JP5760923B2 - 固体撮像装置の製造方法 - Google Patents

固体撮像装置の製造方法 Download PDF

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Publication number
JP5760923B2
JP5760923B2 JP2011220310A JP2011220310A JP5760923B2 JP 5760923 B2 JP5760923 B2 JP 5760923B2 JP 2011220310 A JP2011220310 A JP 2011220310A JP 2011220310 A JP2011220310 A JP 2011220310A JP 5760923 B2 JP5760923 B2 JP 5760923B2
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JP
Japan
Prior art keywords
film
wiring
insulating layer
imaging device
state imaging
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Expired - Fee Related
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JP2011220310A
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English (en)
Japanese (ja)
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JP2013080838A5 (ru
JP2013080838A (ja
Inventor
健太郎 秋山
健太郎 秋山
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Sony Corp
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Sony Corp
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Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP2011220310A priority Critical patent/JP5760923B2/ja
Priority to TW101133370A priority patent/TWI577001B/zh
Priority to CN201610686559.3A priority patent/CN106169493B/zh
Priority to DE202012013576.7U priority patent/DE202012013576U1/de
Priority to EP19177082.5A priority patent/EP3561873B1/en
Priority to CN201280045395.6A priority patent/CN103797579B/zh
Priority to US14/346,607 priority patent/US9184205B2/en
Priority to EP12838953.3A priority patent/EP2747139B1/en
Priority to PCT/JP2012/074945 priority patent/WO2013051462A1/ja
Priority to KR1020147006318A priority patent/KR102051155B1/ko
Publication of JP2013080838A publication Critical patent/JP2013080838A/ja
Publication of JP2013080838A5 publication Critical patent/JP2013080838A5/ja
Application granted granted Critical
Publication of JP5760923B2 publication Critical patent/JP5760923B2/ja
Priority to US14/871,345 priority patent/US9374511B2/en
Priority to US15/087,729 priority patent/US9576998B2/en
Priority to US15/411,470 priority patent/US10312281B2/en
Priority to US16/413,045 priority patent/US11329091B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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  • Transforming Light Signals Into Electric Signals (AREA)
  • Solid State Image Pick-Up Elements (AREA)
JP2011220310A 2011-10-04 2011-10-04 固体撮像装置の製造方法 Expired - Fee Related JP5760923B2 (ja)

Priority Applications (14)

Application Number Priority Date Filing Date Title
JP2011220310A JP5760923B2 (ja) 2011-10-04 2011-10-04 固体撮像装置の製造方法
TW101133370A TWI577001B (zh) 2011-10-04 2012-09-12 固體攝像裝置、固體攝像裝置之製造方法及電子機器
KR1020147006318A KR102051155B1 (ko) 2011-10-04 2012-09-27 고체 촬상 장치, 고체 촬상 장치의 제조 방법 및 전자 기기
EP19177082.5A EP3561873B1 (en) 2011-10-04 2012-09-27 Solid-state image pickup unit, method of manufacturing solid-state image pickup unit, and electronic apparatus
CN201280045395.6A CN103797579B (zh) 2011-10-04 2012-09-27 固态图像拾取单元、制造固态图像拾取单元的方法和电子设备
US14/346,607 US9184205B2 (en) 2011-10-04 2012-09-27 Solid-state image pickup unit, method of manufacturing solid-state image pickup unit, and electronic apparatus
EP12838953.3A EP2747139B1 (en) 2011-10-04 2012-09-27 Semiconductor image pickup device, method for making semiconductor image pickup device, and electronic device
PCT/JP2012/074945 WO2013051462A1 (ja) 2011-10-04 2012-09-27 固体撮像装置、固体撮像装置の製造方法、および電子機器
CN201610686559.3A CN106169493B (zh) 2011-10-04 2012-09-27 固态图像拾取单元和电子设备
DE202012013576.7U DE202012013576U1 (de) 2011-10-04 2012-09-27 Festkörper-Bildaufnahmeeinheit und elektronische Vorrichtung
US14/871,345 US9374511B2 (en) 2011-10-04 2015-09-30 Solid-state image pickup unit, method of manufacturing solid-state image pickup unit, and electronic apparatus
US15/087,729 US9576998B2 (en) 2011-10-04 2016-03-31 Solid-state image pickup unit, method of manufacturing solid-state image pickup unit, and electronic apparatus
US15/411,470 US10312281B2 (en) 2011-10-04 2017-01-20 Solid-state image pickup unit, method of manufacturing solid-state image pickup unit, and electronic apparatus
US16/413,045 US11329091B2 (en) 2011-10-04 2019-05-15 Solid-state image pickup unit, method of manufacturing solid-state image pickup unit, and electronic apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011220310A JP5760923B2 (ja) 2011-10-04 2011-10-04 固体撮像装置の製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2015077492A Division JP5994887B2 (ja) 2015-04-06 2015-04-06 固体撮像装置、固体撮像装置の製造方法、および電子機器

Publications (3)

Publication Number Publication Date
JP2013080838A JP2013080838A (ja) 2013-05-02
JP2013080838A5 JP2013080838A5 (ru) 2014-11-13
JP5760923B2 true JP5760923B2 (ja) 2015-08-12

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011220310A Expired - Fee Related JP5760923B2 (ja) 2011-10-04 2011-10-04 固体撮像装置の製造方法

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JP (1) JP5760923B2 (ru)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5421475B2 (ja) * 2012-07-04 2014-02-19 誠 雫石 撮像素子、半導体集積回路及び撮像装置
JP5424371B1 (ja) * 2013-05-08 2014-02-26 誠 雫石 固体撮像素子及び撮像装置
KR102047920B1 (ko) * 2013-09-11 2019-11-25 삼성디스플레이 주식회사 표시 장치용 패널 및 그 제조 방법
TW202407993A (zh) 2013-11-06 2024-02-16 日商新力股份有限公司 固體攝像裝置及其製造方法、及電子機器
KR102177702B1 (ko) 2014-02-03 2020-11-11 삼성전자주식회사 비아 플러그를 갖는 비아 구조체 및 반도체 소자
JP2015170702A (ja) * 2014-03-06 2015-09-28 ソニー株式会社 固体撮像装置およびその製造方法、並びに電子機器
JP2016146376A (ja) * 2015-02-06 2016-08-12 ルネサスエレクトロニクス株式会社 撮像装置およびその製造方法
TWI692859B (zh) 2015-05-15 2020-05-01 日商新力股份有限公司 固體攝像裝置及其製造方法、以及電子機器
JP2017168531A (ja) * 2016-03-14 2017-09-21 株式会社リコー 固体撮像装置及び固体撮像装置の製造方法
JP2019040893A (ja) * 2017-08-22 2019-03-14 ソニーセミコンダクタソリューションズ株式会社 固体撮像装置およびその製造方法、並びに電子機器
JP2017216480A (ja) * 2017-09-01 2017-12-07 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
WO2019092938A1 (ja) * 2017-11-13 2019-05-16 オリンパス株式会社 半導体基板、半導体基板積層体および内視鏡
US10950178B2 (en) * 2018-02-20 2021-03-16 Emagin Corporation Microdisplay with reduced pixel size and method of forming same
WO2021199680A1 (ja) * 2020-03-31 2021-10-07 ソニーセミコンダクタソリューションズ株式会社 受光素子および電子機器
KR20210122525A (ko) * 2020-04-01 2021-10-12 에스케이하이닉스 주식회사 이미지 센서 장치
KR20210137677A (ko) * 2020-05-11 2021-11-18 에스케이하이닉스 주식회사 이미지 센서 장치
US20230170353A1 (en) * 2020-06-18 2023-06-01 Sony Semiconductor Solutions Corporation Display apparatus, method of manufacturing display apparatus, and electronic apparatus
JP2023022718A (ja) * 2021-08-03 2023-02-15 ソニーセミコンダクタソリューションズ株式会社 撮像装置及びその製造方法、電子機器
WO2024024450A1 (ja) * 2022-07-26 2024-02-01 ソニーセミコンダクタソリューションズ株式会社 半導体装置及びその製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1168074A (ja) * 1997-08-13 1999-03-09 Sony Corp 固体撮像素子
JP4979154B2 (ja) * 2000-06-07 2012-07-18 ルネサスエレクトロニクス株式会社 半導体装置
JP2003209235A (ja) * 2002-01-16 2003-07-25 Sony Corp 固体撮像素子及びその製造方法
JP2006261638A (ja) * 2005-02-21 2006-09-28 Sony Corp 固体撮像装置および固体撮像装置の駆動方法
JP5268618B2 (ja) * 2008-12-18 2013-08-21 株式会社東芝 半導体装置
JP5985136B2 (ja) * 2009-03-19 2016-09-06 ソニー株式会社 半導体装置とその製造方法、及び電子機器
JP5442394B2 (ja) * 2009-10-29 2014-03-12 ソニー株式会社 固体撮像装置とその製造方法、及び電子機器
JP2010199602A (ja) * 2010-04-16 2010-09-09 Sony Corp 固体撮像素子及びその製造方法

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