JP5776089B2 - 部品実装装置 - Google Patents

部品実装装置 Download PDF

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Publication number
JP5776089B2
JP5776089B2 JP2014512650A JP2014512650A JP5776089B2 JP 5776089 B2 JP5776089 B2 JP 5776089B2 JP 2014512650 A JP2014512650 A JP 2014512650A JP 2014512650 A JP2014512650 A JP 2014512650A JP 5776089 B2 JP5776089 B2 JP 5776089B2
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JP
Japan
Prior art keywords
component
nozzle
component mounting
image
mounting apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2014512650A
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English (en)
Japanese (ja)
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JPWO2013161878A1 (ja
Inventor
功 高平
功 高平
高志 三枝
高志 三枝
井上　智博
智博 井上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yamaha Motor Co Ltd
Original Assignee
Yamaha Motor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamaha Motor Co Ltd filed Critical Yamaha Motor Co Ltd
Priority to JP2014512650A priority Critical patent/JP5776089B2/ja
Application granted granted Critical
Publication of JP5776089B2 publication Critical patent/JP5776089B2/ja
Publication of JPWO2013161878A1 publication Critical patent/JPWO2013161878A1/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement

Landscapes

  • Engineering & Computer Science (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP2014512650A 2012-04-27 2013-04-24 部品実装装置 Active JP5776089B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2014512650A JP5776089B2 (ja) 2012-04-27 2013-04-24 部品実装装置

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2012101996 2012-04-27
JP2012101996 2012-04-27
PCT/JP2013/062078 WO2013161878A1 (ja) 2012-04-27 2013-04-24 部品実装装置
JP2014512650A JP5776089B2 (ja) 2012-04-27 2013-04-24 部品実装装置

Publications (2)

Publication Number Publication Date
JP5776089B2 true JP5776089B2 (ja) 2015-09-09
JPWO2013161878A1 JPWO2013161878A1 (ja) 2015-12-24

Family

ID=49483186

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014512650A Active JP5776089B2 (ja) 2012-04-27 2013-04-24 部品実装装置

Country Status (3)

Country Link
JP (1) JP5776089B2 (zh)
CN (1) CN104285508B (zh)
WO (1) WO2013161878A1 (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10452050B2 (en) 2014-06-18 2019-10-22 Hitachi, Ltd. Positioning system
WO2016092651A1 (ja) * 2014-12-10 2016-06-16 富士機械製造株式会社 部品実装機
WO2016157287A1 (ja) * 2015-03-27 2016-10-06 富士機械製造株式会社 部品実装機
KR102482124B1 (ko) * 2016-01-25 2022-12-27 한화정밀기계 주식회사 칩 부품 마운터의 오차 최소화 방법
JP7316489B2 (ja) * 2019-05-17 2023-07-28 パナソニックＩｐマネジメント株式会社 部品実装装置
JPWO2021060064A1 (zh) * 2019-09-27 2021-04-01
JPWO2021060065A1 (zh) * 2019-09-27 2021-04-01

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07115296A (ja) * 1993-10-15 1995-05-02 Sanyo Electric Co Ltd 部品実装機の制御装置
JP2001127500A (ja) * 1999-10-25 2001-05-11 Murata Mfg Co Ltd チップマウンタの部品撮像装置
JP2003008295A (ja) * 2001-06-25 2003-01-10 Matsushita Electric Ind Co Ltd 電子部品装着方法及びその装置
JP2003234600A (ja) * 2002-02-08 2003-08-22 Matsushita Electric Ind Co Ltd 部品実装機の検査方法および装置
JP4851361B2 (ja) * 2007-02-19 2012-01-11 富士機械製造株式会社 電子回路部品装着装置
JP2011216616A (ja) * 2010-03-31 2011-10-27 Panasonic Corp 部品実装装置および部品実装方法
JP5302925B2 (ja) * 2010-03-31 2013-10-02 パナソニック株式会社 部品実装装置および部品実装方法
JP5721222B2 (ja) * 2011-05-31 2015-05-20 三星テクウィン株式会社Ｓａｍｓｕｎｇ Ｔｅｃｈｗｉｎ Ｃｏ．， Ｌｔｄ 電子部品実装装置

Also Published As

Publication number Publication date
CN104285508A (zh) 2015-01-14
CN104285508B (zh) 2017-10-24
JPWO2013161878A1 (ja) 2015-12-24
WO2013161878A1 (ja) 2013-10-31

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