JP4141401B2 - ボンディング装置 - Google Patents
ボンディング装置 Download PDFInfo
- Publication number
- JP4141401B2 JP4141401B2 JP2004092176A JP2004092176A JP4141401B2 JP 4141401 B2 JP4141401 B2 JP 4141401B2 JP 2004092176 A JP2004092176 A JP 2004092176A JP 2004092176 A JP2004092176 A JP 2004092176A JP 4141401 B2 JP4141401 B2 JP 4141401B2
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- drive motor
- link
- capillary
- rear link
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
- B23K20/004—Wire welding
- B23K20/005—Capillary welding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78343—Means for applying energy, e.g. heating means by means of pressure by ultrasonic vibrations
- H01L2224/7835—Stable and mobile yokes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/788—Means for moving parts
- H01L2224/78821—Upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
- H01L2224/78822—Rotational mechanism
- H01L2224/78823—Pivoting mechanism
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Wire Bonding (AREA)
Description
2 キャピラリ
3 ワイヤ
4 前方リンク
5、5a、6 支軸
7 ボンディングヘッド
10 後方リンク
11、11a、12 支軸
20 駆動モータ
30、31、32、33 十字板ばね
34、35 取付部材
Claims (3)
- キャピラリを一端に保持したボンディングアームと、下端部が前記ボンディングアームに回転自在に支承され、上方部がボンディングヘッドに回転自在に支承された前方リンクと、下端部が前記ボンディングアームの後端部に回転自在に支承され、上方部がボンディングヘッドに回転自在に支承された後方リンクと、前記キャピラリを上下駆動させる駆動モータとを備え、前記キャピラリの仮想回転中心が前記前方リンクの上下の回転中心を結ぶ線の延長と、前記後方リンクの上下の回転中心を結ぶ線の延長との交点で、かつボンディング面になるように構成されたボンディング装置において、前記駆動モータの固定部を前記ボンディングヘッドに固定し、駆動モータの回転部を前記後方リンクの上方の回転中心を中心として回転可能に該後方リンクの上端部に固定し、前記駆動モータの回転部を設けた前記後方リンクの重心位置が、前記後方リンクの回転中心の上方であって、かつその回転中心を含む平面に関し、前記ボンディングアーム側に存在するように構成したことを特徴とするボンディング装置。
- 前記駆動モータは、円弧状よりなることを特徴とする請求項1記載のボンディング装置。
- 前記駆動モータは、コイルが前記ボンディングヘッドに固定され、磁石が前記後方リンクに固定されていることを特徴とする請求項1又は2記載のボンディング装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004092176A JP4141401B2 (ja) | 2004-03-26 | 2004-03-26 | ボンディング装置 |
TW094101994A TW200532830A (en) | 2004-03-26 | 2005-01-24 | Bonding apparatus |
KR1020050015639A KR100628707B1 (ko) | 2004-03-26 | 2005-02-25 | 본딩장치 |
US11/089,262 US7306132B2 (en) | 2004-03-26 | 2005-03-24 | Bonding apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004092176A JP4141401B2 (ja) | 2004-03-26 | 2004-03-26 | ボンディング装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005277325A JP2005277325A (ja) | 2005-10-06 |
JP4141401B2 true JP4141401B2 (ja) | 2008-08-27 |
Family
ID=34988585
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004092176A Expired - Fee Related JP4141401B2 (ja) | 2004-03-26 | 2004-03-26 | ボンディング装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7306132B2 (ja) |
JP (1) | JP4141401B2 (ja) |
KR (1) | KR100628707B1 (ja) |
TW (1) | TW200532830A (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7377415B2 (en) * | 2005-06-15 | 2008-05-27 | Kulicke And Soffa Industries, Inc. | Bond head link assembly for a wire bonding machine |
JP4657942B2 (ja) * | 2006-02-14 | 2011-03-23 | 株式会社新川 | ボンディング装置 |
JP4343985B2 (ja) * | 2008-01-24 | 2009-10-14 | 株式会社新川 | ボンディング装置及びボンディング装置のボンディングステージ高さ調整方法 |
US20140183181A1 (en) * | 2012-12-27 | 2014-07-03 | Pilkington Group Limited | Method and apparatus for forming a vehicle window assembly using induction soldering |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3328875A (en) * | 1965-12-20 | 1967-07-04 | Matheus D Pennings | Method of attaching conductors to terminals |
US6176414B1 (en) | 1999-11-08 | 2001-01-23 | Kulicke & Soffa Investments, Inc. | Linkage guided bond head |
JP2003197686A (ja) * | 2001-10-18 | 2003-07-11 | Nec Corp | 電子部品実装装置及び電子部品実装方法 |
JP3742359B2 (ja) | 2002-04-02 | 2006-02-01 | 株式会社新川 | ボンディング装置 |
JP3666592B2 (ja) * | 2002-05-23 | 2005-06-29 | 株式会社新川 | ボンディング装置 |
JP3993157B2 (ja) * | 2003-10-23 | 2007-10-17 | 株式会社新川 | ボンディング装置 |
-
2004
- 2004-03-26 JP JP2004092176A patent/JP4141401B2/ja not_active Expired - Fee Related
-
2005
- 2005-01-24 TW TW094101994A patent/TW200532830A/zh not_active IP Right Cessation
- 2005-02-25 KR KR1020050015639A patent/KR100628707B1/ko not_active IP Right Cessation
- 2005-03-24 US US11/089,262 patent/US7306132B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
TW200532830A (en) | 2005-10-01 |
US20050211746A1 (en) | 2005-09-29 |
US7306132B2 (en) | 2007-12-11 |
KR20060042197A (ko) | 2006-05-12 |
JP2005277325A (ja) | 2005-10-06 |
KR100628707B1 (ko) | 2006-09-29 |
TWI328845B (ja) | 2010-08-11 |
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