JP4657942B2 - ボンディング装置 - Google Patents
ボンディング装置 Download PDFInfo
- Publication number
- JP4657942B2 JP4657942B2 JP2006035980A JP2006035980A JP4657942B2 JP 4657942 B2 JP4657942 B2 JP 4657942B2 JP 2006035980 A JP2006035980 A JP 2006035980A JP 2006035980 A JP2006035980 A JP 2006035980A JP 4657942 B2 JP4657942 B2 JP 4657942B2
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- Prior art keywords
- horn
- link
- bonding
- holder
- link mechanism
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78343—Means for applying energy, e.g. heating means by means of pressure by ultrasonic vibrations
- H01L2224/7835—Stable and mobile yokes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/788—Means for moving parts
- H01L2224/78821—Upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
- H01L2224/78822—Rotational mechanism
- H01L2224/78823—Pivoting mechanism
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/852—Applying energy for connecting
- H01L2224/85201—Compression bonding
- H01L2224/85205—Ultrasonic bonding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Description
第1に、ホーンホルダを支持するリンク機構部の上方に装置固定部(フレーム)が存在するので、超音波ホーン、クランパ等の調整作業が非常に困難である。
第2に、ホーンホルダを駆動するモータの吸引力は、板ばね等のリンク機構部を座屈させる方向に働くので、この対策として、板ばねの強度アップのために複雑な構造が必要となり、性能が低下する。
第3に、ホーンホルダがリンク機構部の下方に位置するので、ホーンホルダは試料を加熱するヒートブロックの熱の影響を大きく受けることとなり、熱膨張による経時変化が発生し、高精度の実現の障害となる。
前記駆動モータは磁石とコイルとよりなり、前記磁石と前記コイルの対向面はそれぞれ前記仮想回転中心を中心とした円弧状に形成され、前記磁石又は前記コイルの一方が前記ホーンホルダに固定され、他方が前記ボンディングヘッドに固定され、前記ボンディングヘッドは、前記ホーンホルダの下方に前記リンク機構部を取付けるリンク機構取付け部を有し、前記リンク機構部の前方リンク及び後方リンクは、上方部が前記ホーンホルダに回転自在に支承され、下方部が前記リンク機構取付け部に回転自在に支承されていることを特徴とする。
また前方及び後方リンクを支持するリンク機構取付け部は前方及び後方リンクの下方に設けられているので、請求項2のように、超音波ホーン、前方リンク及び後方リンクの下方のボンディングヘッド部分に断熱カバーを設けることができ、前方リンク及び後方リンク上方のホーンホルダ部分及び駆動モータ更に超音波ホーンに対するヒートブロックによる熱の影響を低減できる。
2 キャピラリ
3 ワイヤ
4 ホーンホルダ
5 クランパ
10 ボンディングヘッド
12 リンク機構取付け部
20 前方板ばね
21 後方板ばね
22、23 上方支軸
24、25 下方支軸
26 仮想回転中心
27 ボンディング面
30 駆動モータ
31 磁石
32 コイル
40 断熱カバー
Claims (2)
- キャピラリを一端に保持した超音波ホーンと、この超音波ホーンを保持したホーンホルダと、前記キャピラリを上下駆動させる駆動モータと、ボンディングヘッドに一端部が回転自在に取付けられ、他端部が前記ホーンホルダに回転自在に取付けられて該ホーンホルダを支持する前方リンクと後方リンクとよりなるリンク機構部とを備え、前記キャピラリの仮想回転中心が前記前方リンクの上下の回転中心を結ぶ線の延長と、前記後方リンクの上下の回転中心を結ぶ線の延長との交点で、かつボンディング面になるように構成されたボンディング装置において、
前記駆動モータは磁石とコイルとよりなり、前記磁石と前記コイルの対向面はそれぞれ前記仮想回転中心を中心とした円弧状に形成され、前記磁石又は前記コイルの一方が前記ホーンホルダに固定され、他方が前記ボンディングヘッドに固定され、前記ボンディングヘッドは、前記ホーンホルダの下方に前記リンク機構部を取付けるリンク機構取付け部を有し、前記リンク機構部の前方リンク及び後方リンクは、上方部が前記ホーンホルダに回転自在に支承され、下方部が前記リンク機構取付け部に回転自在に支承されていることを特徴とするボンディング装置。 - 前記ボンディングヘッドの前記超音波ホーン、前記前方リンク及び前記後方リンクの下方部分に断熱カバーが配設されていることを特徴とする請求項1記載のボンディング装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006035980A JP4657942B2 (ja) | 2006-02-14 | 2006-02-14 | ボンディング装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006035980A JP4657942B2 (ja) | 2006-02-14 | 2006-02-14 | ボンディング装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007220698A JP2007220698A (ja) | 2007-08-30 |
JP4657942B2 true JP4657942B2 (ja) | 2011-03-23 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2006035980A Expired - Fee Related JP4657942B2 (ja) | 2006-02-14 | 2006-02-14 | ボンディング装置 |
Country Status (1)
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JP (1) | JP4657942B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ITMI20071148A1 (it) | 2007-06-05 | 2008-12-06 | Getters Spa | Batterie ricaricabili al litio comprendenti mezzi in forma di foglio polimerico multistrato per l'assorbimento di sostanze nocive |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05304184A (ja) * | 1992-04-28 | 1993-11-16 | Hitachi Ltd | ワイヤボンダのボンディングヘッド |
JP2001168135A (ja) * | 1999-11-08 | 2001-06-22 | Kulicke & Soffa Investments Inc | リンケージ誘導されたボンドヘッド |
JP2003297872A (ja) * | 2002-04-02 | 2003-10-17 | Shinkawa Ltd | ボンディング装置 |
JP2003347346A (ja) * | 2002-05-23 | 2003-12-05 | Shinkawa Ltd | ボンディング装置 |
JP2005277325A (ja) * | 2004-03-26 | 2005-10-06 | Shinkawa Ltd | ボンディング装置 |
-
2006
- 2006-02-14 JP JP2006035980A patent/JP4657942B2/ja not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05304184A (ja) * | 1992-04-28 | 1993-11-16 | Hitachi Ltd | ワイヤボンダのボンディングヘッド |
JP2001168135A (ja) * | 1999-11-08 | 2001-06-22 | Kulicke & Soffa Investments Inc | リンケージ誘導されたボンドヘッド |
JP2003297872A (ja) * | 2002-04-02 | 2003-10-17 | Shinkawa Ltd | ボンディング装置 |
JP2003347346A (ja) * | 2002-05-23 | 2003-12-05 | Shinkawa Ltd | ボンディング装置 |
JP2005277325A (ja) * | 2004-03-26 | 2005-10-06 | Shinkawa Ltd | ボンディング装置 |
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Publication number | Publication date |
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JP2007220698A (ja) | 2007-08-30 |
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