JP5645752B2 - 基板洗浄方法及びロール洗浄部材 - Google Patents
基板洗浄方法及びロール洗浄部材 Download PDFInfo
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- JP5645752B2 JP5645752B2 JP2011116690A JP2011116690A JP5645752B2 JP 5645752 B2 JP5645752 B2 JP 5645752B2 JP 2011116690 A JP2011116690 A JP 2011116690A JP 2011116690 A JP2011116690 A JP 2011116690A JP 5645752 B2 JP5645752 B2 JP 5645752B2
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- 238000004140 cleaning Methods 0.000 title claims description 411
- 239000000758 substrate Substances 0.000 title claims description 260
- 238000000034 method Methods 0.000 title claims description 27
- 239000007788 liquid Substances 0.000 claims description 22
- 230000002093 peripheral effect Effects 0.000 claims description 19
- 238000009826 distribution Methods 0.000 claims description 11
- 238000005201 scrubbing Methods 0.000 claims description 4
- 238000007790 scraping Methods 0.000 claims description 3
- 230000007547 defect Effects 0.000 description 17
- 230000000052 comparative effect Effects 0.000 description 10
- 238000011109 contamination Methods 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 230000004888 barrier function Effects 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000005498 polishing Methods 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000011538 cleaning material Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
- H01L21/02068—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers
- H01L21/02074—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers the processing being a planarization of conductive layers
Description
図1は、本発明の基板洗浄方法に使用されるスクラブ洗浄装置の一例を示す概要図である。図1に示すように、このスクラブ洗浄装置は、表面を上にして半導体ウエハ等の基板Wの周縁部を支持し基板Wを水平回転させる、水平方向に移動自在な複数本(図では4本)のスピンドル10と、スピンドル10で支持して回転させる基板Wの上方に昇降自在に配置される上部ロールホルダ12と、スピンドル10で支持して回転させる基板Wの下方に昇降自在に配置される下部ロールホルダ14を備えている。
12 上部ロールホルダ
14 下部ロールホルダ
16 上部ロール洗浄部材(ロールスポンジ)
16a ノジュール
16b 螺旋溝
18 下部ロール洗浄部材(ロールスポンジ)
24 コマ
30 洗浄エリア
32 順方向洗浄エリア
34 逆方向洗浄エリア
Lf 順方向洗浄エリアの長さ
Li 逆方向洗浄エリアの長さ
A1 順方向洗浄エリアに対応する領域
A2 逆方向洗浄エリアに対応する領域
Claims (6)
- 表面に多数のノジュールを有し基板の直径方向に直線状に延びて基板表面との間に洗浄エリアを形成するロール洗浄部材と基板とを共に一方向に回転させつつ、前記ノジュールと基板表面とを互いに接触させて該表面をスクラブ洗浄する基板洗浄方法において、
前記洗浄エリア上の前記ロール洗浄部材と基板の相対回転速度が相対的に低い順方向洗浄エリアでは、前記洗浄エリア上の前記ロール洗浄部材と基板の相対回転速度が相対的に高い逆方向洗浄エリアよりも少ない面積で前記ノジュールと基板表面とを互いに接触させることを特徴とする基板洗浄方法。 - 前記ロール洗浄部材の回転に伴って、基板上の前記順方向洗浄エリアに存在する洗浄液を基板の中心部から外周部に向かって掻き出すことを特徴とする請求項1記載の基板洗浄方法。
- 表面に多数のノジュールを有し基板の直径方向に直線状に延びて基板表面との間に洗浄エリアを形成するロール洗浄部材と基板とを共に一方向に回転させつつ、前記ノジュールと基板表面とを互いに接触させて該表面をスクラブ洗浄する基板洗浄方法において、
前記洗浄エリア上の前記ロール洗浄部材と基板の相対回転速度が相対的に高い逆方向洗浄エリア、及び前記洗浄エリア上の前記ロール洗浄部材と基板の相対回転速度が相対的に低い順方向洗浄エリアの反逆方向洗浄エリア側端部のみで前記ノジュールと基板表面とを互いに接触させることを特徴とする基板洗浄方法。 - 表面に多数のノジュールを有し、基板の直径方向に直線状に延びて基板表面との間に洗浄エリアを形成し、基板と共に一方向に回転させつつ前記ノジュールと基板表面とを互いに接触させて該表面をスクラブ洗浄するロール洗浄部材であって、
前記洗浄エリア上の基板との相対回転速度が相対的に低い順方向洗浄エリアに対応する領域に設けられる前記ノジュールの分布密度を、前記洗浄エリア上の基板との相対回転速度が相対的に高い逆方向洗浄エリアに対応する領域に設けられる前記ノジュールの分布密度より低くしたことを特徴とするロール洗浄部材。 - 前記順方向洗浄エリアに対応する領域には、回転に伴って、洗浄液を基板の中心部から外周部に向かって掻き出す方向に螺旋状に連続した螺旋溝がノジュール間に形成されるように、前記ノジュールが設けられていることを特徴とする請求項4記載のロール洗浄部材。
- 表面に多数のノジュールを有し、基板の直径方向に直線状に延びて基板表面との間に洗浄エリアを形成し、基板と共に一方向に回転させつつ前記ノジュールと基板表面とを互いに接触させて該表面をスクラブ洗浄するロール洗浄部材であって、
前記洗浄エリア上の基板との相対回転速度が相対的に高い逆方向洗浄エリアに対応する領域、及び前記洗浄エリア上の基板との相対回転速度が相対的に低い順方向洗浄エリアの反逆方向洗浄エリア側端部に対応する領域のみに前記ノジュールが設けられていることを特徴とするロール洗浄部材。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011116690A JP5645752B2 (ja) | 2011-05-25 | 2011-05-25 | 基板洗浄方法及びロール洗浄部材 |
US13/478,373 US9011605B2 (en) | 2011-05-25 | 2012-05-23 | Substrate cleaning method and roll cleaning member |
TW101118532A TWI512808B (zh) | 2011-05-25 | 2012-05-24 | Substrate cleaning method and roller cleaning components |
KR1020120055161A KR101554767B1 (ko) | 2011-05-25 | 2012-05-24 | 기판 세정 방법 및 롤 세정 부재 |
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JP2011116690A JP5645752B2 (ja) | 2011-05-25 | 2011-05-25 | 基板洗浄方法及びロール洗浄部材 |
Publications (2)
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JP2012248564A JP2012248564A (ja) | 2012-12-13 |
JP5645752B2 true JP5645752B2 (ja) | 2014-12-24 |
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JP2011116690A Active JP5645752B2 (ja) | 2011-05-25 | 2011-05-25 | 基板洗浄方法及びロール洗浄部材 |
Country Status (4)
Country | Link |
---|---|
US (1) | US9011605B2 (ja) |
JP (1) | JP5645752B2 (ja) |
KR (1) | KR101554767B1 (ja) |
TW (1) | TWI512808B (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
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TW201235155A (en) * | 2011-02-25 | 2012-09-01 | Hon Hai Prec Ind Co Ltd | Cleaning scrap device for grinding plate |
TWI636518B (zh) * | 2013-04-23 | 2018-09-21 | 荏原製作所股份有限公司 | 基板處理裝置及處理基板之製造方法 |
KR102063464B1 (ko) * | 2013-11-28 | 2020-01-08 | 주식회사 케이씨텍 | 기판 세정 장치 |
SG11201703375WA (en) * | 2014-10-31 | 2017-05-30 | Ebara Corp | Substrate cleaning roll, substrate cleaning apparatus, and substrate cleaning method |
KR102573572B1 (ko) * | 2017-12-20 | 2023-09-01 | 삼성전자주식회사 | 웨이퍼 세정 장치 |
JP7166132B2 (ja) * | 2018-10-12 | 2022-11-07 | 株式会社荏原製作所 | 基板洗浄部材および基板洗浄装置 |
JP2022134658A (ja) * | 2021-03-03 | 2022-09-15 | アイオン株式会社 | ブラシローラ |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH10308374A (ja) | 1997-03-06 | 1998-11-17 | Ebara Corp | 洗浄方法及び洗浄装置 |
JP2000015190A (ja) | 1998-07-03 | 2000-01-18 | Matsushita Electric Ind Co Ltd | 基板洗浄方法及び装置 |
US6299698B1 (en) * | 1998-07-10 | 2001-10-09 | Applied Materials, Inc. | Wafer edge scrubber and method |
JP2001358110A (ja) * | 2000-06-13 | 2001-12-26 | Hitachi Ltd | スクラブ洗浄装置およびそれを用いた半導体装置の製造方法 |
JP2002043267A (ja) | 2000-07-21 | 2002-02-08 | Ebara Corp | 基板洗浄装置、基板洗浄方法及び基板処理装置 |
JP3854085B2 (ja) * | 2001-03-16 | 2006-12-06 | 株式会社荏原製作所 | 基板処理装置 |
JP2002313767A (ja) | 2001-04-17 | 2002-10-25 | Ebara Corp | 基板処理装置 |
US6616516B1 (en) * | 2001-12-13 | 2003-09-09 | Lam Research Corporation | Method and apparatus for asymmetric processing of front side and back side of semiconductor substrates |
US6733596B1 (en) * | 2002-12-23 | 2004-05-11 | Lam Research Corporation | Substrate cleaning brush preparation sequence, method, and system |
US20050109371A1 (en) * | 2003-10-27 | 2005-05-26 | Applied Materials, Inc. | Post CMP scrubbing of substrates |
JP2008282865A (ja) | 2007-05-08 | 2008-11-20 | Fuji Electric Device Technology Co Ltd | スクラブ洗浄装置及びそれに用いられるロールスポンジアセンブリ |
JP2009066527A (ja) * | 2007-09-13 | 2009-04-02 | Nec Electronics Corp | 洗浄用ローラおよび洗浄装置 |
JP2009117765A (ja) * | 2007-11-09 | 2009-05-28 | Aion Kk | 洗浄用スポンジローラ |
TWM362051U (en) * | 2009-02-26 | 2009-08-01 | Tung An Dev Ltd | Structure for cleaning |
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2011
- 2011-05-25 JP JP2011116690A patent/JP5645752B2/ja active Active
-
2012
- 2012-05-23 US US13/478,373 patent/US9011605B2/en active Active
- 2012-05-24 TW TW101118532A patent/TWI512808B/zh active
- 2012-05-24 KR KR1020120055161A patent/KR101554767B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
TWI512808B (zh) | 2015-12-11 |
US9011605B2 (en) | 2015-04-21 |
JP2012248564A (ja) | 2012-12-13 |
US20120312323A1 (en) | 2012-12-13 |
KR20120132380A (ko) | 2012-12-05 |
KR101554767B1 (ko) | 2015-09-21 |
TW201301373A (zh) | 2013-01-01 |
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