JP5752736B2 - スパッタリング用ターゲット - Google Patents

スパッタリング用ターゲット Download PDF

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Publication number
JP5752736B2
JP5752736B2 JP2013080844A JP2013080844A JP5752736B2 JP 5752736 B2 JP5752736 B2 JP 5752736B2 JP 2013080844 A JP2013080844 A JP 2013080844A JP 2013080844 A JP2013080844 A JP 2013080844A JP 5752736 B2 JP5752736 B2 JP 5752736B2
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JP
Japan
Prior art keywords
grain boundary
less
hot
rolling
boundary length
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2013080844A
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English (en)
Japanese (ja)
Other versions
JP2014201814A5 (enExample
JP2014201814A (ja
Inventor
牧　一誠
一誠 牧
広行 森
広行 森
公 荒井
公 荒井
典久 飯田
典久 飯田
隆弘 竹田
隆弘 竹田
茂 下出水
茂 下出水
伸 及川
伸 及川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Shindoh Co Ltd
Mitsubishi Materials Corp
Original Assignee
Mitsubishi Shindoh Co Ltd
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2013080844A priority Critical patent/JP5752736B2/ja
Application filed by Mitsubishi Shindoh Co Ltd, Mitsubishi Materials Corp filed Critical Mitsubishi Shindoh Co Ltd
Priority to TW103112851A priority patent/TWI518197B/zh
Priority to KR1020157026462A priority patent/KR102214290B1/ko
Priority to PCT/JP2014/060151 priority patent/WO2014168132A1/ja
Priority to CN201480020010.XA priority patent/CN105189792B/zh
Priority to US14/782,177 priority patent/US9938606B2/en
Publication of JP2014201814A publication Critical patent/JP2014201814A/ja
Publication of JP2014201814A5 publication Critical patent/JP2014201814A5/ja
Application granted granted Critical
Publication of JP5752736B2 publication Critical patent/JP5752736B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physical Vapour Deposition (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Metal Rolling (AREA)
JP2013080844A 2013-04-08 2013-04-08 スパッタリング用ターゲット Active JP5752736B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2013080844A JP5752736B2 (ja) 2013-04-08 2013-04-08 スパッタリング用ターゲット
KR1020157026462A KR102214290B1 (ko) 2013-04-08 2014-04-08 열연 구리판
PCT/JP2014/060151 WO2014168132A1 (ja) 2013-04-08 2014-04-08 熱延銅板
CN201480020010.XA CN105189792B (zh) 2013-04-08 2014-04-08 热轧铜板
TW103112851A TWI518197B (zh) 2013-04-08 2014-04-08 熱軋銅板
US14/782,177 US9938606B2 (en) 2013-04-08 2014-04-08 Hot-rolled copper plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013080844A JP5752736B2 (ja) 2013-04-08 2013-04-08 スパッタリング用ターゲット

Publications (3)

Publication Number Publication Date
JP2014201814A JP2014201814A (ja) 2014-10-27
JP2014201814A5 JP2014201814A5 (enExample) 2014-12-04
JP5752736B2 true JP5752736B2 (ja) 2015-07-22

Family

ID=51689539

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013080844A Active JP5752736B2 (ja) 2013-04-08 2013-04-08 スパッタリング用ターゲット

Country Status (6)

Country Link
US (1) US9938606B2 (enExample)
JP (1) JP5752736B2 (enExample)
KR (1) KR102214290B1 (enExample)
CN (1) CN105189792B (enExample)
TW (1) TWI518197B (enExample)
WO (1) WO2014168132A1 (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6056876B2 (ja) 2015-01-07 2017-01-11 三菱マテリアル株式会社 超伝導安定化材
JP6056877B2 (ja) 2015-01-07 2017-01-11 三菱マテリアル株式会社 超伝導線、及び、超伝導コイル
EP3342898B1 (en) 2015-08-24 2023-03-22 Mitsubishi Materials Corporation High purity copper sputtering target material
JP6668899B2 (ja) * 2016-04-06 2020-03-18 三菱マテリアル株式会社 超伝導安定化材、超伝導線及び超伝導コイル
JP6299802B2 (ja) 2016-04-06 2018-03-28 三菱マテリアル株式会社 超伝導安定化材、超伝導線及び超伝導コイル
JP6299803B2 (ja) 2016-04-06 2018-03-28 三菱マテリアル株式会社 超伝導線、及び、超伝導コイル
TWI663274B (zh) 2017-03-30 2019-06-21 日商Ｊｘ金屬股份有限公司 Sputtering target and manufacturing method thereof
JP7121883B2 (ja) * 2018-04-09 2022-08-19 三菱マテリアル株式会社 スパッタリングターゲット材
US10670393B1 (en) 2018-11-30 2020-06-02 Applied Materials, Inc. Construction of three-dimensional profiles of high aspect ratio structures using top down imaging
US12385110B2 (en) 2018-12-13 2025-08-12 Mitsubishi Materials Corporation Pure copper plate
JP7131376B2 (ja) * 2018-12-27 2022-09-06 三菱マテリアル株式会社 スパッタリングターゲット用銅素材
US11427888B2 (en) 2019-01-07 2022-08-30 Mitsubishi Materials Corporation Sputtering target material
TWI727586B (zh) * 2019-02-28 2021-05-11 日商Ｊｘ金屬股份有限公司 銅電極材料
WO2021060023A1 (ja) * 2019-09-27 2021-04-01 三菱マテリアル株式会社 純銅板
CN110578126B (zh) * 2019-10-18 2021-12-28 洛阳高新四丰电子材料有限公司 一种多规格高纯铜靶材的制备方法
EP4116451A4 (en) * 2020-03-06 2024-03-27 Mitsubishi Materials Corporation PURE COPPER PLATE
WO2024024898A1 (ja) * 2022-07-29 2024-02-01 三菱マテリアル株式会社 純銅材、絶縁基板、電子デバイス

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2614885B2 (ja) * 1988-02-10 1997-05-28 株式会社フジクラ 真空蒸着用銅基材
JP3403918B2 (ja) 1997-06-02 2003-05-06 株式会社ジャパンエナジー 高純度銅スパッタリングタ−ゲットおよび薄膜
JP3975414B2 (ja) 1997-11-28 2007-09-12 日立金属株式会社 スパッタリング用銅ターゲットおよびその製造方法
CN1181224C (zh) 2001-06-01 2004-12-22 中国科学院金属研究所 一种高强度高导电性纳米晶体铜材料的制备方法
CA2674403C (en) * 2007-12-18 2012-06-05 Integran Technologies Inc. Method for preparing polycrystalline structures having improved mechanical and physical properties
JP4620185B2 (ja) * 2008-09-30 2011-01-26 Ｊｘ日鉱日石金属株式会社 高純度銅及び電解による高純度銅の製造方法
WO2010038642A1 (ja) * 2008-09-30 2010-04-08 日鉱金属株式会社 高純度銅又は高純度銅合金スパッタリングターゲット、同スパッタリングターゲットの製造方法及び高純度銅又は高純度銅合金スパッタ膜
JP4790782B2 (ja) 2008-11-04 2011-10-12 Ｊｘ日鉱日石金属株式会社 銅合金スパッタリングターゲット及び半導体素子配線
JP4869398B2 (ja) * 2009-12-22 2012-02-08 三菱伸銅株式会社 純銅板の製造方法及び純銅板
KR20120106745A (ko) 2009-12-22 2012-09-26 미쓰비시 마테리알 가부시키가이샤 순구리판의 제조 방법 및 순구리판
JP4792116B2 (ja) 2010-02-09 2011-10-12 三菱伸銅株式会社 純銅板の製造方法及び純銅板
JP4869415B2 (ja) * 2010-02-09 2012-02-08 三菱伸銅株式会社 純銅板の製造方法及び純銅板
JP5464352B2 (ja) * 2010-03-05 2014-04-09 三菱マテリアル株式会社 均一かつ微細結晶組織を有する高純度銅加工材の製造方法
JP5376168B2 (ja) * 2010-03-30 2013-12-25 三菱マテリアル株式会社 電気銅めっき用高純度銅アノード、その製造方法および電気銅めっき方法
JP5685869B2 (ja) 2010-09-14 2015-03-18 三菱マテリアル株式会社 太陽電池パネルのインターコネクター用銅圧延箔及びその製造方法
JP6027823B2 (ja) * 2012-09-07 2016-11-16 三菱マテリアル株式会社 熱延銅板、及び、熱延銅板の形状調整方法

Also Published As

Publication number Publication date
TW201510254A (zh) 2015-03-16
TWI518197B (zh) 2016-01-21
US20160047017A1 (en) 2016-02-18
KR20150140658A (ko) 2015-12-16
KR102214290B1 (ko) 2021-02-08
JP2014201814A (ja) 2014-10-27
WO2014168132A1 (ja) 2014-10-16
CN105189792B (zh) 2017-06-09
CN105189792A (zh) 2015-12-23
US9938606B2 (en) 2018-04-10

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