JP5775747B2 - 配線基板及びその製造方法 - Google Patents

配線基板及びその製造方法 Download PDF

Info

Publication number
JP5775747B2
JP5775747B2 JP2011125329A JP2011125329A JP5775747B2 JP 5775747 B2 JP5775747 B2 JP 5775747B2 JP 2011125329 A JP2011125329 A JP 2011125329A JP 2011125329 A JP2011125329 A JP 2011125329A JP 5775747 B2 JP5775747 B2 JP 5775747B2
Authority
JP
Japan
Prior art keywords
layer
substrate body
insulating film
wiring
groove
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2011125329A
Other languages
English (en)
Japanese (ja)
Other versions
JP2012253227A5 (enExample
JP2012253227A (ja
Inventor
理絵 新井
理絵 新井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2011125329A priority Critical patent/JP5775747B2/ja
Priority to US13/479,833 priority patent/US8723051B2/en
Publication of JP2012253227A publication Critical patent/JP2012253227A/ja
Publication of JP2012253227A5 publication Critical patent/JP2012253227A5/ja
Application granted granted Critical
Publication of JP5775747B2 publication Critical patent/JP5775747B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/06—Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H05K3/4605—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated made from inorganic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09563—Metal filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP2011125329A 2011-06-03 2011-06-03 配線基板及びその製造方法 Active JP5775747B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2011125329A JP5775747B2 (ja) 2011-06-03 2011-06-03 配線基板及びその製造方法
US13/479,833 US8723051B2 (en) 2011-06-03 2012-05-24 Wiring substrate and method for manufacturing wiring substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011125329A JP5775747B2 (ja) 2011-06-03 2011-06-03 配線基板及びその製造方法

Publications (3)

Publication Number Publication Date
JP2012253227A JP2012253227A (ja) 2012-12-20
JP2012253227A5 JP2012253227A5 (enExample) 2014-05-29
JP5775747B2 true JP5775747B2 (ja) 2015-09-09

Family

ID=47261549

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011125329A Active JP5775747B2 (ja) 2011-06-03 2011-06-03 配線基板及びその製造方法

Country Status (2)

Country Link
US (1) US8723051B2 (enExample)
JP (1) JP5775747B2 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20130097481A (ko) * 2012-02-24 2013-09-03 삼성전자주식회사 인쇄회로기판(ｐｃｂ) 및 그 ｐｃｂ를 포함한 메모리 모듈
JP2014236102A (ja) * 2013-05-31 2014-12-15 凸版印刷株式会社 貫通電極付き配線基板、その製造方法及び半導体装置
WO2015005029A1 (ja) * 2013-07-11 2015-01-15 株式会社村田製作所 樹脂多層基板、および樹脂多層基板の製造方法
JP6600573B2 (ja) * 2015-03-31 2019-10-30 新光電気工業株式会社 配線基板及び半導体パッケージ
CN109661125B (zh) * 2017-10-12 2021-11-16 宏启胜精密电子(秦皇岛)有限公司 电路板及其制作方法
KR102442256B1 (ko) * 2020-11-05 2022-09-08 성균관대학교산학협력단 보이드가 없는 실리콘 관통전극의 제조방법
CN114916127B (zh) * 2021-02-09 2025-06-17 苏州旭创科技有限公司 电路板及其制造方法
US20230197592A1 (en) * 2021-12-16 2023-06-22 Intel Corporation Power delivery techniques for glass substrate with high density signal vias

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4278806B2 (ja) * 1999-12-13 2009-06-17 イビデン株式会社 多層プリント配線板及び多層プリント配線板の製造方法
JP4129971B2 (ja) 2000-12-01 2008-08-06 新光電気工業株式会社 配線基板の製造方法
JP2002217553A (ja) * 2001-01-12 2002-08-02 Sony Corp 多層プリント配線板および多層プリント配線板の製造方法
JP4181778B2 (ja) * 2002-02-05 2008-11-19 ソニー株式会社 配線基板の製造方法
JP4056854B2 (ja) 2002-11-05 2008-03-05 新光電気工業株式会社 半導体装置の製造方法
KR101162522B1 (ko) * 2003-04-07 2012-07-09 이비덴 가부시키가이샤 다층프린트배선판
JP2005183466A (ja) * 2003-12-16 2005-07-07 Ibiden Co Ltd 多層プリント配線板
JP4387231B2 (ja) 2004-03-31 2009-12-16 新光電気工業株式会社 キャパシタ実装配線基板及びその製造方法
US20060237227A1 (en) * 2005-04-26 2006-10-26 Shiyou Zhao Circuit board via structure for high speed signaling
JP4716819B2 (ja) * 2005-08-22 2011-07-06 新光電気工業株式会社 インターポーザの製造方法
JP4824397B2 (ja) * 2005-12-27 2011-11-30 イビデン株式会社 多層プリント配線板
JPWO2010134511A1 (ja) * 2009-05-20 2012-11-12 日本電気株式会社 半導体装置及び半導体装置の製造方法
KR101018109B1 (ko) * 2009-08-24 2011-02-25 삼성전기주식회사 다층 배선 기판 및 그의 제조방법
TWI399150B (zh) * 2009-12-31 2013-06-11 Unimicron Technology Corp 線路板及其製程

Also Published As

Publication number Publication date
US8723051B2 (en) 2014-05-13
JP2012253227A (ja) 2012-12-20
US20120307470A1 (en) 2012-12-06

Similar Documents

Publication Publication Date Title
JP4937842B2 (ja) 半導体装置およびその製造方法
JP5775747B2 (ja) 配線基板及びその製造方法
US9392705B2 (en) Wiring board with through wiring
TWI532139B (zh) 晶片封裝體及其形成方法
US8907489B2 (en) Wiring substrate, method of manufacturing the same, and semiconductor device
JP4601686B2 (ja) 半導体装置および半導体装置の製造方法
CN108538801B (zh) 半导体衬底及半导体封装装置，以及用于形成半导体衬底的方法
KR20140005107A (ko) 기판, 기판의 제조 방법, 반도체 장치, 및 전자 기기
TWI514491B (zh) 半導體基板及其製造方法
JPWO2009084300A1 (ja) インターポーザー及びインターポーザーの製造方法
JP2008210933A (ja) 半導体装置
JP2013062296A (ja) 配線基板、及び半導体パッケージ
CN116889107A (zh) 多层配线基板
KR101139650B1 (ko) 배선 기판, 그 제조 방법, 및 반도체 장치
US8895868B2 (en) Wiring substrate
CN102891120B (zh) 晶片封装体及其形成方法
JP2012134526A (ja) 半導体装置
JP5006026B2 (ja) 半導体装置
CN220627797U (zh) 电子器件
CN102339810B (zh) 硅基基板及其制作方法
CN102891133A (zh) 晶片封装体及其形成方法
JP2011238742A (ja) 配線基板の製造方法及び配線基板
TWI470760B (zh) 晶片封裝體及其形成方法
TWI459529B (zh) 晶片封裝體及其形成方法
JP2018101748A (ja) 半導体装置およびその製造方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20140416

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20140416

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20141104

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20141216

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20150428

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20150612

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20150630

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20150706

R150 Certificate of patent or registration of utility model

Ref document number: 5775747

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150