JP5886224B2 - 基板洗浄方法 - Google Patents

基板洗浄方法 Download PDF

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Publication number
JP5886224B2
JP5886224B2 JP2013041494A JP2013041494A JP5886224B2 JP 5886224 B2 JP5886224 B2 JP 5886224B2 JP 2013041494 A JP2013041494 A JP 2013041494A JP 2013041494 A JP2013041494 A JP 2013041494A JP 5886224 B2 JP5886224 B2 JP 5886224B2
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JP
Japan
Prior art keywords
substrate
cleaning
roll
area
cleaning liquid
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Active
Application number
JP2013041494A
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English (en)
Japanese (ja)
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JP2014003273A5 (https=
JP2014003273A (ja
Inventor
知淳 石橋
知淳 石橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to JP2013041494A priority Critical patent/JP5886224B2/ja
Priority to TW102115659A priority patent/TWI493614B/zh
Priority to US13/894,331 priority patent/US8932407B2/en
Priority to KR1020130055792A priority patent/KR20130131232A/ko
Priority to CN2013101935844A priority patent/CN103418558A/zh
Publication of JP2014003273A publication Critical patent/JP2014003273A/ja
Publication of JP2014003273A5 publication Critical patent/JP2014003273A5/ja
Application granted granted Critical
Publication of JP5886224B2 publication Critical patent/JP5886224B2/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H10P70/23—Cleaning during device manufacture during, before or after processing of insulating materials
    • H10P70/237—Cleaning during device manufacture during, before or after processing of insulating materials the processing being a planarisation of insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/27—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using selective deposition, e.g. simultaneous growth of monocrystalline and non-monocrystalline semiconductor materials
    • H10P14/276—Lateral overgrowth
    • H10P14/278—Pendeoepitaxy
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H10P70/27—Cleaning during device manufacture during, before or after processing of conductive materials, e.g. polysilicon or amorphous silicon layers
    • H10P70/277—Cleaning during device manufacture during, before or after processing of conductive materials, e.g. polysilicon or amorphous silicon layers the processing being a planarisation of conductive layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • B08B1/34—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members rotating about an axis parallel to the surface
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/60—Cleaning only by mechanical processes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2013041494A 2012-05-23 2013-03-04 基板洗浄方法 Active JP5886224B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2013041494A JP5886224B2 (ja) 2012-05-23 2013-03-04 基板洗浄方法
TW102115659A TWI493614B (zh) 2012-05-23 2013-05-02 Substrate cleaning method
US13/894,331 US8932407B2 (en) 2012-05-23 2013-05-14 Substrate cleaning method
KR1020130055792A KR20130131232A (ko) 2012-05-23 2013-05-16 기판 세정 방법
CN2013101935844A CN103418558A (zh) 2012-05-23 2013-05-22 基板清洗方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012117344 2012-05-23
JP2012117344 2012-05-23
JP2013041494A JP5886224B2 (ja) 2012-05-23 2013-03-04 基板洗浄方法

Publications (3)

Publication Number Publication Date
JP2014003273A JP2014003273A (ja) 2014-01-09
JP2014003273A5 JP2014003273A5 (https=) 2015-10-01
JP5886224B2 true JP5886224B2 (ja) 2016-03-16

Family

ID=49620627

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013041494A Active JP5886224B2 (ja) 2012-05-23 2013-03-04 基板洗浄方法

Country Status (5)

Country Link
US (1) US8932407B2 (https=)
JP (1) JP5886224B2 (https=)
KR (1) KR20130131232A (https=)
CN (1) CN103418558A (https=)
TW (1) TWI493614B (https=)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD735427S1 (en) * 2013-02-01 2015-07-28 Ebara Corporation Roller shaft for substrate cleaning
USD728177S1 (en) * 2013-02-01 2015-04-28 Ebara Corporation Roller shaft for substrate cleaning
TWI664672B (zh) * 2013-07-03 2019-07-01 Ebara Corporation 基板洗淨裝置及基板洗淨方法
CN104971916B (zh) * 2014-04-01 2020-07-07 株式会社荏原制作所 清洗装置及清洗方法
JP6600470B2 (ja) 2014-04-01 2019-10-30 株式会社荏原製作所 洗浄装置及び洗浄方法
US9475272B2 (en) 2014-10-09 2016-10-25 Taiwan Semiconductor Manufacturing Company, Ltd. De-bonding and cleaning process and system
JP7018768B2 (ja) * 2014-11-24 2022-02-14 コーニング インコーポレイテッド 基板表面洗浄方法および装置
CN104907300B (zh) * 2015-06-01 2017-04-26 常州兆阳能源科技有限公司 太阳能电池板的高效清洗系统
JP6646460B2 (ja) * 2016-02-15 2020-02-14 株式会社荏原製作所 基板洗浄装置及び基板処理装置
JP6609197B2 (ja) * 2016-02-25 2019-11-20 株式会社ディスコ 洗浄装置
JP6718714B2 (ja) 2016-03-25 2020-07-08 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
KR102573572B1 (ko) * 2017-12-20 2023-09-01 삼성전자주식회사 웨이퍼 세정 장치
US20200276619A1 (en) * 2019-02-04 2020-09-03 Ebara Corporation Cleaning member attaching part, cleaning member assembly and substrate cleaning apparatus
CN111085485B (zh) * 2019-12-26 2021-02-09 海盐宝仕龙塑业股份有限公司 一种板材的表面处理系统
CN112268211B (zh) * 2020-10-27 2022-05-10 沧州诚效通信器材有限公司 一种智能无线通信设备支撑固定方法
KR20230173091A (ko) 2021-04-21 2023-12-26 신에쯔 한도타이 가부시키가이샤 웨이퍼의 세정방법 및 세정처리장치
CN120311276A (zh) * 2024-01-12 2025-07-15 盛美半导体设备(上海)股份有限公司 电镀装置及基板清洁方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61152392A (ja) * 1984-12-25 1986-07-11 武藤工業株式会社 長尺状用紙の切断方法及び装置
JPH04363022A (ja) * 1991-06-06 1992-12-15 Enya Syst:Kk 貼付板洗浄装置
JP2647050B2 (ja) * 1995-03-31 1997-08-27 日本電気株式会社 ウェハ研磨装置
JP2887095B2 (ja) 1995-08-31 1999-04-26 芝浦メカトロニクス株式会社 洗浄装置
JP2002043267A (ja) * 2000-07-21 2002-02-08 Ebara Corp 基板洗浄装置、基板洗浄方法及び基板処理装置
JP2003077876A (ja) 2001-08-30 2003-03-14 Matsushita Electric Ind Co Ltd 洗浄装置及び洗浄方法
JP2003142444A (ja) * 2001-10-31 2003-05-16 Applied Materials Inc 洗浄装置
US6733596B1 (en) * 2002-12-23 2004-05-11 Lam Research Corporation Substrate cleaning brush preparation sequence, method, and system
US6951042B1 (en) * 2003-02-28 2005-10-04 Lam Research Corporation Brush scrubbing-high frequency resonating wafer processing system and methods for making and implementing the same
US7353560B2 (en) * 2003-12-18 2008-04-08 Lam Research Corporation Proximity brush unit apparatus and method
US8608858B2 (en) * 2004-09-28 2013-12-17 Ebara Corporation Substrate cleaning apparatus and method for determining timing of replacement of cleaning member
JP4387938B2 (ja) * 2004-12-27 2009-12-24 大日本スクリーン製造株式会社 基板処理装置
JP2008226349A (ja) * 2007-03-13 2008-09-25 Showa Denko Kk 円盤状基板の製造方法、洗浄装置
JP2008311481A (ja) * 2007-06-15 2008-12-25 Sony Corp 基板洗浄方法、基板洗浄装置及び半導体製造方法
JP2010212295A (ja) * 2009-03-06 2010-09-24 Elpida Memory Inc 基板洗浄装置および基板洗浄方法
JP2010278103A (ja) 2009-05-27 2010-12-09 Sumitomo Metal Mining Co Ltd スクラブ洗浄装置
JP2011165751A (ja) * 2010-02-05 2011-08-25 Toshiba Corp 洗浄装置及び半導体装置の製造方法
JP2011233646A (ja) * 2010-04-26 2011-11-17 Sumitomo Metal Mining Co Ltd 半導体用基板の洗浄方法

Also Published As

Publication number Publication date
US20130312790A1 (en) 2013-11-28
KR20130131232A (ko) 2013-12-03
US8932407B2 (en) 2015-01-13
TW201349323A (zh) 2013-12-01
CN103418558A (zh) 2013-12-04
JP2014003273A (ja) 2014-01-09
TWI493614B (zh) 2015-07-21

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