半导体装置 |
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JPH11330496A (ja) * | 1998-05-07 | 1999-11-30 | Hitachi Ltd | 半導体装置 |
JP2001217420A (ja) * | 2000-02-01 | 2001-08-10 | Mitsubishi Electric Corp | 半導体装置 |
JP2002231944A (ja) * | 2001-01-31 | 2002-08-16 | Sanken Electric Co Ltd | 電力用半導体装置 |
JP2005093550A (ja) * | 2003-09-12 | 2005-04-07 | Toshiba Corp | 半導体装置 |
JP2013012568A (ja) * | 2011-06-29 | 2013-01-17 | Mitsubishi Electric Corp | 半導体装置およびその製造方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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US11798997B2 (en) | 2021-03-19 | 2023-10-24 | Kabushiki Kaisha Toshiba | Semiconductor device |
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CN104995736A (zh) | 2015-10-21 |
DE112013006681B4 (de) | 2022-01-20 |
CN104995736B (zh) | 2018-03-30 |
DE112013006681T5 (de) | 2015-10-29 |
US20150364541A1 (en) | 2015-12-17 |
WO2014125626A1 (ja) | 2014-08-21 |
JPWO2014125626A1 (ja) | 2017-02-02 |
US9412809B2 (en) | 2016-08-09 |
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