CN102945813B - 一种用于全自动引线键合设备上的键合头装置 - Google Patents
一种用于全自动引线键合设备上的键合头装置 Download PDFInfo
- Publication number
- CN102945813B CN102945813B CN201210412618.XA CN201210412618A CN102945813B CN 102945813 B CN102945813 B CN 102945813B CN 201210412618 A CN201210412618 A CN 201210412618A CN 102945813 B CN102945813 B CN 102945813B
- Authority
- CN
- China
- Prior art keywords
- assembly
- bonding
- wire clamp
- sparking
- electromagnetic damping
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
Description
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210412618.XA CN102945813B (zh) | 2012-10-25 | 2012-10-25 | 一种用于全自动引线键合设备上的键合头装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210412618.XA CN102945813B (zh) | 2012-10-25 | 2012-10-25 | 一种用于全自动引线键合设备上的键合头装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102945813A CN102945813A (zh) | 2013-02-27 |
CN102945813B true CN102945813B (zh) | 2016-12-21 |
Family
ID=47728745
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201210412618.XA Expired - Fee Related CN102945813B (zh) | 2012-10-25 | 2012-10-25 | 一种用于全自动引线键合设备上的键合头装置 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN102945813B (zh) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103177980A (zh) * | 2013-03-01 | 2013-06-26 | 广东工业大学 | 一种用于全自动引线键合设备上的键合头装置 |
CN105552002A (zh) * | 2015-12-18 | 2016-05-04 | 中国电子科技集团公司第二研究所 | 一种引线楔焊微小力输出机构 |
CN105598613A (zh) * | 2015-12-18 | 2016-05-25 | 中国电子科技集团公司第二研究所 | 全自动引线键合机焊头 |
CN105590874A (zh) * | 2015-12-18 | 2016-05-18 | 中国电子科技集团公司第二研究所 | 一种引线楔焊微小力输出机构的工作方法 |
CN111752314B (zh) * | 2019-03-29 | 2021-10-01 | 上海微电子装备(集团)股份有限公司 | 键合头压力控制装置及控制方法、键合设备 |
CN110034032B (zh) * | 2019-04-25 | 2020-10-20 | 广东工业大学 | 一种力反馈闭环控制复合键合装置 |
CN111863644B (zh) * | 2020-08-04 | 2021-03-09 | 广东金田半导体科技有限公司 | 一种半导体封装超声铝线键合装置 |
CN118712122A (zh) * | 2024-08-30 | 2024-09-27 | 西北电子装备技术研究所(中国电子科技集团公司第二研究所) | 热声键合机的联动式断线装置 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102157409A (zh) * | 2011-03-17 | 2011-08-17 | 南通富士通微电子股份有限公司 | 键合机 |
CN202816884U (zh) * | 2012-10-25 | 2013-03-20 | 广东工业大学 | 用于全自动引线键合设备上的键合头装置 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58111334A (ja) * | 1981-12-25 | 1983-07-02 | Hitachi Ltd | シヨツクアブソ−バ−機構 |
DE10190130D2 (de) * | 2000-01-21 | 2002-12-19 | Hesse & Knipps Gmbh | Halteeinrichtung für Ultraschall-Transducer |
-
2012
- 2012-10-25 CN CN201210412618.XA patent/CN102945813B/zh not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102157409A (zh) * | 2011-03-17 | 2011-08-17 | 南通富士通微电子股份有限公司 | 键合机 |
CN202816884U (zh) * | 2012-10-25 | 2013-03-20 | 广东工业大学 | 用于全自动引线键合设备上的键合头装置 |
Also Published As
Publication number | Publication date |
---|---|
CN102945813A (zh) | 2013-02-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN102945813B (zh) | 一种用于全自动引线键合设备上的键合头装置 | |
CN109906127B (zh) | 三维造形物的制造装置与三维造形物的制造方法 | |
CN103367183B (zh) | 双摆臂式固晶机焊头机构及固晶机 | |
CN104597128A (zh) | 一种适用于汽轮机焊接转子的相控阵超声波无损检测机器人系统 | |
CN102339771B (zh) | 一种双焊线头引线键合装置 | |
CN107160050A (zh) | 一种焊线机 | |
CN111048447A (zh) | 一种键合机引线机构及工作方法 | |
CN202816884U (zh) | 用于全自动引线键合设备上的键合头装置 | |
CN203456421U (zh) | 用于全自动引线键合设备上的键合头装置 | |
US7025243B2 (en) | Bondhead for wire bonding apparatus | |
CN103177980A (zh) | 一种用于全自动引线键合设备上的键合头装置 | |
US11437343B2 (en) | Full-automatic deep access ball bonding head device | |
CN102437111A (zh) | 利用线夹制造折点的快速引线成弧方法及装置 | |
CN102343476B (zh) | 键合头装置 | |
CN110560822B (zh) | 一种基于直线电机的振动送丝焊接装置 | |
CN214185654U (zh) | 一种三轴联动写锡机构 | |
KR102360298B1 (ko) | 다수의 액추에이터를 갖는 와이어 접합 장치 | |
CN201511209U (zh) | 焊接机头 | |
JP2003297872A (ja) | ボンディング装置 | |
JP3946570B2 (ja) | Tig溶接装置及びtig溶接方法 | |
CN207282882U (zh) | 一种音圈电机驱动的45-60度线夹 | |
CN103579072A (zh) | 夹片机构缓冲装置 | |
US20110114703A1 (en) | Z-axis motion system for a wire bonding machine | |
CN110640382A (zh) | 一种盘式电机定子绕组焊接装置及其使用方法 | |
CN113751811B (zh) | 一种电磁搅拌电火花沉积修复装置及沉积修复方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB03 | Change of inventor or designer information |
Inventor after: Chen Xin Inventor after: Cao Zhanlun Inventor after: Wu Xiaohong Inventor after: Jiang Yongjun Inventor after: Gao Jian Inventor after: Li Zexiang Inventor before: Cao Zhanlun Inventor before: Chen Xin Inventor before: Wu Xiaohong Inventor before: Jiang Yongjun Inventor before: Gao Jian |
|
COR | Change of bibliographic data | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161221 Termination date: 20211025 |