JP2012057142A5 - - Google Patents
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- Publication number
- JP2012057142A5 JP2012057142A5 JP2011097852A JP2011097852A JP2012057142A5 JP 2012057142 A5 JP2012057142 A5 JP 2012057142A5 JP 2011097852 A JP2011097852 A JP 2011097852A JP 2011097852 A JP2011097852 A JP 2011097852A JP 2012057142 A5 JP2012057142 A5 JP 2012057142A5
- Authority
- JP
- Japan
- Prior art keywords
- metal
- resin
- linear expansion
- thermally expandable
- expansion coefficient
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052751 metal Inorganic materials 0.000 claims 11
- 239000002184 metal Substances 0.000 claims 11
- 239000011347 resin Substances 0.000 claims 8
- 229920005989 resin Polymers 0.000 claims 8
- 239000000463 material Substances 0.000 claims 5
- 239000002245 particle Substances 0.000 claims 4
- 239000007787 solid Substances 0.000 claims 4
- 229910052692 Dysprosium Inorganic materials 0.000 claims 2
- 229910052691 Erbium Inorganic materials 0.000 claims 2
- 229910052693 Europium Inorganic materials 0.000 claims 2
- 229910052688 Gadolinium Inorganic materials 0.000 claims 2
- 229910052689 Holmium Inorganic materials 0.000 claims 2
- 229910052765 Lutetium Inorganic materials 0.000 claims 2
- 229910052779 Neodymium Inorganic materials 0.000 claims 2
- 229910052777 Praseodymium Inorganic materials 0.000 claims 2
- 229910052772 Samarium Inorganic materials 0.000 claims 2
- 229910052771 Terbium Inorganic materials 0.000 claims 2
- 229910052775 Thulium Inorganic materials 0.000 claims 2
- 229910052769 Ytterbium Inorganic materials 0.000 claims 2
- 229910052738 indium Inorganic materials 0.000 claims 2
- 229910052746 lanthanum Inorganic materials 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- 229910052727 yttrium Inorganic materials 0.000 claims 2
- 239000004693 Polybenzimidazole Substances 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 239000003990 capacitor Substances 0.000 claims 1
- 239000012776 electronic material Substances 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 claims 1
- 238000003384 imaging method Methods 0.000 claims 1
- 239000004973 liquid crystal related substance Substances 0.000 claims 1
- 230000003287 optical effect Effects 0.000 claims 1
- 108091008695 photoreceptors Proteins 0.000 claims 1
- 229920002480 polybenzimidazole Polymers 0.000 claims 1
- 239000003566 sealing material Substances 0.000 claims 1
- 125000006850 spacer group Chemical group 0.000 claims 1
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011097852A JP5795187B2 (ja) | 2010-08-12 | 2011-04-26 | 対熱膨張性樹脂および対熱膨張性金属 |
| US13/205,258 US8664316B2 (en) | 2010-08-12 | 2011-08-08 | Anti-thermally-expansive resin and anti-thermally-expansive metal |
| CN201110228962.9A CN102399443B (zh) | 2010-08-12 | 2011-08-11 | 抗热膨胀性树脂和抗热膨胀性金属 |
| EP11177211A EP2418240B1 (en) | 2010-08-12 | 2011-08-11 | Anti-thermally-expansive resin and anti-thermally-expansive metal |
| US14/152,404 US8974729B2 (en) | 2010-08-12 | 2014-01-10 | Anti-thermally-expansive resin and anti-thermally-expansive metal |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010180886 | 2010-08-12 | ||
| JP2010180886 | 2010-08-12 | ||
| JP2011097852A JP5795187B2 (ja) | 2010-08-12 | 2011-04-26 | 対熱膨張性樹脂および対熱膨張性金属 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012057142A JP2012057142A (ja) | 2012-03-22 |
| JP2012057142A5 true JP2012057142A5 (enExample) | 2014-06-19 |
| JP5795187B2 JP5795187B2 (ja) | 2015-10-14 |
Family
ID=44645548
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011097852A Active JP5795187B2 (ja) | 2010-08-12 | 2011-04-26 | 対熱膨張性樹脂および対熱膨張性金属 |
Country Status (4)
| Country | Link |
|---|---|
| US (2) | US8664316B2 (enExample) |
| EP (1) | EP2418240B1 (enExample) |
| JP (1) | JP5795187B2 (enExample) |
| CN (1) | CN102399443B (enExample) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5781824B2 (ja) * | 2010-08-12 | 2015-09-24 | キヤノン株式会社 | 熱膨張抑制部材および対熱膨張性部材 |
| JPWO2014010197A1 (ja) * | 2012-07-11 | 2016-06-20 | スカイワークス・パナソニック フィルターソリューションズ ジャパン株式会社 | 電子部品 |
| CN103982868B (zh) * | 2014-04-30 | 2018-09-07 | 合肥京东方显示光源有限公司 | 一种自缓冲元件及其制备方法、背光模组、显示装置 |
| DE102015100863B4 (de) * | 2015-01-21 | 2022-03-03 | Infineon Technologies Ag | Verfahren zur Handhabung eines Produktsubstrats und ein verklebtes Substratsystem |
| JP6546483B2 (ja) * | 2015-08-31 | 2019-07-17 | 地方独立行政法人神奈川県立産業技術総合研究所 | 負熱膨張性材料の製造方法 |
| JP6555473B2 (ja) * | 2015-08-31 | 2019-08-07 | 国立大学法人東京工業大学 | 負熱膨張性材料、及び複合体 |
| JP6619641B2 (ja) * | 2015-12-14 | 2019-12-11 | 株式会社小糸製作所 | 光源ユニット、及び、それを用いた灯具 |
| US10567508B2 (en) * | 2017-04-28 | 2020-02-18 | Facebook, Inc. | Media file upload awareness for online systems |
| RU2676537C1 (ru) * | 2017-09-06 | 2019-01-09 | Дмитрий Александрович Серебренников | Композитный материал с инварными свойствами |
| CN112136194B (zh) * | 2018-06-21 | 2022-05-31 | 京瓷Avx元器件公司 | 在高温下具有稳定电性质的固体电解质电容器 |
| JP7351477B2 (ja) | 2019-07-23 | 2023-09-27 | 国立大学法人東京工業大学 | 樹脂組成物およびその樹脂成形体 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4999336A (en) * | 1983-12-13 | 1991-03-12 | Scm Metal Products, Inc. | Dispersion strengthened metal composites |
| JPS61175035A (ja) * | 1985-01-31 | 1986-08-06 | 株式会社日立製作所 | 樹脂と無機材料との複合体 |
| US5694503A (en) | 1996-09-09 | 1997-12-02 | Lucent Technologies Inc. | Article comprising a temperature compensated optical fiber refractive index grating |
| US6132676A (en) * | 1997-06-30 | 2000-10-17 | Massachusetts Institute Of Technology | Minimal thermal expansion, high thermal conductivity metal-ceramic matrix composite |
| US20050191515A1 (en) | 2000-07-20 | 2005-09-01 | Shipley Company, L.L.C. | Very low thermal expansion composite |
| US6518609B1 (en) | 2000-08-31 | 2003-02-11 | University Of Maryland | Niobium or vanadium substituted strontium titanate barrier intermediate a silicon underlayer and a functional metal oxide film |
| CN1894791B (zh) | 2001-05-24 | 2011-01-26 | 弗莱氏金属公司 | 传热界面材料以及焊料预制品 |
| AU2002318144A1 (en) | 2001-05-24 | 2003-01-29 | Fry's Metals, Inc. | Thermal interface material and heat sink configuration |
| US7105235B2 (en) * | 2002-05-17 | 2006-09-12 | Her Majesty The Queen In Right Of Canada As Represented By The Minister Of Natural Resources | Isotropic zero CTE reinforced composite materials |
| JP4797148B2 (ja) | 2003-10-08 | 2011-10-19 | 独立行政法人産業技術総合研究所 | 熱電変換材料接続用導電性ペースト |
| JP4446064B2 (ja) | 2004-07-07 | 2010-04-07 | 独立行政法人産業技術総合研究所 | 熱電変換素子及び熱電変換モジュール |
| JP5099478B2 (ja) | 2004-07-30 | 2012-12-19 | 独立行政法人理化学研究所 | 熱膨張抑制剤、ゼロ熱膨張材料、熱膨張抑制方法および熱膨張抑制剤の製造方法 |
| US20070135550A1 (en) * | 2005-12-14 | 2007-06-14 | Nirupama Chakrapani | Negative thermal expansion material filler for low CTE composites |
| JP2008260892A (ja) * | 2007-04-13 | 2008-10-30 | Sekisui Chem Co Ltd | 電子部品用接着剤 |
| JP2010021429A (ja) | 2008-07-11 | 2010-01-28 | Murata Mfg Co Ltd | 電子機器およびその製造方法 |
| JP2010029990A (ja) * | 2008-07-29 | 2010-02-12 | National Institute Of Advanced Industrial & Technology | 負熱膨張率材料および該負熱膨張率材料を含む複合材料 |
| JP5781824B2 (ja) | 2010-08-12 | 2015-09-24 | キヤノン株式会社 | 熱膨張抑制部材および対熱膨張性部材 |
-
2011
- 2011-04-26 JP JP2011097852A patent/JP5795187B2/ja active Active
- 2011-08-08 US US13/205,258 patent/US8664316B2/en active Active
- 2011-08-11 EP EP11177211A patent/EP2418240B1/en active Active
- 2011-08-11 CN CN201110228962.9A patent/CN102399443B/zh active Active
-
2014
- 2014-01-10 US US14/152,404 patent/US8974729B2/en active Active
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