JP5705052B2 - ダイボンディング装置 - Google Patents

ダイボンディング装置 Download PDF

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Publication number
JP5705052B2
JP5705052B2 JP2011162715A JP2011162715A JP5705052B2 JP 5705052 B2 JP5705052 B2 JP 5705052B2 JP 2011162715 A JP2011162715 A JP 2011162715A JP 2011162715 A JP2011162715 A JP 2011162715A JP 5705052 B2 JP5705052 B2 JP 5705052B2
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JP
Japan
Prior art keywords
shaft
semiconductor chip
bonding
bonding apparatus
die bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2011162715A
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English (en)
Japanese (ja)
Other versions
JP2013026585A (ja
JP2013026585A5 (ko
Inventor
正人 辻
正人 辻
光輝 坂本
光輝 坂本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP2011162715A priority Critical patent/JP5705052B2/ja
Priority to TW101120965A priority patent/TWI451515B/zh
Priority to KR1020120073274A priority patent/KR101380816B1/ko
Priority to CN201210261799.0A priority patent/CN102903647B/zh
Publication of JP2013026585A publication Critical patent/JP2013026585A/ja
Publication of JP2013026585A5 publication Critical patent/JP2013026585A5/ja
Application granted granted Critical
Publication of JP5705052B2 publication Critical patent/JP5705052B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
  • Wire Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2011162715A 2011-07-26 2011-07-26 ダイボンディング装置 Active JP5705052B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2011162715A JP5705052B2 (ja) 2011-07-26 2011-07-26 ダイボンディング装置
TW101120965A TWI451515B (zh) 2011-07-26 2012-06-12 Grain bonding device
KR1020120073274A KR101380816B1 (ko) 2011-07-26 2012-07-05 다이본딩 장치
CN201210261799.0A CN102903647B (zh) 2011-07-26 2012-07-26 芯片焊接装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011162715A JP5705052B2 (ja) 2011-07-26 2011-07-26 ダイボンディング装置

Publications (3)

Publication Number Publication Date
JP2013026585A JP2013026585A (ja) 2013-02-04
JP2013026585A5 JP2013026585A5 (ko) 2014-02-06
JP5705052B2 true JP5705052B2 (ja) 2015-04-22

Family

ID=47575829

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011162715A Active JP5705052B2 (ja) 2011-07-26 2011-07-26 ダイボンディング装置

Country Status (4)

Country Link
JP (1) JP5705052B2 (ko)
KR (1) KR101380816B1 (ko)
CN (1) CN102903647B (ko)
TW (1) TWI451515B (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108447803A (zh) * 2018-03-26 2018-08-24 童龙范 一种新型片式半导体超薄封装装置

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6695225B2 (ja) * 2016-07-12 2020-05-20 株式会社ディスコ 搬送ユニット
JP7128697B2 (ja) * 2018-09-19 2022-08-31 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法
CN109817532B (zh) * 2019-03-28 2020-12-15 惠州西文思技术股份有限公司 一种用于芯片的加工设备
CN113977028B (zh) * 2021-10-28 2023-04-25 恩纳基智能科技无锡有限公司 一种共晶焊接设备

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01208837A (ja) * 1988-02-17 1989-08-22 Hitachi Ltd アーム装置およびそれを使用したボンディング装置
JP2635889B2 (ja) * 1992-06-24 1997-07-30 株式会社東芝 ダイボンディング装置
JP3206486B2 (ja) * 1997-04-08 2001-09-10 松下電器産業株式会社 チップのボンディング装置におけるボンディングヘッド
JPH10308405A (ja) * 1997-05-08 1998-11-17 Mitsubishi Electric Corp ボンディング装置及びボンディング方法並びに半導体装置の製造方法
JP2000269240A (ja) * 1999-03-16 2000-09-29 Hitachi Cable Ltd 光モジュールの製造方法及び光素子搭載装置
JP3402284B2 (ja) * 1999-10-29 2003-05-06 日本電気株式会社 ボンディング装置
TW559963B (en) * 2001-06-08 2003-11-01 Shibaura Mechatronics Corp Pressuring apparatus of electronic device and its method
KR20030046306A (ko) * 2001-12-05 2003-06-12 에섹 트레이딩 에스에이 반도체 칩을 설치하기 위한 장치
AU2003249592A1 (en) * 2002-07-17 2004-02-02 Matsushita Electric Industrial Co., Ltd Method and apparatus for picking up semiconductor chip and suction and exfoliation tool up therefor
US7306695B2 (en) * 2003-04-10 2007-12-11 Matsushita Electric Industrial Co., Ltd. Apparatus and method for picking up semiconductor chip
CH697294B1 (de) * 2003-12-22 2008-08-15 Oerlikon Assembly Equipment Ag Verfahren für die Kalibration der Greifachse des Bondkopfs eines Automaten für die Montage von Halbleiterchips auf einem Substrat.
JP2005340411A (ja) * 2004-05-26 2005-12-08 Nidec Tosok Corp ボンディング装置
JP4397349B2 (ja) * 2005-05-20 2010-01-13 株式会社新川 チップボンディング装置
JP2006324533A (ja) 2005-05-20 2006-11-30 Nidec Tosok Corp ボンディング荷重制御装置
KR100851567B1 (ko) 2007-04-03 2008-08-12 주식회사 탑 엔지니어링 본딩 장비의 칩 트랜스퍼 헤드

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108447803A (zh) * 2018-03-26 2018-08-24 童龙范 一种新型片式半导体超薄封装装置

Also Published As

Publication number Publication date
JP2013026585A (ja) 2013-02-04
TW201306154A (zh) 2013-02-01
KR101380816B1 (ko) 2014-04-04
KR20130012917A (ko) 2013-02-05
CN102903647B (zh) 2014-12-24
TWI451515B (zh) 2014-09-01
CN102903647A (zh) 2013-01-30

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