JP5696135B2 - ウエハーハンドリングシステムおよびその方法 - Google Patents
ウエハーハンドリングシステムおよびその方法 Download PDFInfo
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- JP5696135B2 JP5696135B2 JP2012502404A JP2012502404A JP5696135B2 JP 5696135 B2 JP5696135 B2 JP 5696135B2 JP 2012502404 A JP2012502404 A JP 2012502404A JP 2012502404 A JP2012502404 A JP 2012502404A JP 5696135 B2 JP5696135 B2 JP 5696135B2
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- 238000000034 method Methods 0.000 title claims description 26
- 235000012431 wafers Nutrition 0.000 claims description 311
- 238000012545 processing Methods 0.000 claims description 28
- 238000012546 transfer Methods 0.000 claims description 20
- 230000005484 gravity Effects 0.000 claims description 19
- 241000405965 Scomberomorus brasiliensis Species 0.000 claims 1
- 239000012636 effector Substances 0.000 description 40
- 238000009792 diffusion process Methods 0.000 description 16
- 238000004519 manufacturing process Methods 0.000 description 10
- 238000010586 diagram Methods 0.000 description 8
- 238000012423 maintenance Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 230000032258 transport Effects 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000036316 preload Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000007723 transport mechanism Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67383—Closed carriers characterised by substrate supports
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
[0001]本出願は、2009年3月30日に出願された米国仮特許出願第61/164,639号からの優先権を主張する。
Claims (10)
- ほぼ平坦な上面とほぼ平坦な下面とを有する複数のウエハーをハンドリングするためのシステムであって、
少なくとも1つのアンロードステーションと、
フロントローディングエンドおよびバックストップエンドを有する少なくとも1つの中間ステーションであって、前記ウエハーの平面が水平面に対して所定の角度で配置された状態で前記ウエハーを保持するように構成され、前記角度が、前記フロントローディングエンドから前記バックストップエンドに向かって下方に30〜60度である、少なくとも1つの中間ステーションと、
前記アンロードステーションと前記中間ステーションとの間で前記ウエハーを運搬するように構成された移送装置と、を備え、
前記少なくとも1つの中間ステーションは少なくとも1つのスロットを有し、前記少なくとも1つのスロットは、前記複数のウエハーのうちの第1のウエハーと、前記複数のウエハーのうちの背合わせ配置の第2のウエハーとを受け取るように構成されており、前記第1のウエハーは前記少なくとも1つのスロット内に挿入され、前記第2のウエハーは、前記第1および第2のウエハーの隣接する表面が接触した状態で前記第1のウエハーに隣接して前記少なくとも1つのスロット内に挿入される、システム。 - 前記移送装置は真空グリッパと重力グリッパとを備える、請求項1に記載のシステム。
- 前記少なくとも1つの中間ステーションは、それぞれがウエハーを支持するように構成されたリアストップを前記バックストップエンドに有する複数のスロットを備える、請求項1または2に記載のシステム。
- 前記角度は45度である、請求項1〜3のいずれか1項に記載のシステム。
- 前記第2のウエハーは、前記第1および第2のウエハーのそれぞれの上面が接触した状態でまたはそれぞれの下面が接触した状態で、前記第1のウエハーの上の前記少なくとも1つの中間ステーションの前記少なくとも1つのスロット内に挿入される、請求項1に記載のシステム。
- 前記少なくとも1つの中間ステーションは、前記背合わせ配置の前記第2のウエハーを持ち上げるように設計された真空素子を含む、請求項5に記載のシステム。
- 前記移送装置は、前記少なくとも1つの中間ステーションから前記背合わせ配置のウエハーを取り出し、処理用キャリヤ内にロードするための端部保持装置内に前記ウエハーを置くように構成される、請求項5または6に記載のシステム。
- 前記複数のウエハーがロードされた処理用キャリヤを受け取るように構成された処理ステーションをさらに含むシステムであって、前記キャリヤは処理のために炉に移動させられる、請求項1〜7のいずれか1項に記載のシステム。
- アンロードステーションからウエハーをアンロードする工程と、
前記アンロードステーションから中間ステーションに前記ウエハーを移送する工程と、
前記中間ステーションから処理ステーションに前記ウエハーを移送する工程と、
前記ウエハーを処理する工程と、
前記処理ステーションから前記ウエハーをアンロードする工程と、
前記ウエハーをキャリヤ内に再ロードする工程と、を含むウエハーハンドリング方法であって、
前記ウエハーは移送装置によりアンロードされ、移送され、再ロードされ、
前記中間ステーションは、フロントローディングエンドおよびバックストップエンドを有しており、前記中間ステーションは、前記ウエハーの平面が水平面に対して所定の角度で配置された状態で前記ウエハーを保持するように構成され、前記角度が、前記フロントローディングエンドから前記バックストップエンドに向かって下方に30〜60度であり、
前記中間ステーションは少なくとも1つのスロットを有し、前記少なくとも1つのスロットは、前記ウエハーのうちの第1のウエハーと、前記ウエハーのうちの背合わせ配置の第2のウエハーとを受け取るように構成されており、前記第1のウエハーは前記少なくとも1つのスロット内に挿入され、前記第2のウエハーは、前記第1および第2のウエハーの隣接する表面が接触した状態で前記第1のウエハーに隣接して前記少なくとも1つのスロット内に挿入される、ウエハーハンドリング方法。 - 前記第1のウエハーはその上面が上方に向けられた状態で整合される工程をさらに含む、請求項9に記載のウエハーハンドリング方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US16463909P | 2009-03-30 | 2009-03-30 | |
US61/164,639 | 2009-03-30 | ||
PCT/CA2010/000487 WO2010111781A1 (en) | 2009-03-30 | 2010-03-30 | Systems and methods for handling wafers |
Publications (3)
Publication Number | Publication Date |
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JP2012522385A JP2012522385A (ja) | 2012-09-20 |
JP2012522385A5 JP2012522385A5 (ja) | 2013-05-23 |
JP5696135B2 true JP5696135B2 (ja) | 2015-04-08 |
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Application Number | Title | Priority Date | Filing Date |
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JP2012502404A Expired - Fee Related JP5696135B2 (ja) | 2009-03-30 | 2010-03-30 | ウエハーハンドリングシステムおよびその方法 |
Country Status (9)
Country | Link |
---|---|
US (1) | US9184079B2 (ja) |
EP (1) | EP2415074B1 (ja) |
JP (1) | JP5696135B2 (ja) |
KR (1) | KR101695434B1 (ja) |
CN (1) | CN102369595B (ja) |
CA (1) | CA2756831C (ja) |
MY (1) | MY161955A (ja) |
TW (1) | TW201044487A (ja) |
WO (1) | WO2010111781A1 (ja) |
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2010
- 2010-03-30 CA CA2756831A patent/CA2756831C/en active Active
- 2010-03-30 TW TW099109588A patent/TW201044487A/zh unknown
- 2010-03-30 US US12/750,095 patent/US9184079B2/en active Active
- 2010-03-30 JP JP2012502404A patent/JP5696135B2/ja not_active Expired - Fee Related
- 2010-03-30 KR KR1020117025756A patent/KR101695434B1/ko active IP Right Grant
- 2010-03-30 MY MYPI2011004600A patent/MY161955A/en unknown
- 2010-03-30 CN CN201080014631.9A patent/CN102369595B/zh active Active
- 2010-03-30 WO PCT/CA2010/000487 patent/WO2010111781A1/en active Application Filing
- 2010-03-30 EP EP10757971.6A patent/EP2415074B1/en active Active
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TW201044487A (en) | 2010-12-16 |
CA2756831A1 (en) | 2010-10-07 |
US9184079B2 (en) | 2015-11-10 |
KR20120024568A (ko) | 2012-03-14 |
CN102369595A (zh) | 2012-03-07 |
CA2756831C (en) | 2017-12-05 |
JP2012522385A (ja) | 2012-09-20 |
US20100272544A1 (en) | 2010-10-28 |
CN102369595B (zh) | 2016-03-23 |
EP2415074A4 (en) | 2012-02-22 |
KR101695434B1 (ko) | 2017-01-23 |
WO2010111781A1 (en) | 2010-10-07 |
EP2415074A1 (en) | 2012-02-08 |
MY161955A (en) | 2017-05-15 |
EP2415074B1 (en) | 2018-10-24 |
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