JP5787691B2 - インプリント装置、それを用いた物品の製造方法 - Google Patents
インプリント装置、それを用いた物品の製造方法 Download PDFInfo
- Publication number
- JP5787691B2 JP5787691B2 JP2011205432A JP2011205432A JP5787691B2 JP 5787691 B2 JP5787691 B2 JP 5787691B2 JP 2011205432 A JP2011205432 A JP 2011205432A JP 2011205432 A JP2011205432 A JP 2011205432A JP 5787691 B2 JP5787691 B2 JP 5787691B2
- Authority
- JP
- Japan
- Prior art keywords
- gas
- substrate
- mold
- recovery
- imprint apparatus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/002—Component parts, details or accessories; Auxiliary operations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
- B29C33/424—Moulding surfaces provided with means for marking or patterning
- B29C2033/426—Stampers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
- B29C2043/023—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface having a plurality of grooves
- B29C2043/025—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface having a plurality of grooves forming a microstructure, i.e. fine patterning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
- B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
- B29C2059/023—Microembossing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
- B29C33/424—Moulding surfaces provided with means for marking or patterning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
- B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Mathematical Physics (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011205432A JP5787691B2 (ja) | 2011-09-21 | 2011-09-21 | インプリント装置、それを用いた物品の製造方法 |
| PCT/JP2012/005938 WO2013042350A1 (en) | 2011-09-21 | 2012-09-18 | Imprint apparatus and article manufacturing method using same |
| US14/238,525 US9694535B2 (en) | 2011-09-21 | 2012-09-18 | Imprint apparatus and article manufacturing method using same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011205432A JP5787691B2 (ja) | 2011-09-21 | 2011-09-21 | インプリント装置、それを用いた物品の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013069732A JP2013069732A (ja) | 2013-04-18 |
| JP2013069732A5 JP2013069732A5 (enExample) | 2014-11-06 |
| JP5787691B2 true JP5787691B2 (ja) | 2015-09-30 |
Family
ID=47914138
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011205432A Expired - Fee Related JP5787691B2 (ja) | 2011-09-21 | 2011-09-21 | インプリント装置、それを用いた物品の製造方法 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US9694535B2 (enExample) |
| JP (1) | JP5787691B2 (enExample) |
| WO (1) | WO2013042350A1 (enExample) |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6313591B2 (ja) * | 2013-12-20 | 2018-04-18 | キヤノン株式会社 | インプリント装置、異物除去方法及び物品の製造方法 |
| JP6294679B2 (ja) * | 2014-01-21 | 2018-03-14 | キヤノン株式会社 | インプリント装置及び物品の製造方法 |
| WO2015181924A1 (ja) * | 2014-05-29 | 2015-12-03 | キヤノン株式会社 | 塗布装置、インプリント装置および物品の製造方法 |
| JP6320183B2 (ja) * | 2014-06-10 | 2018-05-09 | キヤノン株式会社 | インプリント装置、インプリント方法、および物品製造方法 |
| JP6420571B2 (ja) * | 2014-06-13 | 2018-11-07 | キヤノン株式会社 | インプリント装置、インプリント方法及び物品の製造方法 |
| JP6525567B2 (ja) * | 2014-12-02 | 2019-06-05 | キヤノン株式会社 | インプリント装置及び物品の製造方法 |
| TWI693477B (zh) * | 2015-02-23 | 2020-05-11 | 日商尼康股份有限公司 | 測量裝置、微影系統及曝光裝置、以及元件製造方法 |
| CN107278279B (zh) | 2015-02-23 | 2020-07-03 | 株式会社尼康 | 基板处理系统及基板处理方法、以及组件制造方法 |
| CN111158220A (zh) | 2015-02-23 | 2020-05-15 | 株式会社尼康 | 测量装置及方法、光刻系统、曝光装置及方法 |
| JP6643048B2 (ja) * | 2015-11-09 | 2020-02-12 | キヤノン株式会社 | 基板を処理する装置、物品の製造方法、および気体供給経路 |
| WO2017134989A1 (ja) * | 2016-02-03 | 2017-08-10 | キヤノン株式会社 | インプリント装置および物品の製造方法 |
| JP6702753B2 (ja) * | 2016-02-17 | 2020-06-03 | キヤノン株式会社 | リソグラフィ装置、及び物品の製造方法 |
| JP6603678B2 (ja) * | 2016-02-26 | 2019-11-06 | キヤノン株式会社 | インプリント装置およびその動作方法ならびに物品製造方法 |
| WO2017145924A1 (ja) * | 2016-02-26 | 2017-08-31 | キヤノン株式会社 | インプリント装置およびその動作方法ならびに物品製造方法 |
| JP2017157641A (ja) * | 2016-02-29 | 2017-09-07 | キヤノン株式会社 | インプリント装置、インプリント方法、および物品の製造方法 |
| CN106228913B (zh) * | 2016-08-24 | 2022-12-30 | 京东方科技集团股份有限公司 | 转印设备及其转印方法 |
| JP7058951B2 (ja) * | 2017-05-24 | 2022-04-25 | キヤノン株式会社 | インプリント装置、および物品の製造方法 |
| US10895806B2 (en) * | 2017-09-29 | 2021-01-19 | Canon Kabushiki Kaisha | Imprinting method and apparatus |
| JP7262930B2 (ja) * | 2018-04-26 | 2023-04-24 | キヤノン株式会社 | 型を用いて基板上の組成物を成形する成形装置、成形方法、および物品の製造方法 |
| KR20220100578A (ko) * | 2019-11-12 | 2022-07-15 | 모포토닉스 홀딩 비.브이. | 공동을 갖는 플레이트 캐리어를 포함하는 롤-투-플레이트 임프린팅 공정을 위한 장치 |
| JP7323937B2 (ja) * | 2020-05-22 | 2023-08-09 | アピックヤマダ株式会社 | 樹脂モールド装置 |
Family Cites Families (34)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5997963A (en) * | 1998-05-05 | 1999-12-07 | Ultratech Stepper, Inc. | Microchamber |
| SE515607C2 (sv) * | 1999-12-10 | 2001-09-10 | Obducat Ab | Anordning och metod vid tillverkning av strukturer |
| US20080164638A1 (en) * | 2006-11-28 | 2008-07-10 | Wei Zhang | Method and apparatus for rapid imprint lithography |
| US7019819B2 (en) * | 2002-11-13 | 2006-03-28 | Molecular Imprints, Inc. | Chucking system for modulating shapes of substrates |
| JP3700001B2 (ja) * | 2002-09-10 | 2005-09-28 | 独立行政法人産業技術総合研究所 | インプリント方法及び装置 |
| US7641840B2 (en) * | 2002-11-13 | 2010-01-05 | Molecular Imprints, Inc. | Method for expelling gas positioned between a substrate and a mold |
| US7090716B2 (en) * | 2003-10-02 | 2006-08-15 | Molecular Imprints, Inc. | Single phase fluid imprint lithography method |
| JP4393244B2 (ja) * | 2004-03-29 | 2010-01-06 | キヤノン株式会社 | インプリント装置 |
| KR101585310B1 (ko) * | 2004-12-15 | 2016-01-14 | 가부시키가이샤 니콘 | 기판 유지 장치, 노광 장치 및 디바이스 제조방법 |
| US7490547B2 (en) * | 2004-12-30 | 2009-02-17 | Asml Netherlands B.V. | Imprint lithography |
| US7377764B2 (en) * | 2005-06-13 | 2008-05-27 | Asml Netherlands B.V. | Imprint lithography |
| US7670534B2 (en) * | 2005-09-21 | 2010-03-02 | Molecular Imprints, Inc. | Method to control an atmosphere between a body and a substrate |
| JPWO2007094213A1 (ja) * | 2006-02-14 | 2009-07-02 | パイオニア株式会社 | インプリント装置及びインプリント方法 |
| CN101405087A (zh) * | 2006-04-03 | 2009-04-08 | 分子制模股份有限公司 | 光刻印刷系统 |
| JP2008218976A (ja) | 2007-02-07 | 2008-09-18 | Canon Inc | 露光装置 |
| US7755740B2 (en) * | 2007-02-07 | 2010-07-13 | Canon Kabushiki Kaisha | Exposure apparatus |
| KR101289337B1 (ko) * | 2007-08-29 | 2013-07-29 | 시게이트 테크놀로지 엘엘씨 | 양면 임프린트 리소그래피 장치 |
| JP4578517B2 (ja) * | 2007-12-26 | 2010-11-10 | Scivax株式会社 | インプリント装置およびインプリント方法 |
| JP5121549B2 (ja) * | 2008-04-21 | 2013-01-16 | 株式会社東芝 | ナノインプリント方法 |
| US20100096764A1 (en) * | 2008-10-20 | 2010-04-22 | Molecular Imprints, Inc. | Gas Environment for Imprint Lithography |
| JP2010149482A (ja) * | 2008-12-26 | 2010-07-08 | Toshiba Corp | インプリント用モールドおよびパターン形成方法 |
| JP5416420B2 (ja) * | 2009-01-22 | 2014-02-12 | 株式会社日立ハイテクノロジーズ | 微細構造転写装置 |
| NL2004685A (en) * | 2009-07-27 | 2011-01-31 | Asml Netherlands Bv | Imprint lithography apparatus and method. |
| US20110180964A1 (en) * | 2010-01-27 | 2011-07-28 | Molecular Imprints. Inc. | Systems and methods for substrate formation |
| EP2534536A2 (en) * | 2010-02-09 | 2012-12-19 | Molecular Imprints, Inc. | Process gas confinement for nanoimprint lithography |
| JP5546893B2 (ja) | 2010-02-16 | 2014-07-09 | 東京エレクトロン株式会社 | インプリント方法 |
| JP5618588B2 (ja) * | 2010-03-24 | 2014-11-05 | キヤノン株式会社 | インプリント方法 |
| JP2012039057A (ja) * | 2010-07-13 | 2012-02-23 | Canon Inc | インプリント装置及び物品の製造方法 |
| JP2012080015A (ja) * | 2010-10-05 | 2012-04-19 | Canon Inc | インプリント装置及び物品の製造方法 |
| JP5930622B2 (ja) * | 2010-10-08 | 2016-06-08 | キヤノン株式会社 | インプリント装置、及び、物品の製造方法 |
| JP5679850B2 (ja) * | 2011-02-07 | 2015-03-04 | キヤノン株式会社 | インプリント装置、および、物品の製造方法 |
| JP5647029B2 (ja) * | 2011-02-18 | 2014-12-24 | キヤノン株式会社 | インプリント装置及び物品の製造方法 |
| JP5289492B2 (ja) * | 2011-03-23 | 2013-09-11 | 株式会社東芝 | インプリント方法およびインプリント装置 |
| JP2013026573A (ja) * | 2011-07-25 | 2013-02-04 | Canon Inc | インプリント装置、および、物品の製造方法 |
-
2011
- 2011-09-21 JP JP2011205432A patent/JP5787691B2/ja not_active Expired - Fee Related
-
2012
- 2012-09-18 US US14/238,525 patent/US9694535B2/en not_active Expired - Fee Related
- 2012-09-18 WO PCT/JP2012/005938 patent/WO2013042350A1/en not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| WO2013042350A1 (en) | 2013-03-28 |
| US9694535B2 (en) | 2017-07-04 |
| JP2013069732A (ja) | 2013-04-18 |
| US20140191441A1 (en) | 2014-07-10 |
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