JP5781824B2 - 熱膨張抑制部材および対熱膨張性部材 - Google Patents

熱膨張抑制部材および対熱膨張性部材 Download PDF

Info

Publication number
JP5781824B2
JP5781824B2 JP2011097851A JP2011097851A JP5781824B2 JP 5781824 B2 JP5781824 B2 JP 5781824B2 JP 2011097851 A JP2011097851 A JP 2011097851A JP 2011097851 A JP2011097851 A JP 2011097851A JP 5781824 B2 JP5781824 B2 JP 5781824B2
Authority
JP
Japan
Prior art keywords
metal
thermal expansion
linear expansion
expansion coefficient
thermally expandable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2011097851A
Other languages
English (en)
Japanese (ja)
Other versions
JP2012056830A (ja
JP2012056830A5 (enExample
Inventor
久保田　純
純 久保田
三浦　薫
薫 三浦
薮田　久人
久人 薮田
喜彦 松村
喜彦 松村
島川　祐一
祐一 島川
東　正樹
正樹 東
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Kyoto University NUC
Original Assignee
Canon Inc
Kyoto University NUC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc, Kyoto University NUC filed Critical Canon Inc
Priority to JP2011097851A priority Critical patent/JP5781824B2/ja
Priority to US13/205,272 priority patent/US8753749B2/en
Priority to CN201110226208.1A priority patent/CN102373032B/zh
Priority to EP11177212.5A priority patent/EP2418923B1/en
Publication of JP2012056830A publication Critical patent/JP2012056830A/ja
Priority to US14/262,012 priority patent/US10124558B2/en
Publication of JP2012056830A5 publication Critical patent/JP2012056830A5/ja
Application granted granted Critical
Publication of JP5781824B2 publication Critical patent/JP5781824B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/027—Thermal properties
    • B32B7/028—Heat-shrinkability
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
    • C01G53/00—Compounds of nickel
    • C01G53/40—Complex oxides containing nickel and at least one other metal element
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/50—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on rare-earth compounds
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/50—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on rare-earth compounds
    • C04B35/505—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on rare-earth compounds based on yttrium oxide
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3731—Ceramic materials or glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/732—Dimensional properties
    • B32B2307/734—Dimensional stability
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Structural Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Ceramic Products (AREA)
  • Inorganic Compounds Of Heavy Metals (AREA)
JP2011097851A 2010-08-12 2011-04-26 熱膨張抑制部材および対熱膨張性部材 Active JP5781824B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2011097851A JP5781824B2 (ja) 2010-08-12 2011-04-26 熱膨張抑制部材および対熱膨張性部材
US13/205,272 US8753749B2 (en) 2010-08-12 2011-08-08 Thermal expansion suppressing member and anti-thermally-expansive member
CN201110226208.1A CN102373032B (zh) 2010-08-12 2011-08-09 热膨胀抑制部件和抗热膨胀性部件
EP11177212.5A EP2418923B1 (en) 2010-08-12 2011-08-11 Thermal expansion suppressing member and anti-thermally-expansive member
US14/262,012 US10124558B2 (en) 2010-08-12 2014-04-25 Thermal expansion suppressing member and anti-thermally-expansive member

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010180885 2010-08-12
JP2010180885 2010-08-12
JP2011097851A JP5781824B2 (ja) 2010-08-12 2011-04-26 熱膨張抑制部材および対熱膨張性部材

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2015142328A Division JP6038244B2 (ja) 2010-08-12 2015-07-16 熱膨張抑制部材および対熱膨張性部材

Publications (3)

Publication Number Publication Date
JP2012056830A JP2012056830A (ja) 2012-03-22
JP2012056830A5 JP2012056830A5 (enExample) 2014-06-19
JP5781824B2 true JP5781824B2 (ja) 2015-09-24

Family

ID=44677474

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011097851A Active JP5781824B2 (ja) 2010-08-12 2011-04-26 熱膨張抑制部材および対熱膨張性部材

Country Status (4)

Country Link
US (2) US8753749B2 (enExample)
EP (1) EP2418923B1 (enExample)
JP (1) JP5781824B2 (enExample)
CN (1) CN102373032B (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5781824B2 (ja) * 2010-08-12 2015-09-24 キヤノン株式会社 熱膨張抑制部材および対熱膨張性部材
JP5795187B2 (ja) 2010-08-12 2015-10-14 キヤノン株式会社 対熱膨張性樹脂および対熱膨張性金属
US20140117559A1 (en) * 2012-03-30 2014-05-01 Paul A. Zimmerman Process and material for preventing deleterious expansion of high aspect ratio copper filled through silicon vias (tsvs)
DE102012212898A1 (de) * 2012-07-24 2014-01-30 Carl Zeiss Smt Gmbh Spiegelanordnung für eine EUV-Projektionsbelichtungsanlage, Verfahren zum Betreiben derselben, sowie EUV-Projektionsbelichtungsanlage
JP6143197B2 (ja) * 2012-08-21 2017-06-07 国立大学法人東京工業大学 負熱膨張性材料
JP6555473B2 (ja) * 2015-08-31 2019-08-07 国立大学法人東京工業大学 負熱膨張性材料、及び複合体
WO2017138643A1 (ja) 2016-02-12 2017-08-17 国立大学法人名古屋大学 ルテニウム酸化物およびルテニウム酸化物の製造方法
JP6998051B2 (ja) * 2018-06-08 2022-01-18 地方独立行政法人神奈川県立産業技術総合研究所 負熱膨張性材料、複合体、及び使用方法
CN110335854B (zh) * 2019-06-17 2020-12-11 中国科学院微电子研究所 一种强制对流微流道散热结构、制造方法及电子器件
JP7351477B2 (ja) 2019-07-23 2023-09-27 国立大学法人東京工業大学 樹脂組成物およびその樹脂成形体
CN111254388B (zh) * 2020-03-30 2022-06-10 昆山国显光电有限公司 掩膜外框和掩膜组件
WO2023210673A1 (ja) * 2022-04-28 2023-11-02 国立大学法人東北大学 結晶体、相変化メモリ、結晶体の製造方法及び相変化メモリの製造方法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61175035A (ja) 1985-01-31 1986-08-06 株式会社日立製作所 樹脂と無機材料との複合体
US5694503A (en) 1996-09-09 1997-12-02 Lucent Technologies Inc. Article comprising a temperature compensated optical fiber refractive index grating
US20050191515A1 (en) 2000-07-20 2005-09-01 Shipley Company, L.L.C. Very low thermal expansion composite
US6518609B1 (en) * 2000-08-31 2003-02-11 University Of Maryland Niobium or vanadium substituted strontium titanate barrier intermediate a silicon underlayer and a functional metal oxide film
AU2002318144A1 (en) 2001-05-24 2003-01-29 Fry's Metals, Inc. Thermal interface material and heat sink configuration
CN1894791B (zh) 2001-05-24 2011-01-26 弗莱氏金属公司 传热界面材料以及焊料预制品
JP4797148B2 (ja) * 2003-10-08 2011-10-19 独立行政法人産業技術総合研究所 熱電変換材料接続用導電性ペースト
JP4379798B2 (ja) * 2004-05-19 2009-12-09 日立粉末冶金株式会社 金属−セラミックス焼結積層体の製造方法
JP4446064B2 (ja) * 2004-07-07 2010-04-07 独立行政法人産業技術総合研究所 熱電変換素子及び熱電変換モジュール
JP5099478B2 (ja) 2004-07-30 2012-12-19 独立行政法人理化学研究所 熱膨張抑制剤、ゼロ熱膨張材料、熱膨張抑制方法および熱膨張抑制剤の製造方法
US20070135550A1 (en) 2005-12-14 2007-06-14 Nirupama Chakrapani Negative thermal expansion material filler for low CTE composites
JP2007194429A (ja) 2006-01-19 2007-08-02 Fujitsu Ltd 強磁性・強誘電性材料及び半導体装置
US8232621B2 (en) * 2006-07-28 2012-07-31 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP2008260892A (ja) 2007-04-13 2008-10-30 Sekisui Chem Co Ltd 電子部品用接着剤
JP2010021429A (ja) 2008-07-11 2010-01-28 Murata Mfg Co Ltd 電子機器およびその製造方法
JP2010029990A (ja) * 2008-07-29 2010-02-12 National Institute Of Advanced Industrial & Technology 負熱膨張率材料および該負熱膨張率材料を含む複合材料
WO2010101153A1 (ja) 2009-03-04 2010-09-10 国立大学法人京都大学 Ａサイト秩序型ペロブスカイト酸化物
JP5795187B2 (ja) 2010-08-12 2015-10-14 キヤノン株式会社 対熱膨張性樹脂および対熱膨張性金属
JP5781824B2 (ja) * 2010-08-12 2015-09-24 キヤノン株式会社 熱膨張抑制部材および対熱膨張性部材
JP6143197B2 (ja) 2012-08-21 2017-06-07 国立大学法人東京工業大学 負熱膨張性材料

Also Published As

Publication number Publication date
US10124558B2 (en) 2018-11-13
JP2012056830A (ja) 2012-03-22
EP2418923A1 (en) 2012-02-15
EP2418923B1 (en) 2019-01-23
US8753749B2 (en) 2014-06-17
US20120040196A1 (en) 2012-02-16
CN102373032B (zh) 2014-08-06
CN102373032A (zh) 2012-03-14
US20140234643A1 (en) 2014-08-21

Similar Documents

Publication Publication Date Title
JP5781824B2 (ja) 熱膨張抑制部材および対熱膨張性部材
JP5795187B2 (ja) 対熱膨張性樹脂および対熱膨張性金属
US20140209140A1 (en) Stacked thermoelectric conversion module
JP2011035117A (ja) 熱電変換材料
US9627600B2 (en) Mg—Si system thermoelectric conversion material, method for producing same, sintered body for thermoelectric conversion, thermoelectric conversion element, and thermoelectric conversion module
JP6038244B2 (ja) 熱膨張抑制部材および対熱膨張性部材
JP2014165188A (ja) 熱電変換素子
JP6966666B2 (ja) 温度センサ素子および温度センサ素子の製造方法
JP2021044574A (ja) マグネシウム系熱電変換材料の製造方法
WO2011086850A1 (ja) Ｎｔｃサーミスタ用半導体磁器組成物およびｎｔｃサーミスタ
US20240381773A1 (en) Thermoelectric conversion module and thermoelectric conversion system
TWI768045B (zh) 鎂系熱電變換材料、鎂系熱電變換元件、及鎂系熱電變換材料之製造方法
KR101323320B1 (ko) Ａｇ 및 Ｓｂ가 도핑된 ＧｅＴｅ계 열전재료 및 그 제조방법
KR102242915B1 (ko) 균일한 열전특성을 갖는 열전소재 제조방법
JP7611816B2 (ja) 窒化ケイ素焼結体の製造方法
JP5218285B2 (ja) 熱電変換材料
EP4089749B1 (en) Ink composition for printable thermoelectric materials
JP2003218410A (ja) 熱電材料、その製造方法及び熱電変換素子
WO2015033688A1 (ja) 冷却デバイス

Legal Events

Date Code Title Description
RD03 Notification of appointment of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7423

Effective date: 20120914

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A821

Effective date: 20120914

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20140423

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20140423

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20140911

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20140916

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20141117

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20141218

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20150216

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20150616

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20150716

R150 Certificate of patent or registration of utility model

Ref document number: 5781824

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150