TWI451515B - Grain bonding device - Google Patents

Grain bonding device Download PDF

Info

Publication number
TWI451515B
TWI451515B TW101120965A TW101120965A TWI451515B TW I451515 B TWI451515 B TW I451515B TW 101120965 A TW101120965 A TW 101120965A TW 101120965 A TW101120965 A TW 101120965A TW I451515 B TWI451515 B TW I451515B
Authority
TW
Taiwan
Prior art keywords
plate
shaft
semiconductor wafer
head
rod
Prior art date
Application number
TW101120965A
Other languages
English (en)
Chinese (zh)
Other versions
TW201306154A (zh
Inventor
Masahito Tsuji
Mitsuteru Sakamoto
Original Assignee
Shinkawa Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Kk filed Critical Shinkawa Kk
Publication of TW201306154A publication Critical patent/TW201306154A/zh
Application granted granted Critical
Publication of TWI451515B publication Critical patent/TWI451515B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Wire Bonding (AREA)
TW101120965A 2011-07-26 2012-06-12 Grain bonding device TWI451515B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011162715A JP5705052B2 (ja) 2011-07-26 2011-07-26 ダイボンディング装置

Publications (2)

Publication Number Publication Date
TW201306154A TW201306154A (zh) 2013-02-01
TWI451515B true TWI451515B (zh) 2014-09-01

Family

ID=47575829

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101120965A TWI451515B (zh) 2011-07-26 2012-06-12 Grain bonding device

Country Status (4)

Country Link
JP (1) JP5705052B2 (ko)
KR (1) KR101380816B1 (ko)
CN (1) CN102903647B (ko)
TW (1) TWI451515B (ko)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6695225B2 (ja) * 2016-07-12 2020-05-20 株式会社ディスコ 搬送ユニット
CN108447803B (zh) * 2018-03-26 2019-01-25 沛县国源光伏电力有限公司 一种新型片式半导体超薄封装装置
JP7128697B2 (ja) * 2018-09-19 2022-08-31 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法
CN109817532B (zh) * 2019-03-28 2020-12-15 惠州西文思技术股份有限公司 一种用于芯片的加工设备
CN113977028B (zh) * 2021-10-28 2023-04-25 恩纳基智能科技无锡有限公司 一种共晶焊接设备

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200300995A (en) * 2001-12-05 2003-06-16 Esec Trading Sa Apparatus for mounting semiconductor chips
TWI277166B (en) * 2002-07-17 2007-03-21 Matsushita Electric Ind Co Ltd Method and apparatus for picking up semiconductor chip and suction and exfoliation tool used therefor
TW200735233A (en) * 2005-05-20 2007-09-16 Shinkawa Kk Bonding device for chip
TWI318781B (en) * 2003-04-10 2009-12-21 Panasonic Corp Apparatus and method for picking up semiconductor chip

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01208837A (ja) * 1988-02-17 1989-08-22 Hitachi Ltd アーム装置およびそれを使用したボンディング装置
JP2635889B2 (ja) * 1992-06-24 1997-07-30 株式会社東芝 ダイボンディング装置
JP3206486B2 (ja) * 1997-04-08 2001-09-10 松下電器産業株式会社 チップのボンディング装置におけるボンディングヘッド
JPH10308405A (ja) * 1997-05-08 1998-11-17 Mitsubishi Electric Corp ボンディング装置及びボンディング方法並びに半導体装置の製造方法
JP2000269240A (ja) * 1999-03-16 2000-09-29 Hitachi Cable Ltd 光モジュールの製造方法及び光素子搭載装置
JP3402284B2 (ja) * 1999-10-29 2003-05-06 日本電気株式会社 ボンディング装置
TW559963B (en) * 2001-06-08 2003-11-01 Shibaura Mechatronics Corp Pressuring apparatus of electronic device and its method
CH697294B1 (de) * 2003-12-22 2008-08-15 Oerlikon Assembly Equipment Ag Verfahren für die Kalibration der Greifachse des Bondkopfs eines Automaten für die Montage von Halbleiterchips auf einem Substrat.
JP2005340411A (ja) * 2004-05-26 2005-12-08 Nidec Tosok Corp ボンディング装置
JP2006324533A (ja) 2005-05-20 2006-11-30 Nidec Tosok Corp ボンディング荷重制御装置
KR100851567B1 (ko) 2007-04-03 2008-08-12 주식회사 탑 엔지니어링 본딩 장비의 칩 트랜스퍼 헤드

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200300995A (en) * 2001-12-05 2003-06-16 Esec Trading Sa Apparatus for mounting semiconductor chips
TWI277166B (en) * 2002-07-17 2007-03-21 Matsushita Electric Ind Co Ltd Method and apparatus for picking up semiconductor chip and suction and exfoliation tool used therefor
TWI318781B (en) * 2003-04-10 2009-12-21 Panasonic Corp Apparatus and method for picking up semiconductor chip
TW200735233A (en) * 2005-05-20 2007-09-16 Shinkawa Kk Bonding device for chip

Also Published As

Publication number Publication date
JP2013026585A (ja) 2013-02-04
CN102903647A (zh) 2013-01-30
TW201306154A (zh) 2013-02-01
JP5705052B2 (ja) 2015-04-22
KR20130012917A (ko) 2013-02-05
KR101380816B1 (ko) 2014-04-04
CN102903647B (zh) 2014-12-24

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