JP2012056830A5 - - Google Patents
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- Publication number
- JP2012056830A5 JP2012056830A5 JP2011097851A JP2011097851A JP2012056830A5 JP 2012056830 A5 JP2012056830 A5 JP 2012056830A5 JP 2011097851 A JP2011097851 A JP 2011097851A JP 2011097851 A JP2011097851 A JP 2011097851A JP 2012056830 A5 JP2012056830 A5 JP 2012056830A5
- Authority
- JP
- Japan
- Prior art keywords
- linear expansion
- metal
- expandable member
- member according
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052751 metal Inorganic materials 0.000 claims 7
- 239000002184 metal Substances 0.000 claims 7
- 229910052692 Dysprosium Inorganic materials 0.000 claims 2
- 229910052691 Erbium Inorganic materials 0.000 claims 2
- 229910052693 Europium Inorganic materials 0.000 claims 2
- 229910052688 Gadolinium Inorganic materials 0.000 claims 2
- 229910052689 Holmium Inorganic materials 0.000 claims 2
- 229910052765 Lutetium Inorganic materials 0.000 claims 2
- 229910052779 Neodymium Inorganic materials 0.000 claims 2
- 229910052777 Praseodymium Inorganic materials 0.000 claims 2
- 229910052772 Samarium Inorganic materials 0.000 claims 2
- 229910052771 Terbium Inorganic materials 0.000 claims 2
- 229910052775 Thulium Inorganic materials 0.000 claims 2
- 229910052769 Ytterbium Inorganic materials 0.000 claims 2
- 229910052738 indium Inorganic materials 0.000 claims 2
- 229910052746 lanthanum Inorganic materials 0.000 claims 2
- 239000000463 material Substances 0.000 claims 2
- 229910052727 yttrium Inorganic materials 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 108091008695 photoreceptors Proteins 0.000 claims 1
- 239000007787 solid Substances 0.000 claims 1
- 239000011343 solid material Substances 0.000 claims 1
- 125000006850 spacer group Chemical group 0.000 claims 1
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011097851A JP5781824B2 (ja) | 2010-08-12 | 2011-04-26 | 熱膨張抑制部材および対熱膨張性部材 |
| US13/205,272 US8753749B2 (en) | 2010-08-12 | 2011-08-08 | Thermal expansion suppressing member and anti-thermally-expansive member |
| CN201110226208.1A CN102373032B (zh) | 2010-08-12 | 2011-08-09 | 热膨胀抑制部件和抗热膨胀性部件 |
| EP11177212.5A EP2418923B1 (en) | 2010-08-12 | 2011-08-11 | Thermal expansion suppressing member and anti-thermally-expansive member |
| US14/262,012 US10124558B2 (en) | 2010-08-12 | 2014-04-25 | Thermal expansion suppressing member and anti-thermally-expansive member |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010180885 | 2010-08-12 | ||
| JP2010180885 | 2010-08-12 | ||
| JP2011097851A JP5781824B2 (ja) | 2010-08-12 | 2011-04-26 | 熱膨張抑制部材および対熱膨張性部材 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015142328A Division JP6038244B2 (ja) | 2010-08-12 | 2015-07-16 | 熱膨張抑制部材および対熱膨張性部材 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012056830A JP2012056830A (ja) | 2012-03-22 |
| JP2012056830A5 true JP2012056830A5 (enExample) | 2014-06-19 |
| JP5781824B2 JP5781824B2 (ja) | 2015-09-24 |
Family
ID=44677474
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011097851A Active JP5781824B2 (ja) | 2010-08-12 | 2011-04-26 | 熱膨張抑制部材および対熱膨張性部材 |
Country Status (4)
| Country | Link |
|---|---|
| US (2) | US8753749B2 (enExample) |
| EP (1) | EP2418923B1 (enExample) |
| JP (1) | JP5781824B2 (enExample) |
| CN (1) | CN102373032B (enExample) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5781824B2 (ja) * | 2010-08-12 | 2015-09-24 | キヤノン株式会社 | 熱膨張抑制部材および対熱膨張性部材 |
| JP5795187B2 (ja) | 2010-08-12 | 2015-10-14 | キヤノン株式会社 | 対熱膨張性樹脂および対熱膨張性金属 |
| US20140117559A1 (en) * | 2012-03-30 | 2014-05-01 | Paul A. Zimmerman | Process and material for preventing deleterious expansion of high aspect ratio copper filled through silicon vias (tsvs) |
| DE102012212898A1 (de) * | 2012-07-24 | 2014-01-30 | Carl Zeiss Smt Gmbh | Spiegelanordnung für eine EUV-Projektionsbelichtungsanlage, Verfahren zum Betreiben derselben, sowie EUV-Projektionsbelichtungsanlage |
| JP6143197B2 (ja) * | 2012-08-21 | 2017-06-07 | 国立大学法人東京工業大学 | 負熱膨張性材料 |
| JP6555473B2 (ja) * | 2015-08-31 | 2019-08-07 | 国立大学法人東京工業大学 | 負熱膨張性材料、及び複合体 |
| WO2017138643A1 (ja) | 2016-02-12 | 2017-08-17 | 国立大学法人名古屋大学 | ルテニウム酸化物およびルテニウム酸化物の製造方法 |
| JP6998051B2 (ja) * | 2018-06-08 | 2022-01-18 | 地方独立行政法人神奈川県立産業技術総合研究所 | 負熱膨張性材料、複合体、及び使用方法 |
| CN110335854B (zh) * | 2019-06-17 | 2020-12-11 | 中国科学院微电子研究所 | 一种强制对流微流道散热结构、制造方法及电子器件 |
| JP7351477B2 (ja) | 2019-07-23 | 2023-09-27 | 国立大学法人東京工業大学 | 樹脂組成物およびその樹脂成形体 |
| CN111254388B (zh) * | 2020-03-30 | 2022-06-10 | 昆山国显光电有限公司 | 掩膜外框和掩膜组件 |
| WO2023210673A1 (ja) * | 2022-04-28 | 2023-11-02 | 国立大学法人東北大学 | 結晶体、相変化メモリ、結晶体の製造方法及び相変化メモリの製造方法 |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61175035A (ja) | 1985-01-31 | 1986-08-06 | 株式会社日立製作所 | 樹脂と無機材料との複合体 |
| US5694503A (en) | 1996-09-09 | 1997-12-02 | Lucent Technologies Inc. | Article comprising a temperature compensated optical fiber refractive index grating |
| US20050191515A1 (en) | 2000-07-20 | 2005-09-01 | Shipley Company, L.L.C. | Very low thermal expansion composite |
| US6518609B1 (en) * | 2000-08-31 | 2003-02-11 | University Of Maryland | Niobium or vanadium substituted strontium titanate barrier intermediate a silicon underlayer and a functional metal oxide film |
| AU2002318144A1 (en) | 2001-05-24 | 2003-01-29 | Fry's Metals, Inc. | Thermal interface material and heat sink configuration |
| CN1894791B (zh) | 2001-05-24 | 2011-01-26 | 弗莱氏金属公司 | 传热界面材料以及焊料预制品 |
| JP4797148B2 (ja) * | 2003-10-08 | 2011-10-19 | 独立行政法人産業技術総合研究所 | 熱電変換材料接続用導電性ペースト |
| JP4379798B2 (ja) * | 2004-05-19 | 2009-12-09 | 日立粉末冶金株式会社 | 金属−セラミックス焼結積層体の製造方法 |
| JP4446064B2 (ja) * | 2004-07-07 | 2010-04-07 | 独立行政法人産業技術総合研究所 | 熱電変換素子及び熱電変換モジュール |
| JP5099478B2 (ja) | 2004-07-30 | 2012-12-19 | 独立行政法人理化学研究所 | 熱膨張抑制剤、ゼロ熱膨張材料、熱膨張抑制方法および熱膨張抑制剤の製造方法 |
| US20070135550A1 (en) | 2005-12-14 | 2007-06-14 | Nirupama Chakrapani | Negative thermal expansion material filler for low CTE composites |
| JP2007194429A (ja) | 2006-01-19 | 2007-08-02 | Fujitsu Ltd | 強磁性・強誘電性材料及び半導体装置 |
| US8232621B2 (en) * | 2006-07-28 | 2012-07-31 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| JP2008260892A (ja) | 2007-04-13 | 2008-10-30 | Sekisui Chem Co Ltd | 電子部品用接着剤 |
| JP2010021429A (ja) | 2008-07-11 | 2010-01-28 | Murata Mfg Co Ltd | 電子機器およびその製造方法 |
| JP2010029990A (ja) * | 2008-07-29 | 2010-02-12 | National Institute Of Advanced Industrial & Technology | 負熱膨張率材料および該負熱膨張率材料を含む複合材料 |
| WO2010101153A1 (ja) | 2009-03-04 | 2010-09-10 | 国立大学法人京都大学 | Ａサイト秩序型ペロブスカイト酸化物 |
| JP5795187B2 (ja) | 2010-08-12 | 2015-10-14 | キヤノン株式会社 | 対熱膨張性樹脂および対熱膨張性金属 |
| JP5781824B2 (ja) * | 2010-08-12 | 2015-09-24 | キヤノン株式会社 | 熱膨張抑制部材および対熱膨張性部材 |
| JP6143197B2 (ja) | 2012-08-21 | 2017-06-07 | 国立大学法人東京工業大学 | 負熱膨張性材料 |
-
2011
- 2011-04-26 JP JP2011097851A patent/JP5781824B2/ja active Active
- 2011-08-08 US US13/205,272 patent/US8753749B2/en active Active
- 2011-08-09 CN CN201110226208.1A patent/CN102373032B/zh active Active
- 2011-08-11 EP EP11177212.5A patent/EP2418923B1/en active Active
-
2014
- 2014-04-25 US US14/262,012 patent/US10124558B2/en active Active
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