CN100427258C - 丝焊器 - Google Patents

丝焊器 Download PDF

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CN100427258C
CN100427258C CNB2004100485032A CN200410048503A CN100427258C CN 100427258 C CN100427258 C CN 100427258C CN B2004100485032 A CNB2004100485032 A CN B2004100485032A CN 200410048503 A CN200410048503 A CN 200410048503A CN 100427258 C CN100427258 C CN 100427258C
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迪特尔·菲舍
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Xun Shi Weiss Co.,Ltd. Unisys
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Abstract

用于通过引导焊丝的细管(2)形成两个接点之间的焊丝连接的丝焊器的焊接头(1)成形为一个动臂机构。该动臂机构包括由第一电机(3)驱动的第一转臂(4);由第二电机(5)驱动的第二转臂(6);以及两个连接臂(7、8)。利用这种动臂机构,细管(2)的运动通过旋转运动产生。

Description

丝焊器
技术领域
本发明涉及一种丝焊器。
背景技术
丝焊器是一种在半导体芯片安装到基片之后利用其进行半导体芯片布线的设备。丝焊器具有一个细管,它夹在电极臂(horn)的末端。细管用于将焊丝固定到半导体芯片上的接点和基片上的接点并且引导这两个接点之间的焊丝。在形成半导体芯片上的接点和基片上的接点之间的焊丝连接时,首先将从细管突出的焊丝的端部熔制成线球。随后,利用压力和超声波将线球固定到半导体芯片上的接点。为此目的,超声波从超声换能器施加于电极臂。这种处理过程称为球焊。然后焊丝被拉至需要的长度,形成焊丝圈并焊接于基片上的接点。该处理过程的最后部分称为楔焊。在将焊丝固定到基片上的接点之后,扯断焊丝可以开始下一个接合。
目前市场上可得到的大多数丝焊器利用两个正交布置的驱动器在水平的xy平面内移动焊接头(bondhead)。这种驱动系统的一个例子比如公开在专利说明书EP317787中。另外,这种驱动系统使用真空预加压空气轴承。这种已知的丝焊器的一个显著的缺点在于当将焊接头移动到一个新位置时,必须要加速较大的质量。这需要大功率的驱动系统和结实的轴承。另一个缺点在于,根据焊接头的位置,在加速焊接头时产生较大的扭矩,这对焊接头的轴承提出了极大的要求。这限制了最大可能加速度值并且因而限制了丝焊器的生产能力。
从专利说明书US5330089可知一种利用极性(polar)驱动系统实现焊接头的移动的丝焊器。也需要通过这种驱动系统加速较大的质量。另外,由电机转动加速的载荷取决于载荷相对于直线轴线的位置,这一方面阻碍了焊接头运动的调整,而且另一方面限制了最大可能加速度值。
从中国专利申请CN1302713可知一种利用旋转驱动系统实现焊接头的移动的丝焊器。这种驱动系统具有需要加速较大质量的直线轴线和需要加速较小质量的旋转轴线。
发明内容
本发明的目的在于改进丝焊器,能够实现细管的最快的可能的运动。
根据本发明,提供一种丝焊器,用于形成两个接点之间的焊丝连接,包括一个焊接头,该焊接头具有一个引导焊丝的细管,该焊接头包括:第一转臂,可转动地安装在固定的第一轴线上;第一电机,用于转动第一转臂;第二转臂,可转动地安装在固定的第一轴线上;第二电机,用于转动第二转臂;第一连接臂,可转动地安装在第二轴线上,该第二轴线位于第二转臂的远离第一轴线的第一端部;以及第二连接臂,可转动地安装在第三轴线上,该第三轴线位于第一转臂的远离第一轴线的第一端部,其中所述两个连接臂可转动地安装在第四轴线上,其中固定的第一轴线、第二轴线、第三轴线和第四轴线相互平行,并且其中第一转臂、第二转臂、第一连接臂和第二连接臂合作形成动臂机构。
优选地,第一转臂具有几乎以直角弯曲的第二端部,并且第一电机是线性电机,它包括设置在第一转臂的第二端部上的定子和线圈,并且其中第二转臂具有几乎以直角弯曲的第二端部,并且第二电机是线性电机,它包括设置在第二转臂的第二端部上的定子和线圈。
优选地,第一电机是音圈电机,其具有三个轭条,并且轭条被弯曲。
优选地,丝焊器进一步包括安装在第二连接臂上并可以沿水平轴线转动的摇杆,该摇杆带有一个电极臂,超声波可以施加于该电极臂,并且电极臂的末端夹持一个细管。
根据本发明,提出将用于通过引导焊丝的细管形成两个接点之间的焊丝连接的丝焊器的焊接头成形为一个动臂(pantograph)机构。该动臂机构包括由第一电机驱动的第一转臂;由第二电机驱动的第二转臂;以及两个连接臂。第一转臂和第二转臂可以沿固定的第一轴线转动。第一连接臂可以沿第二轴线转动,该第二轴线位于第二转臂的远离第一轴线的端部。第二连接臂可以沿第三轴线转动,该第三轴线位于第一转臂的远离第一轴线的端部。这两个连接臂可转动地连接在第四轴线上。利用这种动臂机构,通过旋转运动产生细管的运动。其优点在于大量对称结构使得两个电机的负荷相同,即具有两个几乎等重的轴,而不象转动焊接头那样一个重载轴一个轻载轴。
附图说明
下面,根据附图更加详细地说明本发明的实施例。
附图中:
图1是根据本发明第一实施例的丝焊器的焊接头;以及
图2是根据本发明第二实施例的丝焊器的焊接头。
具体实施方式
图1示出根据本发明第一实施例的丝焊器的焊接头的透视图。利用细管2引导焊丝,焊接头1用来形成半导体芯片上的接点即所谓焊点和基片上的接点之间的焊丝连接。焊接头1包括由第一电机3驱动的第一转臂4;由第二电机5驱动的第二转臂6;以及两个连接臂7和8。第一转臂4和第二转臂6都可以沿同一轴线9转动。第一电机3沿轴线9转动第一转臂4,第二电机5沿轴线9转动第二转臂6。这两个电机3和5固定安装在丝焊器的未示出的机座上。这两个转臂4和6以及这两个连接臂7和8形成所谓的动臂机构:利用第一螺栓10,第一连接臂7可以沿轴线11转动,该轴线11位于第二转臂6的远离轴线9的端部,利用第二螺栓12,第二连接臂8可以沿轴线13转动,该轴线13位于第一转臂4的远离轴线9的端部,利用第三螺栓14,这两个连接臂7和8可转动地连接在第四轴线15。轴线9和11之间的距离等于轴线13和15之间的距离,轴线9和13之间的距离等于轴线11和15之间的距离。因此第一连接臂7总是平行于第一转臂4,而第二连接臂8总是平行于第二转臂6。轴线9、11、13和15优选地沿垂直方向相互平行。这两个转臂4和6的转动由箭头表示。电机3和5的转动范围以及转臂4和6及两个连接臂7和8的长度确定了细管2可以运动的工作区域17的大小。
可以沿水平轴线16转动的摇杆18安装在第二连接臂8上,其中该摇杆18带有一个电极臂19,来自超声换能器的超声波可以施加于该电极臂19,电极臂19的末端夹持有一个细管2。电机20设置在第二连接臂8上用于转动摇杆18。第二连接臂8上还设置有摄像机21或者连接于摄像机的光学系统,用于确定半导体芯片或者基片的焊点位置。从中国专利申请CN1334599可以获知一种光学系统,它在细管撞击在焊点上之前确定细管2的末端相对于焊点的位置。
图2表示根据本发明第二实施例的丝焊器的焊接头的透视图。与第一实施例不同之处在于电机3和5是线性电机,它包括刚性设置的定子22或23以及安装在相应的转臂4和6上的线圈24或25。在该实施例中,两个转臂4和6是细长形的并且具有几乎以直角弯曲的端部4′和6′用来放置线圈24和25。转臂4和6支撑在安装于丝焊器的基座26上的螺栓27上。合适的线性电机例如所谓的音圈电机,其定子具有E形磁轭。磁轭具有由连接条31连接起来的三个轭条28、29和30。安装在转臂上的线圈环绕这三个轭条中的中间轭条29。因为线圈运动发生在中心为轴线9的圆形路径32上,因此轭条28、29和30被相应于圆形路径32的半径R弯曲。圆形路径的半径R越大,这两个线性电机为了覆盖细管2的给定工作区域17所必须具有的行程就越小。但是,行程越小,对这两个线性电机的位置精度的要求就越高。该实施例中没有表示出摄像机,并且仅仅示意性地表示了摇杆19。
在这两个实施例中,细管末端在焊接头1的工作范围内的位置由两个角度确定,即表示第一转臂4相对于第一预定轴线的角度α,以及表示第二转臂6相对于第二预定轴线的角度β。细管2从由角度α1和β1确定的第一点A=(α1,β1)到由角度α2和β2确定的第二点B=(α2,β2)的运动必须转换成对应于所需路径的坐标α(t),β(t),其中数值t表示一个参数。数值t例如表示时间,其中坐标对α(t),β(t)表示细管2在时间t时的位置。
尽管表示和说明了本发明的实施例应用,但是对于本领域技术人员来说,在本说明的启发下可以做出更多的修改,而不脱离本发明的概念。因此本发明并不局限于所附权利要求及其等同物内。

Claims (4)

1、丝焊器,用于形成两个接点之间的焊丝连接,包括一个焊接头(1),该焊接头(1)具有一个引导焊丝的细管(2),该焊接头包括:
第一转臂(4),可转动地安装在固定的第一轴线(9)上;
第一电机(3),用于转动第一转臂(4);
第二转臂(6),可转动地安装在固定的第一轴线(9)上;
第二电机(5),用于转动第二转臂(6);
第一连接臂(7),可转动地安装在第二轴线(11)上,该第二轴线(11)位于第二转臂(6)的远离第一轴线(9)的第一端部;以及
第二连接臂(8),可转动地安装在第三轴线(13)上,该第三轴线(13)位于第一转臂(4)的远离第一轴线(9)的第一端部,其中所述两个连接臂(7、8)可转动地安装在第四轴线(15)上,
其中固定的第一轴线(9)、第二轴线(11)、第三轴线(13)和第四轴线(15)相互平行,并且其中第一转臂(4)、第二转臂(6)、第一连接臂(7)和第二连接臂(8)合作形成动臂机构。
2、如权利要求1所述的丝焊器,其特征在于,第一转臂(4)具有几乎以直角弯曲的第二端部(4′),并且第一电机(3)是线性电机,它包括刚性设置的定子(22)和设置在第一转臂(4)的第二端部(4′)上的线圈(24),并且其中第二转臂(6)具有几乎以直角弯曲的第二端部(6′),并且第二电机(5)是线性电机,它包括刚性设置的定子(23)和设置在第二转臂(6)的第二端部(6′)上的线圈(25)。
3、如权利要求2所述的丝焊器,其特征在于,第一电机(3)是音圈电机,其具有三个轭条(28、29、30),并且其中轭条(28、29、30)被弯曲。
4、如权利要求1到3中任一项所述的丝焊器,进一步包括安装在第二连接臂(8)上并可以沿水平轴线(16)转动的摇杆(18),该摇杆(18)带有一个电极臂(19),超声波可以施加于该电极臂(19),并且电极臂(19)的末端夹持一个细管(2)。
CNB2004100485032A 2003-06-06 2004-06-07 丝焊器 Expired - Fee Related CN100427258C (zh)

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CH1007/2003 2003-06-06
CH1007/03 2003-06-06
CH10072003 2003-06-06

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CN1572408A CN1572408A (zh) 2005-02-02
CN100427258C true CN100427258C (zh) 2008-10-22

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Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3993157B2 (ja) * 2003-10-23 2007-10-17 株式会社新川 ボンディング装置
DE102005044048B4 (de) * 2004-09-30 2007-05-03 Unaxis International Trading Ltd. Wire Bonder
JP4762934B2 (ja) * 2007-02-28 2011-08-31 株式会社新川 ホーン取付用アーム
WO2008151964A1 (de) * 2007-06-15 2008-12-18 Oerlikon Assembly Equipment Ag, Steinhausen Bondkopf fuer einen wire bonder
JP4343985B2 (ja) * 2008-01-24 2009-10-14 株式会社新川 ボンディング装置及びボンディング装置のボンディングステージ高さ調整方法
CN102039278B (zh) * 2009-10-15 2013-03-13 旺矽科技股份有限公司 分送装置
US8091762B1 (en) * 2010-12-08 2012-01-10 Asm Assembly Automation Ltd Wedge bonding method incorporating remote pattern recognition system
JP5164230B1 (ja) * 2011-09-28 2013-03-21 株式会社カイジョー ボンディング装置
CN103350301B (zh) * 2013-06-28 2015-07-29 上海气焊机厂有限公司 一种工件定位装置
JP5723426B2 (ja) * 2013-09-02 2015-05-27 株式会社カイジョー 駆動機構及び製造装置
JP6250372B2 (ja) * 2013-11-22 2017-12-20 Ntn株式会社 自動溶接機
US11420287B2 (en) * 2019-09-29 2022-08-23 Ningbo Shangjin Automation Technology Co., Ltd. Wire clamping system for fully automatic wire bonding machine
US11842978B1 (en) * 2022-07-15 2023-12-12 Asmpt Singapore Pte. Ltd. Wire bonding system including a wire biasing tool

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5114302A (en) * 1987-11-25 1992-05-19 Esec Sa Apparatus for performing in-feed of working member to working station
US5330089A (en) * 1991-04-26 1994-07-19 Texas Instruments Incorporated Polar bond head
CN1111035A (zh) * 1994-02-03 1995-11-01 松下电器产业株式会社 超声波引线焊接装置
CN1302713A (zh) * 1999-11-02 2001-07-11 Esec贸易公司 用于丝焊器的焊接头
CN1334599A (zh) * 2000-07-21 2002-02-06 Esec贸易公司 用来形成导线连接的设备

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2900830A (en) * 1956-12-18 1959-08-25 Evg Entwicklung Verwert Ges Linkage for describing a straight line
US3256007A (en) * 1962-10-02 1966-06-14 Dayton Malleable Iron Co Torque rod suspension for truck axles
AT252692B (de) * 1964-07-08 1967-03-10 Evg Entwicklung Verwert Ges Geradführungsvorrichtung, insbesondere zum Zuführen der Querstäbe bei Gitterschweißmaschinen
US3474685A (en) * 1967-11-13 1969-10-28 Miller Charles F Micro-positioner
US3653268A (en) * 1970-03-10 1972-04-04 John C Diepeveen Tool moving mechanism
US3813022A (en) * 1972-06-19 1974-05-28 Automated Equipment Corp Wire bonder apparatus
GB1506164A (en) * 1974-07-09 1978-04-05 Mullard Ltd Ultrasonic bonding apparatus
GB2149707B (en) * 1983-11-15 1987-10-28 Hitachi Shipbuilding Eng Co Automatic welding apparatus
ES2107425T3 (es) * 1989-06-08 1997-12-01 Yoshiki Kogyo Kk Palanca que presenta un punto de apoyo libremente desplazable en traslacion y aparato mecanico que utiliza esta palanca.
JP2501946B2 (ja) * 1990-09-26 1996-05-29 三菱電機株式会社 ダイボンド装置およびその制御方法
US5154022A (en) * 1991-06-21 1992-10-13 International Business Machines Corporation High precision micromachining of very fine features
JPH0957680A (ja) * 1995-08-18 1997-03-04 Tokico Ltd 工業用ロボット
TW334622B (en) * 1996-04-17 1998-06-21 Esec Sa Apparatus for making wire connections on semiconductor chips
JP2851267B2 (ja) 1996-08-09 1999-01-27 パーク クワン−スー コンピュータモニタ箱の自動昇降装置
US5971254A (en) * 1997-01-02 1999-10-26 Texas Instruments Incorporated Decoupled xyz stage
US6164514A (en) * 1998-09-15 2000-12-26 Miller; Charles F. Micro-manipulator for ultrasonic bonding with orthogonal tool support slides
JP3718395B2 (ja) * 1999-11-12 2005-11-24 超音波工業株式会社 ボンディング装置のボンディングヘッド

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5114302A (en) * 1987-11-25 1992-05-19 Esec Sa Apparatus for performing in-feed of working member to working station
US5330089A (en) * 1991-04-26 1994-07-19 Texas Instruments Incorporated Polar bond head
CN1111035A (zh) * 1994-02-03 1995-11-01 松下电器产业株式会社 超声波引线焊接装置
US5667130A (en) * 1994-02-03 1997-09-16 Matsushita Electric Industrial Co., Ltd. Ultrasonic wire bonding apparatus and method
CN1302713A (zh) * 1999-11-02 2001-07-11 Esec贸易公司 用于丝焊器的焊接头
CN1334599A (zh) * 2000-07-21 2002-02-06 Esec贸易公司 用来形成导线连接的设备

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TWI255515B (en) 2006-05-21
DE102004026434A1 (de) 2005-01-13
TW200507129A (en) 2005-02-16
US20040245314A1 (en) 2004-12-09
US7159751B2 (en) 2007-01-09
KR20040108576A (ko) 2004-12-24

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