TWI493614B - Substrate cleaning method - Google Patents
Substrate cleaning method Download PDFInfo
- Publication number
- TWI493614B TWI493614B TW102115659A TW102115659A TWI493614B TW I493614 B TWI493614 B TW I493614B TW 102115659 A TW102115659 A TW 102115659A TW 102115659 A TW102115659 A TW 102115659A TW I493614 B TWI493614 B TW I493614B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- cleaning
- cleaning liquid
- roller
- region
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P50/00—Etching of wafers, substrates or parts of devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P70/00—Cleaning of wafers, substrates or parts of devices
- H10P70/20—Cleaning during device manufacture
- H10P70/23—Cleaning during device manufacture during, before or after processing of insulating materials
- H10P70/237—Cleaning during device manufacture during, before or after processing of insulating materials the processing being a planarisation of insulating layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/27—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using selective deposition, e.g. simultaneous growth of monocrystalline and non-monocrystalline semiconductor materials
- H10P14/276—Lateral overgrowth
- H10P14/278—Pendeoepitaxy
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P70/00—Cleaning of wafers, substrates or parts of devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P70/00—Cleaning of wafers, substrates or parts of devices
- H10P70/20—Cleaning during device manufacture
- H10P70/27—Cleaning during device manufacture during, before or after processing of conductive materials, e.g. polysilicon or amorphous silicon layers
- H10P70/277—Cleaning during device manufacture during, before or after processing of conductive materials, e.g. polysilicon or amorphous silicon layers the processing being a planarisation of conductive layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
- B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
- B08B1/34—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members rotating about an axis parallel to the surface
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P70/00—Cleaning of wafers, substrates or parts of devices
- H10P70/60—Cleaning only by mechanical processes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S134/00—Cleaning and liquid contact with solids
- Y10S134/902—Semiconductor wafer
Landscapes
- Cleaning Or Drying Semiconductors (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012117344 | 2012-05-23 | ||
| JP2013041494A JP5886224B2 (ja) | 2012-05-23 | 2013-03-04 | 基板洗浄方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201349323A TW201349323A (zh) | 2013-12-01 |
| TWI493614B true TWI493614B (zh) | 2015-07-21 |
Family
ID=49620627
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102115659A TWI493614B (zh) | 2012-05-23 | 2013-05-02 | Substrate cleaning method |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US8932407B2 (https=) |
| JP (1) | JP5886224B2 (https=) |
| KR (1) | KR20130131232A (https=) |
| CN (1) | CN103418558A (https=) |
| TW (1) | TWI493614B (https=) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD735427S1 (en) * | 2013-02-01 | 2015-07-28 | Ebara Corporation | Roller shaft for substrate cleaning |
| USD728177S1 (en) * | 2013-02-01 | 2015-04-28 | Ebara Corporation | Roller shaft for substrate cleaning |
| TWI664672B (zh) * | 2013-07-03 | 2019-07-01 | Ebara Corporation | 基板洗淨裝置及基板洗淨方法 |
| CN104971916B (zh) * | 2014-04-01 | 2020-07-07 | 株式会社荏原制作所 | 清洗装置及清洗方法 |
| JP6600470B2 (ja) | 2014-04-01 | 2019-10-30 | 株式会社荏原製作所 | 洗浄装置及び洗浄方法 |
| US9475272B2 (en) | 2014-10-09 | 2016-10-25 | Taiwan Semiconductor Manufacturing Company, Ltd. | De-bonding and cleaning process and system |
| JP7018768B2 (ja) * | 2014-11-24 | 2022-02-14 | コーニング インコーポレイテッド | 基板表面洗浄方法および装置 |
| CN104907300B (zh) * | 2015-06-01 | 2017-04-26 | 常州兆阳能源科技有限公司 | 太阳能电池板的高效清洗系统 |
| JP6646460B2 (ja) * | 2016-02-15 | 2020-02-14 | 株式会社荏原製作所 | 基板洗浄装置及び基板処理装置 |
| JP6609197B2 (ja) * | 2016-02-25 | 2019-11-20 | 株式会社ディスコ | 洗浄装置 |
| JP6718714B2 (ja) | 2016-03-25 | 2020-07-08 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理方法および基板処理装置 |
| KR102573572B1 (ko) * | 2017-12-20 | 2023-09-01 | 삼성전자주식회사 | 웨이퍼 세정 장치 |
| US20200276619A1 (en) * | 2019-02-04 | 2020-09-03 | Ebara Corporation | Cleaning member attaching part, cleaning member assembly and substrate cleaning apparatus |
| CN111085485B (zh) * | 2019-12-26 | 2021-02-09 | 海盐宝仕龙塑业股份有限公司 | 一种板材的表面处理系统 |
| CN112268211B (zh) * | 2020-10-27 | 2022-05-10 | 沧州诚效通信器材有限公司 | 一种智能无线通信设备支撑固定方法 |
| KR20230173091A (ko) | 2021-04-21 | 2023-12-26 | 신에쯔 한도타이 가부시키가이샤 | 웨이퍼의 세정방법 및 세정처리장치 |
| CN120311276A (zh) * | 2024-01-12 | 2025-07-15 | 盛美半导体设备(上海)股份有限公司 | 电镀装置及基板清洁方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0433596B2 (https=) * | 1984-12-25 | 1992-06-03 | Mutoh Ind Ltd | |
| US20060016029A1 (en) * | 2003-02-28 | 2006-01-26 | Katrina Mikhaylichenko | Brush scrubbing-high frequency resonating substrate processing system |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04363022A (ja) * | 1991-06-06 | 1992-12-15 | Enya Syst:Kk | 貼付板洗浄装置 |
| JP2647050B2 (ja) * | 1995-03-31 | 1997-08-27 | 日本電気株式会社 | ウェハ研磨装置 |
| JP2887095B2 (ja) | 1995-08-31 | 1999-04-26 | 芝浦メカトロニクス株式会社 | 洗浄装置 |
| JP2002043267A (ja) * | 2000-07-21 | 2002-02-08 | Ebara Corp | 基板洗浄装置、基板洗浄方法及び基板処理装置 |
| JP2003077876A (ja) | 2001-08-30 | 2003-03-14 | Matsushita Electric Ind Co Ltd | 洗浄装置及び洗浄方法 |
| JP2003142444A (ja) * | 2001-10-31 | 2003-05-16 | Applied Materials Inc | 洗浄装置 |
| US6733596B1 (en) * | 2002-12-23 | 2004-05-11 | Lam Research Corporation | Substrate cleaning brush preparation sequence, method, and system |
| US7353560B2 (en) * | 2003-12-18 | 2008-04-08 | Lam Research Corporation | Proximity brush unit apparatus and method |
| US8608858B2 (en) * | 2004-09-28 | 2013-12-17 | Ebara Corporation | Substrate cleaning apparatus and method for determining timing of replacement of cleaning member |
| JP4387938B2 (ja) * | 2004-12-27 | 2009-12-24 | 大日本スクリーン製造株式会社 | 基板処理装置 |
| JP2008226349A (ja) * | 2007-03-13 | 2008-09-25 | Showa Denko Kk | 円盤状基板の製造方法、洗浄装置 |
| JP2008311481A (ja) * | 2007-06-15 | 2008-12-25 | Sony Corp | 基板洗浄方法、基板洗浄装置及び半導体製造方法 |
| JP2010212295A (ja) * | 2009-03-06 | 2010-09-24 | Elpida Memory Inc | 基板洗浄装置および基板洗浄方法 |
| JP2010278103A (ja) | 2009-05-27 | 2010-12-09 | Sumitomo Metal Mining Co Ltd | スクラブ洗浄装置 |
| JP2011165751A (ja) * | 2010-02-05 | 2011-08-25 | Toshiba Corp | 洗浄装置及び半導体装置の製造方法 |
| JP2011233646A (ja) * | 2010-04-26 | 2011-11-17 | Sumitomo Metal Mining Co Ltd | 半導体用基板の洗浄方法 |
-
2013
- 2013-03-04 JP JP2013041494A patent/JP5886224B2/ja active Active
- 2013-05-02 TW TW102115659A patent/TWI493614B/zh active
- 2013-05-14 US US13/894,331 patent/US8932407B2/en active Active
- 2013-05-16 KR KR1020130055792A patent/KR20130131232A/ko not_active Ceased
- 2013-05-22 CN CN2013101935844A patent/CN103418558A/zh active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0433596B2 (https=) * | 1984-12-25 | 1992-06-03 | Mutoh Ind Ltd | |
| US20060016029A1 (en) * | 2003-02-28 | 2006-01-26 | Katrina Mikhaylichenko | Brush scrubbing-high frequency resonating substrate processing system |
Also Published As
| Publication number | Publication date |
|---|---|
| US20130312790A1 (en) | 2013-11-28 |
| KR20130131232A (ko) | 2013-12-03 |
| US8932407B2 (en) | 2015-01-13 |
| JP5886224B2 (ja) | 2016-03-16 |
| TW201349323A (zh) | 2013-12-01 |
| CN103418558A (zh) | 2013-12-04 |
| JP2014003273A (ja) | 2014-01-09 |
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