JP5702725B2 - 調整可能な抵抗を備えたシリコン系ナノスケール抵抗素子 - Google Patents
調整可能な抵抗を備えたシリコン系ナノスケール抵抗素子 Download PDFInfo
- Publication number
- JP5702725B2 JP5702725B2 JP2011531175A JP2011531175A JP5702725B2 JP 5702725 B2 JP5702725 B2 JP 5702725B2 JP 2011531175 A JP2011531175 A JP 2011531175A JP 2011531175 A JP2011531175 A JP 2011531175A JP 5702725 B2 JP5702725 B2 JP 5702725B2
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- amorphous silicon
- resistance element
- resistance
- silicon nanostructure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/20—Multistable switching devices, e.g. memristors
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
- G11C13/0021—Auxiliary circuits
- G11C13/0069—Writing or programming circuits or methods
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/56—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
- G11C13/0021—Auxiliary circuits
- G11C13/003—Cell access
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B63/00—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
- H10B63/20—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices comprising selection components having two electrodes, e.g. diodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B63/00—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
- H10B63/30—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices comprising selection components having three or more electrodes, e.g. transistors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B63/00—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
- H10B63/80—Arrangements comprising multiple bistable or multi-stable switching components of the same type on a plane parallel to the substrate, e.g. cross-point arrays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/20—Multistable switching devices, e.g. memristors
- H10N70/24—Multistable switching devices, e.g. memristors based on migration or redistribution of ionic species, e.g. anions, vacancies
- H10N70/245—Multistable switching devices, e.g. memristors based on migration or redistribution of ionic species, e.g. anions, vacancies the species being metal cations, e.g. programmable metallization cells
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/821—Device geometry
- H10N70/826—Device geometry adapted for essentially vertical current flow, e.g. sandwich or pillar type devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/841—Electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/881—Switching materials
- H10N70/884—Switching materials based on at least one element of group IIIA, IVA or VA, e.g. elemental or compound semiconductors
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2213/00—Indexing scheme relating to G11C13/00 for features not covered by this group
- G11C2213/10—Resistive cells; Technology aspects
- G11C2213/11—Metal ion trapping, i.e. using memory material including cavities, pores or spaces in form of tunnels or channels wherein metal ions can be trapped but do not react and form an electro-deposit creating filaments or dendrites
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2213/00—Indexing scheme relating to G11C13/00 for features not covered by this group
- G11C2213/10—Resistive cells; Technology aspects
- G11C2213/15—Current-voltage curve
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2213/00—Indexing scheme relating to G11C13/00 for features not covered by this group
- G11C2213/30—Resistive cell, memory material aspects
- G11C2213/33—Material including silicon
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2213/00—Indexing scheme relating to G11C13/00 for features not covered by this group
- G11C2213/70—Resistive array aspects
- G11C2213/72—Array wherein the access device being a diode
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2213/00—Indexing scheme relating to G11C13/00 for features not covered by this group
- G11C2213/70—Resistive array aspects
- G11C2213/76—Array using an access device for each cell which being not a transistor and not a diode
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Semiconductor Memories (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10392808P | 2008-10-08 | 2008-10-08 | |
| US61/103,928 | 2008-10-08 | ||
| PCT/US2009/060023 WO2010042732A2 (en) | 2008-10-08 | 2009-10-08 | Silicon-based nanoscale resistive device with adjustable resistance |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012505551A JP2012505551A (ja) | 2012-03-01 |
| JP2012505551A5 JP2012505551A5 (enExample) | 2012-11-15 |
| JP5702725B2 true JP5702725B2 (ja) | 2015-04-15 |
Family
ID=42075693
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011531175A Expired - Fee Related JP5702725B2 (ja) | 2008-10-08 | 2009-10-08 | 調整可能な抵抗を備えたシリコン系ナノスケール抵抗素子 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US8687402B2 (enExample) |
| EP (1) | EP2342750B1 (enExample) |
| JP (1) | JP5702725B2 (enExample) |
| KR (1) | KR20110080153A (enExample) |
| CN (1) | CN102177584B (enExample) |
| WO (1) | WO2010042732A2 (enExample) |
Families Citing this family (143)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7768812B2 (en) | 2008-01-15 | 2010-08-03 | Micron Technology, Inc. | Memory cells, memory cell programming methods, memory cell reading methods, memory cell operating methods, and memory devices |
| US8034655B2 (en) | 2008-04-08 | 2011-10-11 | Micron Technology, Inc. | Non-volatile resistive oxide memory cells, non-volatile resistive oxide memory arrays, and methods of forming non-volatile resistive oxide memory cells and memory arrays |
| US8211743B2 (en) | 2008-05-02 | 2012-07-03 | Micron Technology, Inc. | Methods of forming non-volatile memory cells having multi-resistive state material between conductive electrodes |
| US8134137B2 (en) | 2008-06-18 | 2012-03-13 | Micron Technology, Inc. | Memory device constructions, memory cell forming methods, and semiconductor construction forming methods |
| US9343665B2 (en) | 2008-07-02 | 2016-05-17 | Micron Technology, Inc. | Methods of forming a non-volatile resistive oxide memory cell and methods of forming a non-volatile resistive oxide memory array |
| WO2010048127A2 (en) | 2008-10-20 | 2010-04-29 | The Regents Of The University Of Michigan | A silicon based nanoscale crossbar memory |
| JP5543819B2 (ja) | 2010-03-26 | 2014-07-09 | 株式会社東芝 | 抵抗変化素子、メモリセルアレイ、及び抵抗変化装置 |
| US8411477B2 (en) | 2010-04-22 | 2013-04-02 | Micron Technology, Inc. | Arrays of vertically stacked tiers of non-volatile cross point memory cells, methods of forming arrays of vertically stacked tiers of non-volatile cross point memory cells, and methods of reading a data value stored by an array of vertically stacked tiers of non-volatile cross point memory cells |
| US8427859B2 (en) | 2010-04-22 | 2013-04-23 | Micron Technology, Inc. | Arrays of vertically stacked tiers of non-volatile cross point memory cells, methods of forming arrays of vertically stacked tiers of non-volatile cross point memory cells, and methods of reading a data value stored by an array of vertically stacked tiers of non-volatile cross point memory cells |
| US8289763B2 (en) | 2010-06-07 | 2012-10-16 | Micron Technology, Inc. | Memory arrays |
| US9601692B1 (en) | 2010-07-13 | 2017-03-21 | Crossbar, Inc. | Hetero-switching layer in a RRAM device and method |
| US9570678B1 (en) | 2010-06-08 | 2017-02-14 | Crossbar, Inc. | Resistive RAM with preferental filament formation region and methods |
| US8780601B2 (en) * | 2010-06-08 | 2014-07-15 | Hewlett-Packard Development Company, L.P. | Three-dimensional integrated circuit |
| US8946046B1 (en) | 2012-05-02 | 2015-02-03 | Crossbar, Inc. | Guided path for forming a conductive filament in RRAM |
| US9012307B2 (en) | 2010-07-13 | 2015-04-21 | Crossbar, Inc. | Two terminal resistive switching device structure and method of fabricating |
| JP5981424B2 (ja) | 2010-06-11 | 2016-08-31 | クロスバー, インコーポレイテッドCrossbar, Inc. | メモリー素子に関する柱状構造及び方法 |
| US8441835B2 (en) | 2010-06-11 | 2013-05-14 | Crossbar, Inc. | Interface control for improved switching in RRAM |
| US8374018B2 (en) * | 2010-07-09 | 2013-02-12 | Crossbar, Inc. | Resistive memory using SiGe material |
| US8168506B2 (en) | 2010-07-13 | 2012-05-01 | Crossbar, Inc. | On/off ratio for non-volatile memory device and method |
| US8947908B2 (en) | 2010-11-04 | 2015-02-03 | Crossbar, Inc. | Hetero-switching layer in a RRAM device and method |
| US8467227B1 (en) | 2010-11-04 | 2013-06-18 | Crossbar, Inc. | Hetero resistive switching material layer in RRAM device and method |
| US8569172B1 (en) | 2012-08-14 | 2013-10-29 | Crossbar, Inc. | Noble metal/non-noble metal electrode for RRAM applications |
| US8884261B2 (en) | 2010-08-23 | 2014-11-11 | Crossbar, Inc. | Device switching using layered device structure |
| US9224496B2 (en) | 2010-08-11 | 2015-12-29 | Shine C. Chung | Circuit and system of aggregated area anti-fuse in CMOS processes |
| US9019742B2 (en) | 2010-08-20 | 2015-04-28 | Shine C. Chung | Multiple-state one-time programmable (OTP) memory to function as multi-time programmable (MTP) memory |
| US9711237B2 (en) | 2010-08-20 | 2017-07-18 | Attopsemi Technology Co., Ltd. | Method and structure for reliable electrical fuse programming |
| US9824768B2 (en) | 2015-03-22 | 2017-11-21 | Attopsemi Technology Co., Ltd | Integrated OTP memory for providing MTP memory |
| US10249379B2 (en) | 2010-08-20 | 2019-04-02 | Attopsemi Technology Co., Ltd | One-time programmable devices having program selector for electrical fuses with extended area |
| US10923204B2 (en) | 2010-08-20 | 2021-02-16 | Attopsemi Technology Co., Ltd | Fully testible OTP memory |
| US8854859B2 (en) | 2010-08-20 | 2014-10-07 | Shine C. Chung | Programmably reversible resistive device cells using CMOS logic processes |
| US9025357B2 (en) | 2010-08-20 | 2015-05-05 | Shine C. Chung | Programmable resistive memory unit with data and reference cells |
| US9042153B2 (en) | 2010-08-20 | 2015-05-26 | Shine C. Chung | Programmable resistive memory unit with multiple cells to improve yield and reliability |
| US9460807B2 (en) | 2010-08-20 | 2016-10-04 | Shine C. Chung | One-time programmable memory devices using FinFET technology |
| US9251893B2 (en) | 2010-08-20 | 2016-02-02 | Shine C. Chung | Multiple-bit programmable resistive memory using diode as program selector |
| US9496033B2 (en) | 2010-08-20 | 2016-11-15 | Attopsemi Technology Co., Ltd | Method and system of programmable resistive devices with read capability using a low supply voltage |
| US9431127B2 (en) | 2010-08-20 | 2016-08-30 | Shine C. Chung | Circuit and system of using junction diode as program selector for metal fuses for one-time programmable devices |
| US9236141B2 (en) | 2010-08-20 | 2016-01-12 | Shine C. Chung | Circuit and system of using junction diode of MOS as program selector for programmable resistive devices |
| US10916317B2 (en) | 2010-08-20 | 2021-02-09 | Attopsemi Technology Co., Ltd | Programmable resistance memory on thin film transistor technology |
| US10229746B2 (en) | 2010-08-20 | 2019-03-12 | Attopsemi Technology Co., Ltd | OTP memory with high data security |
| US9070437B2 (en) | 2010-08-20 | 2015-06-30 | Shine C. Chung | Circuit and system of using junction diode as program selector for one-time programmable devices with heat sink |
| US9818478B2 (en) | 2012-12-07 | 2017-11-14 | Attopsemi Technology Co., Ltd | Programmable resistive device and memory using diode as selector |
| US8841196B1 (en) | 2010-09-29 | 2014-09-23 | Crossbar, Inc. | Selective deposition of silver for non-volatile memory device fabrication |
| US8492195B2 (en) | 2010-08-23 | 2013-07-23 | Crossbar, Inc. | Method for forming stackable non-volatile resistive switching memory devices |
| US8889521B1 (en) | 2012-09-14 | 2014-11-18 | Crossbar, Inc. | Method for silver deposition for a non-volatile memory device |
| US8404553B2 (en) | 2010-08-23 | 2013-03-26 | Crossbar, Inc. | Disturb-resistant non-volatile memory device and method |
| US9401475B1 (en) | 2010-08-23 | 2016-07-26 | Crossbar, Inc. | Method for silver deposition for a non-volatile memory device |
| US8558212B2 (en) | 2010-09-29 | 2013-10-15 | Crossbar, Inc. | Conductive path in switching material in a resistive random access memory device and control |
| US8351242B2 (en) | 2010-09-29 | 2013-01-08 | Micron Technology, Inc. | Electronic devices, memory devices and memory arrays |
| US8391049B2 (en) | 2010-09-29 | 2013-03-05 | Crossbar, Inc. | Resistor structure for a non-volatile memory device and method |
| US8723154B2 (en) * | 2010-09-29 | 2014-05-13 | Crossbar, Inc. | Integration of an amorphous silicon resistive switching device |
| US8759809B2 (en) | 2010-10-21 | 2014-06-24 | Micron Technology, Inc. | Integrated circuitry comprising nonvolatile memory cells having platelike electrode and ion conductive material layer |
| US8187945B2 (en) | 2010-10-27 | 2012-05-29 | Crossbar, Inc. | Method for obtaining smooth, continuous silver film |
| US8796661B2 (en) | 2010-11-01 | 2014-08-05 | Micron Technology, Inc. | Nonvolatile memory cells and methods of forming nonvolatile memory cell |
| US8526213B2 (en) * | 2010-11-01 | 2013-09-03 | Micron Technology, Inc. | Memory cells, methods of programming memory cells, and methods of forming memory cells |
| US9076513B2 (en) | 2010-11-03 | 2015-07-07 | Shine C. Chung | Low-pin-count non-volatile memory interface with soft programming capability |
| US9019791B2 (en) | 2010-11-03 | 2015-04-28 | Shine C. Chung | Low-pin-count non-volatile memory interface for 3D IC |
| US8988965B2 (en) | 2010-11-03 | 2015-03-24 | Shine C. Chung | Low-pin-count non-volatile memory interface |
| US8258020B2 (en) | 2010-11-04 | 2012-09-04 | Crossbar Inc. | Interconnects for stacked non-volatile memory device and method |
| US8502185B2 (en) | 2011-05-31 | 2013-08-06 | Crossbar, Inc. | Switching device having a non-linear element |
| USRE46335E1 (en) | 2010-11-04 | 2017-03-07 | Crossbar, Inc. | Switching device having a non-linear element |
| US8088688B1 (en) | 2010-11-05 | 2012-01-03 | Crossbar, Inc. | p+ polysilicon material on aluminum for non-volatile memory device and method |
| US9454997B2 (en) | 2010-12-02 | 2016-09-27 | Micron Technology, Inc. | Array of nonvolatile memory cells having at least five memory cells per unit cell, having a plurality of the unit cells which individually comprise three elevational regions of programmable material, and/or having a continuous volume having a combination of a plurality of vertically oriented memory cells and a plurality of horizontally oriented memory cells; array of vertically stacked tiers of nonvolatile memory cells |
| CN102544011A (zh) | 2010-12-08 | 2012-07-04 | 庄建祥 | 反熔丝存储器及电子系统 |
| US8431458B2 (en) | 2010-12-27 | 2013-04-30 | Micron Technology, Inc. | Methods of forming a nonvolatile memory cell and methods of forming an array of nonvolatile memory cells |
| US8930174B2 (en) | 2010-12-28 | 2015-01-06 | Crossbar, Inc. | Modeling technique for resistive random access memory (RRAM) cells |
| US8791010B1 (en) | 2010-12-31 | 2014-07-29 | Crossbar, Inc. | Silver interconnects for stacked non-volatile memory device and method |
| US8815696B1 (en) | 2010-12-31 | 2014-08-26 | Crossbar, Inc. | Disturb-resistant non-volatile memory device using via-fill and etchback technique |
| US9153623B1 (en) | 2010-12-31 | 2015-10-06 | Crossbar, Inc. | Thin film transistor steering element for a non-volatile memory device |
| US8791447B2 (en) | 2011-01-20 | 2014-07-29 | Micron Technology, Inc. | Arrays of nonvolatile memory cells and methods of forming arrays of nonvolatile memory cells |
| US8848423B2 (en) | 2011-02-14 | 2014-09-30 | Shine C. Chung | Circuit and system of using FinFET for building programmable resistive devices |
| US10192615B2 (en) | 2011-02-14 | 2019-01-29 | Attopsemi Technology Co., Ltd | One-time programmable devices having a semiconductor fin structure with a divided active region |
| US10586832B2 (en) | 2011-02-14 | 2020-03-10 | Attopsemi Technology Co., Ltd | One-time programmable devices using gate-all-around structures |
| US8488365B2 (en) | 2011-02-24 | 2013-07-16 | Micron Technology, Inc. | Memory cells |
| JP5439420B2 (ja) * | 2011-03-22 | 2014-03-12 | 株式会社東芝 | 記憶装置 |
| US8537592B2 (en) | 2011-04-15 | 2013-09-17 | Micron Technology, Inc. | Arrays of nonvolatile memory cells and methods of forming arrays of nonvolatile memory cells |
| US8450710B2 (en) | 2011-05-27 | 2013-05-28 | Crossbar, Inc. | Low temperature p+ silicon junction material for a non-volatile memory device |
| US8394670B2 (en) | 2011-05-31 | 2013-03-12 | Crossbar, Inc. | Vertical diodes for non-volatile memory device |
| US9620206B2 (en) | 2011-05-31 | 2017-04-11 | Crossbar, Inc. | Memory array architecture with two-terminal memory cells |
| JP2013004143A (ja) * | 2011-06-16 | 2013-01-07 | Toshiba Corp | 不揮発性半導体記憶装置 |
| US8619459B1 (en) | 2011-06-23 | 2013-12-31 | Crossbar, Inc. | High operating speed resistive random access memory |
| US8659929B2 (en) | 2011-06-30 | 2014-02-25 | Crossbar, Inc. | Amorphous silicon RRAM with non-linear device and operation |
| US9166163B2 (en) | 2011-06-30 | 2015-10-20 | Crossbar, Inc. | Sub-oxide interface layer for two-terminal memory |
| US9564587B1 (en) | 2011-06-30 | 2017-02-07 | Crossbar, Inc. | Three-dimensional two-terminal memory with enhanced electric field and segmented interconnects |
| US9627443B2 (en) | 2011-06-30 | 2017-04-18 | Crossbar, Inc. | Three-dimensional oblique two-terminal memory with enhanced electric field |
| US8946669B1 (en) | 2012-04-05 | 2015-02-03 | Crossbar, Inc. | Resistive memory device and fabrication methods |
| CN103828047A (zh) | 2011-07-22 | 2014-05-28 | 科洛斯巴股份有限公司 | 用于非易失性存储器装置的p+硅锗材料的种子层及方法 |
| US8674724B2 (en) | 2011-07-29 | 2014-03-18 | Crossbar, Inc. | Field programmable gate array utilizing two-terminal non-volatile memory |
| US10056907B1 (en) | 2011-07-29 | 2018-08-21 | Crossbar, Inc. | Field programmable gate array utilizing two-terminal non-volatile memory |
| US9729155B2 (en) | 2011-07-29 | 2017-08-08 | Crossbar, Inc. | Field programmable gate array utilizing two-terminal non-volatile memory |
| JP5548170B2 (ja) * | 2011-08-09 | 2014-07-16 | 株式会社東芝 | 抵抗変化メモリおよびその製造方法 |
| JP5537524B2 (ja) | 2011-09-22 | 2014-07-02 | 株式会社東芝 | 抵抗変化メモリ |
| US9136261B2 (en) | 2011-11-15 | 2015-09-15 | Shine C. Chung | Structures and techniques for using mesh-structure diodes for electro-static discharge (ESD) protection |
| US9324849B2 (en) | 2011-11-15 | 2016-04-26 | Shine C. Chung | Structures and techniques for using semiconductor body to construct SCR, DIAC, or TRIAC |
| JP5798052B2 (ja) * | 2012-01-31 | 2015-10-21 | 株式会社東芝 | 記憶装置 |
| JP5634426B2 (ja) * | 2012-03-22 | 2014-12-03 | 株式会社東芝 | 記憶装置 |
| US9007804B2 (en) * | 2012-02-06 | 2015-04-14 | Shine C. Chung | Circuit and system of protective mechanisms for programmable resistive memories |
| US8975727B2 (en) | 2012-02-28 | 2015-03-10 | Intermolecular, Inc. | Memory cell having an integrated two-terminal current limiting resistor |
| US8716098B1 (en) | 2012-03-09 | 2014-05-06 | Crossbar, Inc. | Selective removal method and structure of silver in resistive switching device for a non-volatile memory device |
| US9087576B1 (en) | 2012-03-29 | 2015-07-21 | Crossbar, Inc. | Low temperature fabrication method for a three-dimensional memory device and structure |
| US8946667B1 (en) | 2012-04-13 | 2015-02-03 | Crossbar, Inc. | Barrier structure for a silver based RRAM and method |
| US9685608B2 (en) | 2012-04-13 | 2017-06-20 | Crossbar, Inc. | Reduced diffusion in metal electrode for two-terminal memory |
| US8658476B1 (en) | 2012-04-20 | 2014-02-25 | Crossbar, Inc. | Low temperature P+ polycrystalline silicon material for non-volatile memory device |
| US8796658B1 (en) | 2012-05-07 | 2014-08-05 | Crossbar, Inc. | Filamentary based non-volatile resistive memory device and method |
| US8765566B2 (en) | 2012-05-10 | 2014-07-01 | Crossbar, Inc. | Line and space architecture for a non-volatile memory device |
| US9070859B1 (en) | 2012-05-25 | 2015-06-30 | Crossbar, Inc. | Low temperature deposition method for polycrystalline silicon material for a non-volatile memory device |
| JP5783961B2 (ja) * | 2012-07-09 | 2015-09-24 | 株式会社東芝 | 不揮発性記憶装置 |
| WO2014018318A1 (en) * | 2012-07-27 | 2014-01-30 | Tactonic Technologies, Llc | Method for mechanical sensing utilizing controlled current |
| US9583701B1 (en) | 2012-08-14 | 2017-02-28 | Crossbar, Inc. | Methods for fabricating resistive memory device switching material using ion implantation |
| US10096653B2 (en) | 2012-08-14 | 2018-10-09 | Crossbar, Inc. | Monolithically integrated resistive memory using integrated-circuit foundry compatible processes |
| US20140050010A1 (en) * | 2012-08-15 | 2014-02-20 | Kabushiki Kaisha Toshiba | Semiconductor memory device and file memory system |
| US8946673B1 (en) | 2012-08-24 | 2015-02-03 | Crossbar, Inc. | Resistive switching device structure with improved data retention for non-volatile memory device and method |
| US8796102B1 (en) | 2012-08-29 | 2014-08-05 | Crossbar, Inc. | Device structure for a RRAM and method |
| US9076526B2 (en) | 2012-09-10 | 2015-07-07 | Shine C. Chung | OTP memories functioning as an MTP memory |
| US9312483B2 (en) | 2012-09-24 | 2016-04-12 | Crossbar, Inc. | Electrode structure for a non-volatile memory device and method |
| US9183897B2 (en) | 2012-09-30 | 2015-11-10 | Shine C. Chung | Circuits and methods of a self-timed high speed SRAM |
| US9576616B2 (en) | 2012-10-10 | 2017-02-21 | Crossbar, Inc. | Non-volatile memory with overwrite capability and low write amplification |
| US11068620B2 (en) | 2012-11-09 | 2021-07-20 | Crossbar, Inc. | Secure circuit integrated with memory layer |
| US8982647B2 (en) | 2012-11-14 | 2015-03-17 | Crossbar, Inc. | Resistive random access memory equalization and sensing |
| US9324447B2 (en) | 2012-11-20 | 2016-04-26 | Shine C. Chung | Circuit and system for concurrently programming multiple bits of OTP memory devices |
| US9412790B1 (en) | 2012-12-04 | 2016-08-09 | Crossbar, Inc. | Scalable RRAM device architecture for a non-volatile memory device and method |
| US8890109B2 (en) * | 2012-12-20 | 2014-11-18 | Intermolecular, Inc. | Resistive random access memory access cells having thermally isolating structures |
| US9406379B2 (en) | 2013-01-03 | 2016-08-02 | Crossbar, Inc. | Resistive random access memory with non-linear current-voltage relationship |
| US9324942B1 (en) | 2013-01-31 | 2016-04-26 | Crossbar, Inc. | Resistive memory cell with solid state diode |
| US9112145B1 (en) | 2013-01-31 | 2015-08-18 | Crossbar, Inc. | Rectified switching of two-terminal memory via real time filament formation |
| US8934280B1 (en) | 2013-02-06 | 2015-01-13 | Crossbar, Inc. | Capacitive discharge programming for two-terminal memory cells |
| US9093635B2 (en) | 2013-03-14 | 2015-07-28 | Crossbar, Inc. | Controlling on-state current for two-terminal memory |
| US8860182B1 (en) | 2013-03-22 | 2014-10-14 | Kabushiki Kaisha Toshiba | Resistance random access memory device |
| US9099645B2 (en) | 2013-03-22 | 2015-08-04 | Kabushiki Kaisha Toshiba | Resistance random access memory device |
| US20150129829A1 (en) * | 2013-11-13 | 2015-05-14 | Crossbar, Inc. | One time programmable and multi-level, two-terminal memory cell |
| US10290801B2 (en) | 2014-02-07 | 2019-05-14 | Crossbar, Inc. | Scalable silicon based resistive memory device |
| CN103996790B (zh) * | 2014-05-28 | 2016-10-05 | 河北大学 | 一种纳米级三态阻变存储器及其制备方法 |
| US9412473B2 (en) | 2014-06-16 | 2016-08-09 | Shine C. Chung | System and method of a novel redundancy scheme for OTP |
| KR102140787B1 (ko) * | 2014-07-07 | 2020-08-03 | 삼성전자주식회사 | 저항성 메모리 장치, 저항성 메모리 시스템 및 저항성 메모리 장치의 동작방법 |
| CN104916380A (zh) * | 2015-05-11 | 2015-09-16 | 岳文智 | 一种低压可变电阻器 |
| CN105372849B (zh) * | 2015-11-27 | 2018-08-24 | 电子科技大学 | 一种基于非晶硅忆阻效应的硅基波导光开关及其制造方法 |
| US10535413B2 (en) | 2017-04-14 | 2020-01-14 | Attopsemi Technology Co., Ltd | Low power read operation for programmable resistive memories |
| US11062786B2 (en) | 2017-04-14 | 2021-07-13 | Attopsemi Technology Co., Ltd | One-time programmable memories with low power read operation and novel sensing scheme |
| US10726914B2 (en) | 2017-04-14 | 2020-07-28 | Attopsemi Technology Co. Ltd | Programmable resistive memories with low power read operation and novel sensing scheme |
| US11615859B2 (en) | 2017-04-14 | 2023-03-28 | Attopsemi Technology Co., Ltd | One-time programmable memories with ultra-low power read operation and novel sensing scheme |
| US10770160B2 (en) | 2017-11-30 | 2020-09-08 | Attopsemi Technology Co., Ltd | Programmable resistive memory formed by bit slices from a standard cell library |
| US10957410B1 (en) * | 2018-03-02 | 2021-03-23 | Crossbar, Inc. | Methods and apparatus for facilitated program and erase of two-terminal memory devices |
| US12483429B2 (en) | 2021-06-01 | 2025-11-25 | Attopsemi Technology Co., Ltd | Physically unclonable function produced using OTP memory |
| CN119894037B (zh) * | 2025-03-27 | 2025-07-08 | 中国科学技术大学 | 一种二维材料多端口可重构器件结构及其制备方法 |
Family Cites Families (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3740620A (en) * | 1971-06-22 | 1973-06-19 | Ibm | Storage system having heterojunction-homojunction devices |
| JPS5890790A (ja) * | 1981-08-07 | 1983-05-30 | ザ ブリテイッシュ ペトロレアム カンパニ− ピ−.エル.シ− | 半導体装置 |
| US4569121A (en) * | 1983-03-07 | 1986-02-11 | Signetics Corporation | Method of fabricating a programmable read-only memory cell incorporating an antifuse utilizing deposition of amorphous semiconductor layer |
| US6420725B1 (en) * | 1995-06-07 | 2002-07-16 | Micron Technology, Inc. | Method and apparatus for forming an integrated circuit electrode having a reduced contact area |
| US7067850B2 (en) * | 2001-10-16 | 2006-06-27 | Midwest Research Institute | Stacked switchable element and diode combination |
| US8203154B2 (en) * | 2001-10-16 | 2012-06-19 | Alliance For Sustainable Energy, Llc | Stacked switchable element and diode combination with a low breakdown switchable element |
| JP2005506703A (ja) * | 2001-10-16 | 2005-03-03 | ミッドウエスト リサーチ インスティチュート | 積層されたスイッチ可能素子およびダイオードの組み合わせ |
| US6967350B2 (en) * | 2002-04-02 | 2005-11-22 | Hewlett-Packard Development Company, L.P. | Memory structures |
| US20040026682A1 (en) * | 2002-06-17 | 2004-02-12 | Hai Jiang | Nano-dot memory and fabricating same |
| US7176064B2 (en) * | 2003-12-03 | 2007-02-13 | Sandisk 3D Llc | Memory cell comprising a semiconductor junction diode crystallized adjacent to a silicide |
| US6946719B2 (en) * | 2003-12-03 | 2005-09-20 | Matrix Semiconductor, Inc | Semiconductor device including junction diode contacting contact-antifuse unit comprising silicide |
| US8637366B2 (en) * | 2002-12-19 | 2014-01-28 | Sandisk 3D Llc | Nonvolatile memory cell without a dielectric antifuse having high- and low-impedance states |
| US7084691B2 (en) * | 2004-07-21 | 2006-08-01 | Sharp Laboratories Of America, Inc. | Mono-polarity switchable PCMO resistor trimmer |
| KR100682926B1 (ko) * | 2005-01-31 | 2007-02-15 | 삼성전자주식회사 | 저항체를 이용한 비휘발성 메모리 소자 및 그 제조방법 |
| KR100630437B1 (ko) * | 2005-08-31 | 2006-10-02 | 삼성전자주식회사 | 비휘발성 유기물 저항 메모리 장치 및 그 제조 방법 |
| KR100684908B1 (ko) * | 2006-01-09 | 2007-02-22 | 삼성전자주식회사 | 다수 저항 상태를 갖는 저항 메모리 요소, 저항 메모리 셀및 그 동작 방법 그리고 상기 저항 메모리 요소를 적용한데이터 처리 시스템 |
| JP4203506B2 (ja) * | 2006-01-13 | 2009-01-07 | シャープ株式会社 | 不揮発性半導体記憶装置及びその書き換え方法 |
| JP2007281208A (ja) * | 2006-04-07 | 2007-10-25 | Matsushita Electric Ind Co Ltd | 多層抵抗変化素子アレイ、抵抗変化装置、多層不揮発性記憶素子アレイ、及び不揮発性記憶装置 |
| JP4297136B2 (ja) * | 2006-06-07 | 2009-07-15 | ソニー株式会社 | 記憶装置 |
| US10134985B2 (en) | 2006-10-20 | 2018-11-20 | The Regents Of The University Of Michigan | Non-volatile solid state resistive switching devices |
| US7872900B2 (en) | 2006-11-08 | 2011-01-18 | Symetrix Corporation | Correlated electron memory |
| EP2082426B1 (en) * | 2006-11-08 | 2012-12-26 | Symetrix Corporation | Correlated electron memory |
| WO2008060543A2 (en) * | 2006-11-15 | 2008-05-22 | Sandisk 3D Llc | P-i-n diode crystallized adjacent to a silicide in series with a dielectric antifuse and methods of forming the same |
| KR100898897B1 (ko) * | 2007-02-16 | 2009-05-27 | 삼성전자주식회사 | 비휘발성 메모리 소자 및 그 형성방법 |
| WO2010048127A2 (en) | 2008-10-20 | 2010-04-29 | The Regents Of The University Of Michigan | A silicon based nanoscale crossbar memory |
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- 2009-10-08 EP EP09819890.6A patent/EP2342750B1/en not_active Not-in-force
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| WO2010042732A2 (en) | 2010-04-15 |
| US8687402B2 (en) | 2014-04-01 |
| EP2342750A2 (en) | 2011-07-13 |
| CN102177584A (zh) | 2011-09-07 |
| US20100085798A1 (en) | 2010-04-08 |
| US20140153317A1 (en) | 2014-06-05 |
| KR20110080153A (ko) | 2011-07-12 |
| JP2012505551A (ja) | 2012-03-01 |
| EP2342750A4 (en) | 2012-05-09 |
| WO2010042732A3 (en) | 2010-07-08 |
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