CN103579072A - 夹片机构缓冲装置 - Google Patents

夹片机构缓冲装置 Download PDF

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CN103579072A
CN103579072A CN201310589133.2A CN201310589133A CN103579072A CN 103579072 A CN103579072 A CN 103579072A CN 201310589133 A CN201310589133 A CN 201310589133A CN 103579072 A CN103579072 A CN 103579072A
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buffer unit
damping fin
clamping sheet
sheet mechanism
suction disc
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CN103579072B (zh
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牛伟光
柴亮
李蒙
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CETC Beijing Electronic Equipment Co
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CETC Beijing Electronic Equipment Co
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68363Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used in a transfer process involving transfer directly from an origin substrate to a target substrate without use of an intermediate handle substrate

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  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Wire Bonding (AREA)

Abstract

本发明提供了一种夹片机构缓冲装置,应用于引线键合机夹持系统,包括:螺线管,用于提供所述夹片机构缓冲装置的驱动力;吸板,用于根据所述螺线管提供的驱动力带动夹子和阻尼片运动;阻尼片,用于根据所述吸板带动运动产生涡流;夹子,用于夹持引线框架。通过本发明所提供的夹片机构缓冲装置,能够用来减小夹持引线框架时的冲击力,保证平稳、精确、安全的夹持。

Description

夹片机构缓冲装置
技术领域
本发明涉及电子元件领域,特别涉及一种夹片机构缓冲装置。
背景技术
夹片机构缓冲装置,是适用于半导体后封装设备——引线键合机(Wirebonder)夹持系统中的一种新型缓冲装置。以往引线键合机的夹持系统,通常利用螺线管驱动吸板进行吸合,由吸板直接带动夹子对引线框架进行夹持。用这种系统直接进行引线框架的夹持时,往往冲击力很大,会引起引线框架位置偏移、夹坏,芯片震坏等问题。
半导体器件,诸如集成电路芯片,其电气性能一般是将芯片与引线框架粘接,然后通过引线键合或倒装焊工艺(将芯片焊点与引线框架引脚进行连接)实现的。
传统结构中,引线键合机的物料夹持系统不带有缓冲装置。吸板仅与夹持引线框架的夹子直接相连。螺线管通电后,通电螺线管产生内部磁场,从而吸引由铁材料制成的吸板,吸板带动夹子一起运动。由于磁场力较大,夹子对所夹持引线框架的冲击力很大,过大的冲击力往往会使引线框架被夹坏或因振动而导致位置偏移以及芯片的损坏。会严重影响焊线的精度和质量。
发明内容
本发明提供了一种夹片机构缓冲装置,其目的是为了对引线框架安全、平稳、精确的夹持。
为了达到上述目的,本发明的实施例提供了一种夹片机构缓冲装置,应用于引线键合机夹持系统,包括:
螺线管,用于提供所述夹片机构缓冲装置的驱动力;
吸板,用于根据所述螺线管提供的驱动力带动夹子和阻尼片运动;
阻尼片,用于根据所述吸板带动运动产生涡流;
夹子,用于夹持引线框架。
其中,所述夹子、所述吸片以及所述阻尼片组成连轴机构联动。
其中,所述夹片机构缓冲装置中包括多块磁铁,用于产生磁场。
进一步地,所述磁铁可以用激磁线圈代替。
其中,所述螺线管通电后,能够使所述吸板向下运动,所述吸板带动所述阻尼片及夹子运动。
其中,所述吸板和阻尼片是由金属材料制成的。
本发明的上述方案的有益效果如下:
本发明的上述实施例通过所述的夹片机构缓冲装置,能够用来减小夹持引线框架时的冲击力,保证平稳、精确、安全的夹持。
附图说明
图1为本发明所述的引线键合机夹持系统结构简图;
图2为本发明所述的引线键合机夹持系统结构侧视图;
图3为本发明所述的夹片机构缓冲装置图。
具体实施方式
为使本发明要解决的技术问题、技术方案和优点更加清楚,下面将结合附图及具体实施例进行详细描述。
本发明针对现有的对引线框架夹持的问题,提供了一种夹片机构缓冲装置。
如图1、图2所示,本发明的实施例提供了一种夹片机构缓冲装置,应用于引线键合机夹持系统,包括:螺线管2,用于提供所述夹片机构缓冲装置的驱动力;吸板3,用于根据所述螺线管2提供的驱动力带动夹子1和阻尼片5运动;阻尼片5,用于根据所述吸板3带动运动产生涡流;夹子1,用于夹持引线框架。
其中,所述夹子1,所述吸片3以及所述阻尼片5组成连轴机构联动。
如图3所示,所述夹片机构缓冲装置中包括多块磁铁6-13,用于产生磁场。
进一步地,所述磁铁6-13可以用激磁线圈代替。
其中,所述螺线管2通电后,能够使所述吸板3向下运动,所述吸板3带动所述阻尼片5及夹子1运动。
其中,所述吸板3和阻尼片5是由金属材料制成的。
本发明的实施例根据上述方案提供了一种具体的实施方式,如图1、图2所示,在螺线管2通电后,通电螺线管2感应出磁场。从而对金属材料制成的吸板3产生向下的吸引力。由于夹子1与阻尼片5与吸板3组成连轴机构,且螺线管产生的磁力较大。因此,在螺线管2通电后,吸板3带动夹子1和阻尼片5同时以极快的速度向下运动。
如图3所示,某一瞬间,阻尼片5在图3所示的夹片机构缓冲装置中,由螺线管2未通电时的位置①运动到了通电后的位置②处。磁铁6~13四个一列相对安装于夹片机构缓冲装置的腔体14上,产生磁场。当阻尼片5从位置①运动到位置②,阻尼片5上下运动,磁场为水平方向,阻尼片5上下运动时切割磁力线。在此过程中,所穿透阻尼片5的磁通量发生变化。在磁场中运动的阻尼片5会产生感生电流,磁场对感应电流产生安培力,形成与原来运动方向相反的力偶矩,对阻尼片5的运动起阻尼作用,阻碍两者的相对运动。当阻尼片5在吸板3的带动下以极快的速度相对磁铁运动时,就会产生很大的阻尼。使得与阻尼片5相连的夹子1在很短的时间内停止高速运动,在要夹住引线框架的瞬间平稳地将引线框架紧紧夹住。
其中,腔体内部两侧的磁铁两两相对安装。磁极安装方式如图3所示。
本发明的上述实施例通过阻尼片5在螺线管2的驱动下,在夹片机构缓冲装置中上下运动,切割磁力线而产生涡流。涡流与磁场相互作用形成制力矩,使阻尼片5减速停止运转,在阻尼片5的带动下夹子1缓缓夹住引线框架。以此来减小夹持引线框架时的冲击力,保证平稳、精确、安全的夹持。
以上所述是本发明的优选实施方式,应当指出,对于本技术领域的普通技术人员来说,在不脱离本发明所述原理的前提下,还可以作出若干改进和润饰,这些改进和润饰也应视为本发明的保护范围。

Claims (6)

1.一种夹片机构缓冲装置,应用于引线键合机夹持系统,其特征在于,包括:
螺线管,用于提供所述夹片机构缓冲装置的驱动力;
吸板,用于根据所述螺线管提供的驱动力带动夹子和阻尼片运动;
阻尼片,用于根据所述吸板带动运动产生涡流;
夹子,用于夹持引线框架。
2.根据权利要求1所述的夹片机构缓冲装置,其特征在于,所述夹子、所述吸片以及所述阻尼片组成连轴机构联动。
3.根据权利要求1所述的夹片机构缓冲装置,其特征在于,所述夹片机构缓冲装置中包括多块磁铁,用于产生磁场。
4.根据权利要求4所述的夹片机构缓冲装置,其特征在于,所述磁铁可以用激磁线圈代替。
5.根据权利要求1所述的夹片机构缓冲装置,其特征在于,所述螺线管通电后,能够使所述吸板向下运动,所述吸板带动所述阻尼片及夹子运动。
6.根据权利要求1所述的夹片机构缓冲装置,其特征在于,所述吸板和阻尼片是由金属材料制成的。
CN201310589133.2A 2013-11-20 2013-11-20 夹片机构缓冲装置 Expired - Fee Related CN103579072B (zh)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105563377A (zh) * 2015-11-17 2016-05-11 深圳市德沃先进自动化有限公司 机械爪
CN113506761A (zh) * 2021-07-01 2021-10-15 泉州盈创电子有限公司 维修机顶盒芯片用植球工装

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1507021A (zh) * 2002-11-21 2004-06-23 先进科技新加坡有限公司 夹具驱动机构
US20050211867A1 (en) * 2004-03-24 2005-09-29 Margeson Christopher S Acceleration clamp assist
CN102777525A (zh) * 2012-07-10 2012-11-14 北京航空航天大学 一种用于抑制轴向振动的电涡流耗能阻尼器

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1507021A (zh) * 2002-11-21 2004-06-23 先进科技新加坡有限公司 夹具驱动机构
US20050211867A1 (en) * 2004-03-24 2005-09-29 Margeson Christopher S Acceleration clamp assist
CN102777525A (zh) * 2012-07-10 2012-11-14 北京航空航天大学 一种用于抑制轴向振动的电涡流耗能阻尼器

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105563377A (zh) * 2015-11-17 2016-05-11 深圳市德沃先进自动化有限公司 机械爪
CN105563377B (zh) * 2015-11-17 2018-09-18 深圳市德沃先进自动化有限公司 机械爪
CN113506761A (zh) * 2021-07-01 2021-10-15 泉州盈创电子有限公司 维修机顶盒芯片用植球工装
CN113506761B (zh) * 2021-07-01 2023-09-22 泉州盈创电子股份公司 维修机顶盒芯片用植球工装

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