JP2013080838A5 - - Google Patents

Download PDF

Info

Publication number
JP2013080838A5
JP2013080838A5 JP2011220310A JP2011220310A JP2013080838A5 JP 2013080838 A5 JP2013080838 A5 JP 2013080838A5 JP 2011220310 A JP2011220310 A JP 2011220310A JP 2011220310 A JP2011220310 A JP 2011220310A JP 2013080838 A5 JP2013080838 A5 JP 2013080838A5
Authority
JP
Japan
Prior art keywords
light receiving
insulating layer
sensor substrate
receiving surface
imaging device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2011220310A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013080838A (ja
JP5760923B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2011220310A external-priority patent/JP5760923B2/ja
Priority to JP2011220310A priority Critical patent/JP5760923B2/ja
Priority to TW101133370A priority patent/TWI577001B/zh
Priority to EP19177082.5A priority patent/EP3561873B1/en
Priority to CN201610686559.3A priority patent/CN106169493B/zh
Priority to CN201280045395.6A priority patent/CN103797579B/zh
Priority to DE202012013576.7U priority patent/DE202012013576U1/de
Priority to PCT/JP2012/074945 priority patent/WO2013051462A1/ja
Priority to KR1020147006318A priority patent/KR102051155B1/ko
Priority to EP12838953.3A priority patent/EP2747139B1/en
Priority to US14/346,607 priority patent/US9184205B2/en
Publication of JP2013080838A publication Critical patent/JP2013080838A/ja
Publication of JP2013080838A5 publication Critical patent/JP2013080838A5/ja
Publication of JP5760923B2 publication Critical patent/JP5760923B2/ja
Application granted granted Critical
Priority to US14/871,345 priority patent/US9374511B2/en
Priority to US15/087,729 priority patent/US9576998B2/en
Priority to US15/411,470 priority patent/US10312281B2/en
Priority to US16/413,045 priority patent/US11329091B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2011220310A 2011-10-04 2011-10-04 固体撮像装置の製造方法 Expired - Fee Related JP5760923B2 (ja)

Priority Applications (14)

Application Number Priority Date Filing Date Title
JP2011220310A JP5760923B2 (ja) 2011-10-04 2011-10-04 固体撮像装置の製造方法
TW101133370A TWI577001B (zh) 2011-10-04 2012-09-12 固體攝像裝置、固體攝像裝置之製造方法及電子機器
KR1020147006318A KR102051155B1 (ko) 2011-10-04 2012-09-27 고체 촬상 장치, 고체 촬상 장치의 제조 방법 및 전자 기기
US14/346,607 US9184205B2 (en) 2011-10-04 2012-09-27 Solid-state image pickup unit, method of manufacturing solid-state image pickup unit, and electronic apparatus
CN201610686559.3A CN106169493B (zh) 2011-10-04 2012-09-27 固态图像拾取单元和电子设备
CN201280045395.6A CN103797579B (zh) 2011-10-04 2012-09-27 固态图像拾取单元、制造固态图像拾取单元的方法和电子设备
DE202012013576.7U DE202012013576U1 (de) 2011-10-04 2012-09-27 Festkörper-Bildaufnahmeeinheit und elektronische Vorrichtung
PCT/JP2012/074945 WO2013051462A1 (ja) 2011-10-04 2012-09-27 固体撮像装置、固体撮像装置の製造方法、および電子機器
EP19177082.5A EP3561873B1 (en) 2011-10-04 2012-09-27 Solid-state image pickup unit, method of manufacturing solid-state image pickup unit, and electronic apparatus
EP12838953.3A EP2747139B1 (en) 2011-10-04 2012-09-27 Semiconductor image pickup device, method for making semiconductor image pickup device, and electronic device
US14/871,345 US9374511B2 (en) 2011-10-04 2015-09-30 Solid-state image pickup unit, method of manufacturing solid-state image pickup unit, and electronic apparatus
US15/087,729 US9576998B2 (en) 2011-10-04 2016-03-31 Solid-state image pickup unit, method of manufacturing solid-state image pickup unit, and electronic apparatus
US15/411,470 US10312281B2 (en) 2011-10-04 2017-01-20 Solid-state image pickup unit, method of manufacturing solid-state image pickup unit, and electronic apparatus
US16/413,045 US11329091B2 (en) 2011-10-04 2019-05-15 Solid-state image pickup unit, method of manufacturing solid-state image pickup unit, and electronic apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011220310A JP5760923B2 (ja) 2011-10-04 2011-10-04 固体撮像装置の製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2015077492A Division JP5994887B2 (ja) 2015-04-06 2015-04-06 固体撮像装置、固体撮像装置の製造方法、および電子機器

Publications (3)

Publication Number Publication Date
JP2013080838A JP2013080838A (ja) 2013-05-02
JP2013080838A5 true JP2013080838A5 (ru) 2014-11-13
JP5760923B2 JP5760923B2 (ja) 2015-08-12

Family

ID=48526995

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011220310A Expired - Fee Related JP5760923B2 (ja) 2011-10-04 2011-10-04 固体撮像装置の製造方法

Country Status (1)

Country Link
JP (1) JP5760923B2 (ru)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5421475B2 (ja) 2012-07-04 2014-02-19 誠 雫石 撮像素子、半導体集積回路及び撮像装置
JP5424371B1 (ja) 2013-05-08 2014-02-26 誠 雫石 固体撮像素子及び撮像装置
KR102047920B1 (ko) * 2013-09-11 2019-11-25 삼성디스플레이 주식회사 표시 장치용 패널 및 그 제조 방법
TW202407993A (zh) 2013-11-06 2024-02-16 日商新力股份有限公司 固體攝像裝置及其製造方法、及電子機器
KR102177702B1 (ko) 2014-02-03 2020-11-11 삼성전자주식회사 비아 플러그를 갖는 비아 구조체 및 반도체 소자
JP2015170702A (ja) * 2014-03-06 2015-09-28 ソニー株式会社 固体撮像装置およびその製造方法、並びに電子機器
JP2016146376A (ja) * 2015-02-06 2016-08-12 ルネサスエレクトロニクス株式会社 撮像装置およびその製造方法
TWI692859B (zh) 2015-05-15 2020-05-01 日商新力股份有限公司 固體攝像裝置及其製造方法、以及電子機器
JP2017168531A (ja) * 2016-03-14 2017-09-21 株式会社リコー 固体撮像装置及び固体撮像装置の製造方法
JP2019040893A (ja) * 2017-08-22 2019-03-14 ソニーセミコンダクタソリューションズ株式会社 固体撮像装置およびその製造方法、並びに電子機器
JP2017216480A (ja) * 2017-09-01 2017-12-07 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
WO2019092938A1 (ja) * 2017-11-13 2019-05-16 オリンパス株式会社 半導体基板、半導体基板積層体および内視鏡
US10950178B2 (en) * 2018-02-20 2021-03-16 Emagin Corporation Microdisplay with reduced pixel size and method of forming same
US20230178579A1 (en) * 2020-03-31 2023-06-08 Sony Semiconductor Solutions Corporation Light receiving element and electronic device
KR20210122525A (ko) * 2020-04-01 2021-10-12 에스케이하이닉스 주식회사 이미지 센서 장치
KR20210137677A (ko) * 2020-05-11 2021-11-18 에스케이하이닉스 주식회사 이미지 센서 장치
KR20230025781A (ko) * 2020-06-18 2023-02-23 소니 세미컨덕터 솔루션즈 가부시키가이샤 표시 장치, 표시 장치의 제조 방법 및 전자 기기
JP2023022718A (ja) * 2021-08-03 2023-02-15 ソニーセミコンダクタソリューションズ株式会社 撮像装置及びその製造方法、電子機器
WO2024024450A1 (ja) * 2022-07-26 2024-02-01 ソニーセミコンダクタソリューションズ株式会社 半導体装置及びその製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1168074A (ja) * 1997-08-13 1999-03-09 Sony Corp 固体撮像素子
JP4979154B2 (ja) * 2000-06-07 2012-07-18 ルネサスエレクトロニクス株式会社 半導体装置
JP2003209235A (ja) * 2002-01-16 2003-07-25 Sony Corp 固体撮像素子及びその製造方法
JP2006261638A (ja) * 2005-02-21 2006-09-28 Sony Corp 固体撮像装置および固体撮像装置の駆動方法
JP5268618B2 (ja) * 2008-12-18 2013-08-21 株式会社東芝 半導体装置
JP5985136B2 (ja) * 2009-03-19 2016-09-06 ソニー株式会社 半導体装置とその製造方法、及び電子機器
JP5442394B2 (ja) * 2009-10-29 2014-03-12 ソニー株式会社 固体撮像装置とその製造方法、及び電子機器
JP2010199602A (ja) * 2010-04-16 2010-09-09 Sony Corp 固体撮像素子及びその製造方法

Similar Documents

Publication Publication Date Title
JP2013080838A5 (ru)
JP2013033786A5 (ja) 半導体装置、半導体装置の製造方法、および電子機器
JP2009158863A5 (ru)
TWI549247B (zh) 晶片封裝體
CN109274876B (zh) 感光组件及其封装方法、镜头模组、电子设备
TWI466281B (zh) 影像感測晶片封裝體及其形成方法
JP2009176777A5 (ru)
JP2012191005A5 (ru)
JP2018088488A5 (ru)
JP2012209542A5 (ru)
JP2012084693A5 (ru)
EP2396820A4 (en) IMAGE SENSOR AND OPTICAL SENSOR PAVING HOUSINGS
JP2013175494A5 (ru)
JP2014099582A5 (ru)
JP2014229810A5 (ru)
JP2008311413A5 (ru)
JP2008304379A5 (ru)
JP2008118142A5 (ru)
JP2015115420A5 (ru)
TWI573258B (zh) 光學感測器封裝及光學感測器總成
JP2010067827A5 (ru)
JP2010040621A (ja) 固体撮像デバイス及びその製造方法
TWI632717B (zh) 取像模組及其製造方法
JP2013026565A5 (ru)
JP2012044114A5 (ru)