JP3993157B2 - ボンディング装置 - Google Patents
ボンディング装置 Download PDFInfo
- Publication number
- JP3993157B2 JP3993157B2 JP2003362711A JP2003362711A JP3993157B2 JP 3993157 B2 JP3993157 B2 JP 3993157B2 JP 2003362711 A JP2003362711 A JP 2003362711A JP 2003362711 A JP2003362711 A JP 2003362711A JP 3993157 B2 JP3993157 B2 JP 3993157B2
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- bonding head
- motor
- arm
- movable arm
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
- B23K20/004—Wire welding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/789—Means for monitoring the connection process
- H01L2224/78901—Means for monitoring the connection process using a computer, e.g. fully- or semi-automatic bonding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01007—Nitrogen [N]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01027—Cobalt [Co]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01075—Rhenium [Re]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01076—Osmium [Os]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Wire Bonding (AREA)
- Die Bonding (AREA)
Description
Claims (5)
- ボンディング対象に対しボンディング作業を行うボンディングヘッド部と、ボンディングヘッド部を任意の位置に移動させる移動機構とを含むボンディング装置であって、
移動機構は、
第1モータと、
第1モータの駆動軸に取り付けられ、架台に平行な面内で回転する第1駆動アームと、
第1駆動アームに回転自在に支持される第1可動アームと、
第2モータと、
第2モータの駆動軸に取り付けられ、架台に平行な面内で回転する第2駆動アームと、
第2駆動アームに回転自在に支持される第2可動アームと、
を含み、
ボンディングヘッド部に第1可動アームが固定され、第2可動アームが軸支されることを特徴とするボンディング装置。 - 請求項1に記載のボンディング装置において、
第1可動アームの回転中心と第1可動アームがボンディングヘッド部に固定される固定点とを結ぶ直線と、第2可動アームの回転中心と第2可動アームがボンディングヘッド部に軸支される軸支点とを結ぶ直線との交点が、ボンディングヘッド部の重心位置に略一致することを特徴とするボンディング装置。 - 請求項1に記載のボンディング装置において、
ボンディングヘッド部は架台に対し流体圧により支持されることを特徴とするボンディング装置。 - 請求項1に記載のボンディング装置において、
架台は、ボンディングヘッド部を吊り下げて支持する吊り下げ架台であることを特徴とするボンディング装置。 - 請求項1に記載のボンディング装置において、
第1駆動アームの回転角度を検出する第1センサと、
第2駆動アームの回転角度を検出する第2センサと、
第1センサの検出データ及び第2センサの検出データに基づき、ボンディングヘッド部の位置を架台に対する直交座標系の位置として算出する位置算出手段と、
算出された直交座標系の位置に基づいてボンディングヘッド部の位置制御を行う制御手段と、
を備えることを特徴とするボンディング装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003362711A JP3993157B2 (ja) | 2003-10-23 | 2003-10-23 | ボンディング装置 |
US10/973,364 US7293686B2 (en) | 2003-10-23 | 2004-10-25 | Bonding apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003362711A JP3993157B2 (ja) | 2003-10-23 | 2003-10-23 | ボンディング装置 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2005129673A JP2005129673A (ja) | 2005-05-19 |
JP2005129673A5 JP2005129673A5 (ja) | 2006-01-26 |
JP3993157B2 true JP3993157B2 (ja) | 2007-10-17 |
Family
ID=34587172
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003362711A Expired - Fee Related JP3993157B2 (ja) | 2003-10-23 | 2003-10-23 | ボンディング装置 |
Country Status (2)
Country | Link |
---|---|
US (1) | US7293686B2 (ja) |
JP (1) | JP3993157B2 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4141401B2 (ja) * | 2004-03-26 | 2008-08-27 | 株式会社新川 | ボンディング装置 |
JP2008034811A (ja) * | 2006-07-03 | 2008-02-14 | Shinkawa Ltd | ワイヤボンディング装置におけるボール形成装置及びボンディング装置 |
JP4762934B2 (ja) * | 2007-02-28 | 2011-08-31 | 株式会社新川 | ホーン取付用アーム |
US10050008B1 (en) * | 2017-01-24 | 2018-08-14 | Asm Technology Singapore Pte Ltd | Method and system for automatic bond arm alignment |
JP7009836B2 (ja) * | 2017-08-24 | 2022-01-26 | Tdk株式会社 | 部品吸着搬送機 |
US11289446B2 (en) * | 2018-03-28 | 2022-03-29 | Asm Technology Singapore Pte Ltd | Multiple actuator wire bonding apparatus |
CN112589323B (zh) * | 2020-12-07 | 2023-06-16 | 湖南华湘精密科技发展有限公司 | 一种移动进给结构及精密化自动焊接设备 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5839640A (en) * | 1996-10-23 | 1998-11-24 | Texas Instruments Incorporated | Multiple-tool wire bonder |
JP4021158B2 (ja) | 2001-04-27 | 2007-12-12 | 株式会社新川 | 半導体製造装置におけるxyテーブル |
JP4018057B2 (ja) * | 2003-03-31 | 2007-12-05 | 株式会社新川 | ボンディング装置 |
US7159751B2 (en) * | 2003-06-06 | 2007-01-09 | Esec Trading Sa | Wire bonder |
-
2003
- 2003-10-23 JP JP2003362711A patent/JP3993157B2/ja not_active Expired - Fee Related
-
2004
- 2004-10-25 US US10/973,364 patent/US7293686B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US20050109815A1 (en) | 2005-05-26 |
JP2005129673A (ja) | 2005-05-19 |
US7293686B2 (en) | 2007-11-13 |
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