CN102903647B - 芯片焊接装置 - Google Patents

芯片焊接装置 Download PDF

Info

Publication number
CN102903647B
CN102903647B CN201210261799.0A CN201210261799A CN102903647B CN 102903647 B CN102903647 B CN 102903647B CN 201210261799 A CN201210261799 A CN 201210261799A CN 102903647 B CN102903647 B CN 102903647B
Authority
CN
China
Prior art keywords
mentioned
axle
semiconductor chip
die
plumb joint
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201210261799.0A
Other languages
English (en)
Chinese (zh)
Other versions
CN102903647A (zh
Inventor
辻正人
坂本光輝
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Arakawa Co Ltd
Original Assignee
Arakawa Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Arakawa Co Ltd filed Critical Arakawa Co Ltd
Publication of CN102903647A publication Critical patent/CN102903647A/zh
Application granted granted Critical
Publication of CN102903647B publication Critical patent/CN102903647B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
  • Wire Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN201210261799.0A 2011-07-26 2012-07-26 芯片焊接装置 Active CN102903647B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011-162715 2011-07-26
JP2011162715A JP5705052B2 (ja) 2011-07-26 2011-07-26 ダイボンディング装置

Publications (2)

Publication Number Publication Date
CN102903647A CN102903647A (zh) 2013-01-30
CN102903647B true CN102903647B (zh) 2014-12-24

Family

ID=47575829

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201210261799.0A Active CN102903647B (zh) 2011-07-26 2012-07-26 芯片焊接装置

Country Status (4)

Country Link
JP (1) JP5705052B2 (ko)
KR (1) KR101380816B1 (ko)
CN (1) CN102903647B (ko)
TW (1) TWI451515B (ko)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6695225B2 (ja) * 2016-07-12 2020-05-20 株式会社ディスコ 搬送ユニット
CN108447803B (zh) * 2018-03-26 2019-01-25 沛县国源光伏电力有限公司 一种新型片式半导体超薄封装装置
JP7128697B2 (ja) * 2018-09-19 2022-08-31 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法
CN109817532B (zh) * 2019-03-28 2020-12-15 惠州西文思技术股份有限公司 一种用于芯片的加工设备
CN113977028B (zh) * 2021-10-28 2023-04-25 恩纳基智能科技无锡有限公司 一种共晶焊接设备

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001127097A (ja) * 1999-10-29 2001-05-11 Nec Corp ボンディング装置及びその制御方法
CN1513202A (zh) * 2001-06-08 2004-07-14 芝浦机械电子装置股份有限公司 电子部件压接装置及其方法
CN1794439A (zh) * 2003-12-22 2006-06-28 优利讯国际贸易有限责任公司 校准焊头的方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01208837A (ja) * 1988-02-17 1989-08-22 Hitachi Ltd アーム装置およびそれを使用したボンディング装置
JP2635889B2 (ja) * 1992-06-24 1997-07-30 株式会社東芝 ダイボンディング装置
JP3206486B2 (ja) * 1997-04-08 2001-09-10 松下電器産業株式会社 チップのボンディング装置におけるボンディングヘッド
JPH10308405A (ja) * 1997-05-08 1998-11-17 Mitsubishi Electric Corp ボンディング装置及びボンディング方法並びに半導体装置の製造方法
JP2000269240A (ja) * 1999-03-16 2000-09-29 Hitachi Cable Ltd 光モジュールの製造方法及び光素子搭載装置
KR20030046306A (ko) * 2001-12-05 2003-06-12 에섹 트레이딩 에스에이 반도체 칩을 설치하기 위한 장치
AU2003249592A1 (en) * 2002-07-17 2004-02-02 Matsushita Electric Industrial Co., Ltd Method and apparatus for picking up semiconductor chip and suction and exfoliation tool up therefor
US7306695B2 (en) * 2003-04-10 2007-12-11 Matsushita Electric Industrial Co., Ltd. Apparatus and method for picking up semiconductor chip
JP2005340411A (ja) * 2004-05-26 2005-12-08 Nidec Tosok Corp ボンディング装置
JP4397349B2 (ja) * 2005-05-20 2010-01-13 株式会社新川 チップボンディング装置
JP2006324533A (ja) 2005-05-20 2006-11-30 Nidec Tosok Corp ボンディング荷重制御装置
KR100851567B1 (ko) 2007-04-03 2008-08-12 주식회사 탑 엔지니어링 본딩 장비의 칩 트랜스퍼 헤드

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001127097A (ja) * 1999-10-29 2001-05-11 Nec Corp ボンディング装置及びその制御方法
CN1513202A (zh) * 2001-06-08 2004-07-14 芝浦机械电子装置股份有限公司 电子部件压接装置及其方法
CN1794439A (zh) * 2003-12-22 2006-06-28 优利讯国际贸易有限责任公司 校准焊头的方法

Also Published As

Publication number Publication date
JP2013026585A (ja) 2013-02-04
TW201306154A (zh) 2013-02-01
KR101380816B1 (ko) 2014-04-04
KR20130012917A (ko) 2013-02-05
JP5705052B2 (ja) 2015-04-22
TWI451515B (zh) 2014-09-01
CN102903647A (zh) 2013-01-30

Similar Documents

Publication Publication Date Title
CN102903647B (zh) 芯片焊接装置
CN100518485C (zh) 装配装置和用于装配装置的控制装置
CN205572456U (zh) 一种三轴机械手
CN102449489A (zh) 物理量传感器
CN102945813B (zh) 一种用于全自动引线键合设备上的键合头装置
KR20000028889A (ko) 와이어 본딩방법
CN103367183A (zh) 双摆臂式固晶机焊头机构及固晶机
CN110695575B (zh) 用于引线焊接的焊接机上的自动悬置芯片优化工具及相关方法
CN102881606B (zh) 芯片焊接装置
KR101613196B1 (ko) 플립칩 장착 방법 및 플립칩 장착기
CN100427258C (zh) 丝焊器
JP2013026585A5 (ko)
CN110112093B (zh) 一种倒封装芯片柔性顶针操作装置和系统
CN102437111A (zh) 利用线夹制造折点的快速引线成弧方法及装置
CN215746099U (zh) 一种光伏组件用引线校准套料机构
US6871772B2 (en) Wire bonding apparatus
US20140074280A1 (en) Horizontal Axis Drive Mechanism, Two-Axis Drive Mechanism, and Die Bonder
CN210052728U (zh) 一种倒封装芯片柔性顶针操作装置和系统
CN221676967U (zh) 一种用于压电晶体模组的夹持设备
JP4457975B2 (ja) ガラス母材の製造方法
CN205257455U (zh) 一种捡砖机的挡砖机构
CN110176411A (zh) 安装装置及半导体器件的制造方法
CN201009036Y (zh) 点电焊机机头
CN214477374U (zh) 一种csp芯片产品取放机构
JP4068049B2 (ja) ボンディング方法

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant