JP5696135B2 - ウエハーハンドリングシステムおよびその方法 - Google Patents

ウエハーハンドリングシステムおよびその方法 Download PDF

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Publication number
JP5696135B2
JP5696135B2 JP2012502404A JP2012502404A JP5696135B2 JP 5696135 B2 JP5696135 B2 JP 5696135B2 JP 2012502404 A JP2012502404 A JP 2012502404A JP 2012502404 A JP2012502404 A JP 2012502404A JP 5696135 B2 JP5696135 B2 JP 5696135B2
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JP
Japan
Prior art keywords
wafer
station
wafers
slot
carrier
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Expired - Fee Related
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JP2012502404A
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English (en)
Japanese (ja)
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JP2012522385A (ja
JP2012522385A5 (enExample
Inventor
リボリエール，フレデリック
チャブ，ライアン
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ATS Corp
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ATS Automation Tooling Systems Inc
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Publication of JP2012522385A publication Critical patent/JP2012522385A/ja
Publication of JP2012522385A5 publication Critical patent/JP2012522385A5/ja
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Publication of JP5696135B2 publication Critical patent/JP5696135B2/ja
Expired - Fee Related legal-status Critical Current
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781—Batch transfer of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67383—Closed carriers characterised by substrate supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2012502404A 2009-03-30 2010-03-30 ウエハーハンドリングシステムおよびその方法 Expired - Fee Related JP5696135B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US16463909P 2009-03-30 2009-03-30
US61/164,639 2009-03-30
PCT/CA2010/000487 WO2010111781A1 (en) 2009-03-30 2010-03-30 Systems and methods for handling wafers

Publications (3)

Publication Number Publication Date
JP2012522385A JP2012522385A (ja) 2012-09-20
JP2012522385A5 JP2012522385A5 (enExample) 2013-05-23
JP5696135B2 true JP5696135B2 (ja) 2015-04-08

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012502404A Expired - Fee Related JP5696135B2 (ja) 2009-03-30 2010-03-30 ウエハーハンドリングシステムおよびその方法

Country Status (9)

Country Link
US (1) US9184079B2 (enExample)
EP (1) EP2415074B1 (enExample)
JP (1) JP5696135B2 (enExample)
KR (1) KR101695434B1 (enExample)
CN (1) CN102369595B (enExample)
CA (1) CA2756831C (enExample)
MY (1) MY161955A (enExample)
TW (1) TW201044487A (enExample)
WO (1) WO2010111781A1 (enExample)

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US8571396B2 (en) * 2006-06-26 2013-10-29 Tp Solar, Inc. Rapid thermal firing IR conveyor furnace having high intensity heating section
US9301340B2 (en) 2006-06-26 2016-03-29 Tp Solar, Inc. IR conveyor furnace having single belt with multiple independently controlled processing lanes
US8828776B2 (en) 2009-04-16 2014-09-09 Tp Solar, Inc. Diffusion furnaces employing ultra low mass transport systems and methods of wafer rapid diffusion processing
WO2010121190A1 (en) * 2009-04-16 2010-10-21 Tp Solar, Inc. A Corporation Of Ca Diffusion furnaces employing ultra low mass transport systems and methods of wafer rapid diffusion processing
US20120181265A1 (en) * 2010-07-15 2012-07-19 Despatch Industries Limited Partnership Firing furnace configuration for thermal processing system
US8829396B2 (en) 2010-11-30 2014-09-09 Tp Solar, Inc. Finger drives for IR wafer processing equipment conveyors and lateral differential temperature profile methods
CN103250230B (zh) 2010-12-13 2016-08-31 Tp太阳能公司 掺杂剂涂布系统以及涂布蒸气化掺杂化合物于光伏太阳能晶圆的方法
US8816253B2 (en) 2011-01-21 2014-08-26 Tp Solar, Inc. Dual independent transport systems for IR conveyor furnaces and methods of firing thin work pieces
BE1019301A5 (nl) * 2011-08-31 2012-05-08 Develop Mechanics Nv Inrichting voor het hanteren van halfgeleiderwafers.
CN103187347B (zh) * 2011-12-29 2016-10-05 中建材浚鑫科技股份有限公司 一种卸载电池硅片的方法
US10755960B2 (en) * 2014-11-04 2020-08-25 Brooks Automation, Inc. Wafer aligner
CN104409403A (zh) * 2014-11-05 2015-03-11 江阴方艾机器人有限公司 光伏扩散工序中石英舟装载硅片工艺
DE102014224588B4 (de) * 2014-12-02 2019-08-01 Heraeus Deutschland GmbH & Co. KG Verfahren zum Herstellen eines plattenförmigen metallisierten Keramik-Substrats, Träger zum Herstellen des Substrats und Verwendung des Trägers
JP6688714B2 (ja) * 2016-09-29 2020-04-28 株式会社Ｓｃｒｅｅｎホールディングス 基板配列装置および基板配列方法
JP6811951B2 (ja) * 2017-02-03 2021-01-13 株式会社ディスコ 搬送機構
US10510573B2 (en) * 2017-11-14 2019-12-17 Taiwan Semiconductor Manufacturing Co., Ltd. Loading apparatus and operating method thereof
CN108382782B (zh) * 2018-01-09 2021-02-12 惠科股份有限公司 一种基板的仓储方法和仓储系统
TWI707753B (zh) * 2020-05-07 2020-10-21 鈦昇科技股份有限公司 自動化手臂更換機構
US20230012325A1 (en) * 2021-07-09 2023-01-12 Taiwan Semiconductor Manufacturing Company, Ltd. Robot magazine and tray load and unload system

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Also Published As

Publication number Publication date
CA2756831A1 (en) 2010-10-07
EP2415074A4 (en) 2012-02-22
CN102369595A (zh) 2012-03-07
CN102369595B (zh) 2016-03-23
TW201044487A (en) 2010-12-16
EP2415074A1 (en) 2012-02-08
KR20120024568A (ko) 2012-03-14
MY161955A (en) 2017-05-15
KR101695434B1 (ko) 2017-01-23
CA2756831C (en) 2017-12-05
US9184079B2 (en) 2015-11-10
EP2415074B1 (en) 2018-10-24
JP2012522385A (ja) 2012-09-20
WO2010111781A1 (en) 2010-10-07
US20100272544A1 (en) 2010-10-28

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