CN100427258C - 丝焊器 - Google Patents
丝焊器 Download PDFInfo
- Publication number
- CN100427258C CN100427258C CNB2004100485032A CN200410048503A CN100427258C CN 100427258 C CN100427258 C CN 100427258C CN B2004100485032 A CNB2004100485032 A CN B2004100485032A CN 200410048503 A CN200410048503 A CN 200410048503A CN 100427258 C CN100427258 C CN 100427258C
- Authority
- CN
- China
- Prior art keywords
- pivoted arm
- axis
- motor
- arm
- wire bonder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 210000005239 tubule Anatomy 0.000 claims description 19
- 238000003466 welding Methods 0.000 claims description 16
- 238000005452 bending Methods 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 description 7
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 210000001503 joint Anatomy 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
- B23K20/004—Wire welding
- B23K20/005—Capillary welding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
- H01L21/607—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation involving the application of mechanical vibrations, e.g. ultrasonic vibrations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/788—Means for moving parts
- H01L2224/78821—Upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
- H01L2224/78822—Rotational mechanism
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01027—Cobalt [Co]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19042—Component type being an inductor
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Wire Bonding (AREA)
Abstract
Description
Claims (4)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH1007/2003 | 2003-06-06 | ||
CH1007/03 | 2003-06-06 | ||
CH10072003 | 2003-06-06 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1572408A CN1572408A (zh) | 2005-02-02 |
CN100427258C true CN100427258C (zh) | 2008-10-22 |
Family
ID=33480364
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2004100485032A Expired - Fee Related CN100427258C (zh) | 2003-06-06 | 2004-06-07 | 丝焊器 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7159751B2 (zh) |
KR (1) | KR20040108576A (zh) |
CN (1) | CN100427258C (zh) |
DE (1) | DE102004026434A1 (zh) |
TW (1) | TWI255515B (zh) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3993157B2 (ja) * | 2003-10-23 | 2007-10-17 | 株式会社新川 | ボンディング装置 |
DE102005044048B4 (de) * | 2004-09-30 | 2007-05-03 | Unaxis International Trading Ltd. | Wire Bonder |
JP4762934B2 (ja) * | 2007-02-28 | 2011-08-31 | 株式会社新川 | ホーン取付用アーム |
WO2008151964A1 (de) * | 2007-06-15 | 2008-12-18 | Oerlikon Assembly Equipment Ag, Steinhausen | Bondkopf fuer einen wire bonder |
JP4343985B2 (ja) * | 2008-01-24 | 2009-10-14 | 株式会社新川 | ボンディング装置及びボンディング装置のボンディングステージ高さ調整方法 |
CN102039278B (zh) * | 2009-10-15 | 2013-03-13 | 旺矽科技股份有限公司 | 分送装置 |
US8091762B1 (en) * | 2010-12-08 | 2012-01-10 | Asm Assembly Automation Ltd | Wedge bonding method incorporating remote pattern recognition system |
JP5164230B1 (ja) * | 2011-09-28 | 2013-03-21 | 株式会社カイジョー | ボンディング装置 |
CN103350301B (zh) * | 2013-06-28 | 2015-07-29 | 上海气焊机厂有限公司 | 一种工件定位装置 |
JP5723426B2 (ja) * | 2013-09-02 | 2015-05-27 | 株式会社カイジョー | 駆動機構及び製造装置 |
JP6250372B2 (ja) * | 2013-11-22 | 2017-12-20 | Ntn株式会社 | 自動溶接機 |
US11420287B2 (en) * | 2019-09-29 | 2022-08-23 | Ningbo Shangjin Automation Technology Co., Ltd. | Wire clamping system for fully automatic wire bonding machine |
US11842978B1 (en) * | 2022-07-15 | 2023-12-12 | Asmpt Singapore Pte. Ltd. | Wire bonding system including a wire biasing tool |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5114302A (en) * | 1987-11-25 | 1992-05-19 | Esec Sa | Apparatus for performing in-feed of working member to working station |
US5330089A (en) * | 1991-04-26 | 1994-07-19 | Texas Instruments Incorporated | Polar bond head |
CN1111035A (zh) * | 1994-02-03 | 1995-11-01 | 松下电器产业株式会社 | 超声波引线焊接装置 |
CN1302713A (zh) * | 1999-11-02 | 2001-07-11 | Esec贸易公司 | 用于丝焊器的焊接头 |
CN1334599A (zh) * | 2000-07-21 | 2002-02-06 | Esec贸易公司 | 用来形成导线连接的设备 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2900830A (en) * | 1956-12-18 | 1959-08-25 | Evg Entwicklung Verwert Ges | Linkage for describing a straight line |
US3256007A (en) * | 1962-10-02 | 1966-06-14 | Dayton Malleable Iron Co | Torque rod suspension for truck axles |
AT252692B (de) * | 1964-07-08 | 1967-03-10 | Evg Entwicklung Verwert Ges | Geradführungsvorrichtung, insbesondere zum Zuführen der Querstäbe bei Gitterschweißmaschinen |
US3474685A (en) * | 1967-11-13 | 1969-10-28 | Miller Charles F | Micro-positioner |
US3653268A (en) * | 1970-03-10 | 1972-04-04 | John C Diepeveen | Tool moving mechanism |
US3813022A (en) * | 1972-06-19 | 1974-05-28 | Automated Equipment Corp | Wire bonder apparatus |
GB1506164A (en) * | 1974-07-09 | 1978-04-05 | Mullard Ltd | Ultrasonic bonding apparatus |
GB2149707B (en) * | 1983-11-15 | 1987-10-28 | Hitachi Shipbuilding Eng Co | Automatic welding apparatus |
ES2107425T3 (es) * | 1989-06-08 | 1997-12-01 | Yoshiki Kogyo Kk | Palanca que presenta un punto de apoyo libremente desplazable en traslacion y aparato mecanico que utiliza esta palanca. |
JP2501946B2 (ja) * | 1990-09-26 | 1996-05-29 | 三菱電機株式会社 | ダイボンド装置およびその制御方法 |
US5154022A (en) * | 1991-06-21 | 1992-10-13 | International Business Machines Corporation | High precision micromachining of very fine features |
JPH0957680A (ja) * | 1995-08-18 | 1997-03-04 | Tokico Ltd | 工業用ロボット |
TW334622B (en) * | 1996-04-17 | 1998-06-21 | Esec Sa | Apparatus for making wire connections on semiconductor chips |
JP2851267B2 (ja) | 1996-08-09 | 1999-01-27 | パーク クワン−スー | コンピュータモニタ箱の自動昇降装置 |
US5971254A (en) * | 1997-01-02 | 1999-10-26 | Texas Instruments Incorporated | Decoupled xyz stage |
US6164514A (en) * | 1998-09-15 | 2000-12-26 | Miller; Charles F. | Micro-manipulator for ultrasonic bonding with orthogonal tool support slides |
JP3718395B2 (ja) * | 1999-11-12 | 2005-11-24 | 超音波工業株式会社 | ボンディング装置のボンディングヘッド |
-
2004
- 2004-05-25 US US10/853,328 patent/US7159751B2/en not_active Expired - Fee Related
- 2004-05-29 DE DE102004026434A patent/DE102004026434A1/de not_active Withdrawn
- 2004-05-31 TW TW093115459A patent/TWI255515B/zh not_active IP Right Cessation
- 2004-06-02 KR KR1020040039878A patent/KR20040108576A/ko not_active Application Discontinuation
- 2004-06-07 CN CNB2004100485032A patent/CN100427258C/zh not_active Expired - Fee Related
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5114302A (en) * | 1987-11-25 | 1992-05-19 | Esec Sa | Apparatus for performing in-feed of working member to working station |
US5330089A (en) * | 1991-04-26 | 1994-07-19 | Texas Instruments Incorporated | Polar bond head |
CN1111035A (zh) * | 1994-02-03 | 1995-11-01 | 松下电器产业株式会社 | 超声波引线焊接装置 |
US5667130A (en) * | 1994-02-03 | 1997-09-16 | Matsushita Electric Industrial Co., Ltd. | Ultrasonic wire bonding apparatus and method |
CN1302713A (zh) * | 1999-11-02 | 2001-07-11 | Esec贸易公司 | 用于丝焊器的焊接头 |
CN1334599A (zh) * | 2000-07-21 | 2002-02-06 | Esec贸易公司 | 用来形成导线连接的设备 |
Also Published As
Publication number | Publication date |
---|---|
CN1572408A (zh) | 2005-02-02 |
TWI255515B (en) | 2006-05-21 |
DE102004026434A1 (de) | 2005-01-13 |
TW200507129A (en) | 2005-02-16 |
US20040245314A1 (en) | 2004-12-09 |
US7159751B2 (en) | 2007-01-09 |
KR20040108576A (ko) | 2004-12-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: UNISYS XUN SCHWEITZER CO., LTD. Free format text: FORMER OWNER: YOU LI XUN INTERNATIONAL TRADE CO., LTD. Effective date: 20081010 Owner name: OERLIKON SEAL EQUIPMENT CO., LTD., STEINHAUSEN Free format text: FORMER OWNER: UNISYS XUN SCHWEITZER CO., LTD. Effective date: 20081010 |
|
C41 | Transfer of patent application or patent right or utility model | ||
C56 | Change in the name or address of the patentee |
Owner name: YOU LI XUN INTERNATIONAL TRADE CO., LTD. Free format text: FORMER NAME OR ADDRESS: ESEC TRADE CORPORATION |
|
CP01 | Change in the name or title of a patent holder |
Address after: Swiss Camden Patentee after: Unisys Xun International trade LLC Address before: Swiss Camden Patentee before: ESEC TRADING S.A. |
|
TR01 | Transfer of patent right |
Effective date of registration: 20081010 Address after: Swiss Camden Patentee after: ESEC Trading S.A. Address before: Swiss Camden Patentee before: Xun Shi Weiss Co.,Ltd. Unisys Effective date of registration: 20081010 Address after: Swiss Camden Patentee after: Xun Shi Weiss Co.,Ltd. Unisys Address before: Swiss Camden Patentee before: Unisys Xun International trade LLC |
|
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20081022 Termination date: 20100607 |