JP5860246B2 - 配線基板 - Google Patents
配線基板 Download PDFInfo
- Publication number
- JP5860246B2 JP5860246B2 JP2011183560A JP2011183560A JP5860246B2 JP 5860246 B2 JP5860246 B2 JP 5860246B2 JP 2011183560 A JP2011183560 A JP 2011183560A JP 2011183560 A JP2011183560 A JP 2011183560A JP 5860246 B2 JP5860246 B2 JP 5860246B2
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- JP
- Japan
- Prior art keywords
- layer
- semiconductor element
- wiring board
- wiring
- insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Parts Printed On Printed Circuit Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
3 接続パッド
3a 主導体層
3b 抵抗体層
3d 接続面
10 配線基板
Claims (1)
- 絶縁層の表面に、半導体素子の電極または電気回路基板が接続される接続面を有する接続パッドを具備して成る配線基板であって、前記接続パッドは、前記絶縁層の側に配置された体積抵抗率が100μΩ・cm以下の低抵抗材料から成る主導体層と、前記接続面を形成する厚みが1〜10μmの被覆層と、該被覆層と前記主導体層との間に配置された体積抵抗率が10Ω・cm以上のゲルマニウムから成る厚みが100〜1000nmの抵抗体層とが積層されて成り、該抵抗体層が前記接続面と前記主導体層との間に電気的に直列に接続されていることを特徴とする配線基板。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011183560A JP5860246B2 (ja) | 2011-08-25 | 2011-08-25 | 配線基板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011183560A JP5860246B2 (ja) | 2011-08-25 | 2011-08-25 | 配線基板 |
Publications (2)
Publication Number | Publication Date |
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JP2013045938A JP2013045938A (ja) | 2013-03-04 |
JP5860246B2 true JP5860246B2 (ja) | 2016-02-16 |
Family
ID=48009601
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2011183560A Expired - Fee Related JP5860246B2 (ja) | 2011-08-25 | 2011-08-25 | 配線基板 |
Country Status (1)
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JP (1) | JP5860246B2 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015012111A (ja) * | 2013-06-28 | 2015-01-19 | 京セラサーキットソリューションズ株式会社 | 配線基板 |
JP2015012112A (ja) * | 2013-06-28 | 2015-01-19 | 京セラサーキットソリューションズ株式会社 | 配線基板 |
KR20150002492A (ko) * | 2013-06-28 | 2015-01-07 | 쿄세라 서킷 솔루션즈 가부시키가이샤 | 배선 기판 |
JP2015032594A (ja) * | 2013-07-31 | 2015-02-16 | 京セラサーキットソリューションズ株式会社 | 配線基板 |
JP7310599B2 (ja) * | 2019-12-26 | 2023-07-19 | トヨタ自動車株式会社 | 配線基板の製造方法および配線基板 |
JP2023164038A (ja) * | 2022-04-28 | 2023-11-10 | Toppanホールディングス株式会社 | 配線基板、半導体装置及び配線基板の製造方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2641451B2 (ja) * | 1987-07-06 | 1997-08-13 | 株式会社日立製作所 | 酸化物超電導集積回路 |
CA2089791C (en) * | 1992-04-24 | 1998-11-24 | Michael J. Brady | Electronic devices having metallurgies containing copper-semiconductor compounds |
JP2003234429A (ja) * | 2002-02-07 | 2003-08-22 | Hitachi Ltd | 半導体装置の製造方法 |
JP4830275B2 (ja) * | 2004-07-22 | 2011-12-07 | ソニー株式会社 | 記憶素子 |
-
2011
- 2011-08-25 JP JP2011183560A patent/JP5860246B2/ja not_active Expired - Fee Related
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JP2013045938A (ja) | 2013-03-04 |
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