JP2012522385A5 - - Google Patents

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Publication number
JP2012522385A5
JP2012522385A5 JP2012502404A JP2012502404A JP2012522385A5 JP 2012522385 A5 JP2012522385 A5 JP 2012522385A5 JP 2012502404 A JP2012502404 A JP 2012502404A JP 2012502404 A JP2012502404 A JP 2012502404A JP 2012522385 A5 JP2012522385 A5 JP 2012522385A5
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JP
Japan
Prior art keywords
ridges
wafer
disposed
gravity gripper
gripper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2012502404A
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English (en)
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JP5696135B2 (ja
JP2012522385A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/CA2010/000487 external-priority patent/WO2010111781A1/en
Publication of JP2012522385A publication Critical patent/JP2012522385A/ja
Publication of JP2012522385A5 publication Critical patent/JP2012522385A5/ja
Application granted granted Critical
Publication of JP5696135B2 publication Critical patent/JP5696135B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Claims (1)

  1. 前記重力グリッパは２つの隆起部を有し、前記２つの隆起部は、前記ウエハーの角が前記２つの隆起部の間にはまった状態で前記ウエハーが配置されるように、前記重力グリッパの両側に配置され、かつ遠端部に対し一定の角度に向けられる、請求項１４に記載の装置。
JP2012502404A 2009-03-30 2010-03-30 ウエハーハンドリングシステムおよびその方法 Expired - Fee Related JP5696135B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US16463909P 2009-03-30 2009-03-30
US61/164,639 2009-03-30
PCT/CA2010/000487 WO2010111781A1 (en) 2009-03-30 2010-03-30 Systems and methods for handling wafers

Publications (3)

Publication Number Publication Date
JP2012522385A JP2012522385A (ja) 2012-09-20
JP2012522385A5 true JP2012522385A5 (ja) 2013-05-23
JP5696135B2 JP5696135B2 (ja) 2015-04-08

Family

ID=42827441

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012502404A Expired - Fee Related JP5696135B2 (ja) 2009-03-30 2010-03-30 ウエハーハンドリングシステムおよびその方法

Country Status (9)

Country Link
US (1) US9184079B2 (ja)
EP (1) EP2415074B1 (ja)
JP (1) JP5696135B2 (ja)
KR (1) KR101695434B1 (ja)
CN (1) CN102369595B (ja)
CA (1) CA2756831C (ja)
MY (1) MY161955A (ja)
TW (1) TW201044487A (ja)
WO (1) WO2010111781A1 (ja)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8571396B2 (en) * 2006-06-26 2013-10-29 Tp Solar, Inc. Rapid thermal firing IR conveyor furnace having high intensity heating section
US9301340B2 (en) 2006-06-26 2016-03-29 Tp Solar, Inc. IR conveyor furnace having single belt with multiple independently controlled processing lanes
CN102356458B (zh) 2009-04-16 2014-10-15 Tp太阳能公司 利用极低质量运送系统的扩散炉及晶圆快速扩散加工处理的方法
US8828776B2 (en) 2009-04-16 2014-09-09 Tp Solar, Inc. Diffusion furnaces employing ultra low mass transport systems and methods of wafer rapid diffusion processing
WO2012009636A1 (en) * 2010-07-15 2012-01-19 Despatch Industries Limited Partnership Firing furnace configuration for thermal processing system
US8829396B2 (en) 2010-11-30 2014-09-09 Tp Solar, Inc. Finger drives for IR wafer processing equipment conveyors and lateral differential temperature profile methods
CN103250230B (zh) 2010-12-13 2016-08-31 Tp太阳能公司 掺杂剂涂布系统以及涂布蒸气化掺杂化合物于光伏太阳能晶圆的方法
US8816253B2 (en) 2011-01-21 2014-08-26 Tp Solar, Inc. Dual independent transport systems for IR conveyor furnaces and methods of firing thin work pieces
BE1019301A5 (nl) * 2011-08-31 2012-05-08 Develop Mechanics Nv Inrichting voor het hanteren van halfgeleiderwafers.
CN103187347B (zh) * 2011-12-29 2016-10-05 中建材浚鑫科技股份有限公司 一种卸载电池硅片的方法
US10755960B2 (en) 2014-11-04 2020-08-25 Brooks Automation, Inc. Wafer aligner
CN104409403A (zh) * 2014-11-05 2015-03-11 江阴方艾机器人有限公司 光伏扩散工序中石英舟装载硅片工艺
DE102014224588B4 (de) * 2014-12-02 2019-08-01 Heraeus Deutschland GmbH & Co. KG Verfahren zum Herstellen eines plattenförmigen metallisierten Keramik-Substrats, Träger zum Herstellen des Substrats und Verwendung des Trägers
JP6688714B2 (ja) * 2016-09-29 2020-04-28 株式会社Ｓｃｒｅｅｎホールディングス 基板配列装置および基板配列方法
JP6811951B2 (ja) * 2017-02-03 2021-01-13 株式会社ディスコ 搬送機構
US10510573B2 (en) * 2017-11-14 2019-12-17 Taiwan Semiconductor Manufacturing Co., Ltd. Loading apparatus and operating method thereof
CN108382782B (zh) * 2018-01-09 2021-02-12 惠科股份有限公司 一种基板的仓储方法和仓储系统
TWI707753B (zh) * 2020-05-07 2020-10-21 鈦昇科技股份有限公司 自動化手臂更換機構
US20230012325A1 (en) 2021-07-09 2023-01-12 Taiwan Semiconductor Manufacturing Company, Ltd. Robot magazine and tray load and unload system

Family Cites Families (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4609103A (en) * 1984-08-27 1986-09-02 Texas Instruments Incorporated Semiconductor slice cassette carrier
DE3681799D1 (de) 1985-01-22 1991-11-14 Applied Materials Inc Halbleiter-bearbeitungseinrichtung.
US4856957A (en) * 1988-01-11 1989-08-15 Mactronix, Inc. Semiconductor wafer transfer apparatus with back-to-back positioning and separation
JPH0831510B2 (ja) 1988-03-09 1996-03-27 東京エレクトロン東北株式会社 ウエハ移送方法
US4840530A (en) * 1988-05-23 1989-06-20 Nguyen Loc H Transfer apparatus for semiconductor wafers
FR2656599B1 (fr) * 1989-12-29 1992-03-27 Commissariat Energie Atomique Dispositif de rangement d'objets plats dans une cassette avec rayonnages intermediaires.
US5154730A (en) * 1991-05-17 1992-10-13 Materials Research Corporation Semiconductor wafer processing module having an inclined rotating wafer handling turret and a method of using the module
JPH05226458A (ja) * 1992-02-13 1993-09-03 Akuro Tec:Kk シリコンウェハーの移し替え方法
US5636960A (en) * 1992-07-29 1997-06-10 Tokyo Electron Limited Apparatus for detecting and aligning a substrate
US5697748A (en) * 1993-07-15 1997-12-16 Applied Materials, Inc. Wafer tray and ceramic blade for semiconductor processing apparatus
US6833035B1 (en) * 1994-04-28 2004-12-21 Semitool, Inc. Semiconductor processing system with wafer container docking and loading station
TW319751B (ja) * 1995-05-18 1997-11-11 Toshiba Co Ltd
JPH09107013A (ja) * 1995-10-09 1997-04-22 Dainippon Screen Mfg Co Ltd 基板受け渡し装置
US5738574A (en) * 1995-10-27 1998-04-14 Applied Materials, Inc. Continuous processing system for chemical mechanical polishing
US6286688B1 (en) * 1996-04-03 2001-09-11 Scp Global Technologies, Inc. Compliant silicon wafer handling system
JP3223847B2 (ja) * 1996-06-28 2001-10-29 住友金属工業株式会社 シリコン単結晶ウェーハの熱処理方法と製造方法
CH697146A5 (de) * 1996-10-09 2008-05-15 Tec Sem Ag Greifvorrichtung zur Handhabung von Wafern.
JP3880131B2 (ja) * 1997-05-07 2007-02-14 信越ポリマー株式会社 基板収納容器
US5988971A (en) * 1997-07-09 1999-11-23 Ade Optical Systems Corporation Wafer transfer robot
US6183186B1 (en) * 1997-08-29 2001-02-06 Daitron, Inc. Wafer handling system and method
JP3510463B2 (ja) * 1997-11-10 2004-03-29 東京エレクトロン株式会社 基板の整列装置及び整列方法
US6368040B1 (en) * 1998-02-18 2002-04-09 Tokyo Electron Limited Apparatus for and method of transporting substrates to be processed
US6202482B1 (en) 1998-03-23 2001-03-20 Lehighton Electronics, Inc. Method and apparatus for testing of sheet material
US6053694A (en) * 1998-06-26 2000-04-25 H-Square Corporation Rotatable wafer handler with retractable stops
US6393337B1 (en) * 2000-01-13 2002-05-21 Applied Materials, Inc. Method and apparatus for orienting substrates
JP3912478B2 (ja) 2000-08-31 2007-05-09 ダイキン工業株式会社 基板搬送装置
JP4856308B2 (ja) * 2000-12-27 2012-01-18 キヤノンアネルバ株式会社 基板処理装置及び経由チャンバー
JP2003092330A (ja) 2001-09-18 2003-03-28 Tokyo Electron Ltd 熱処理装置および熱処理方法
KR20050044434A (ko) * 2001-11-13 2005-05-12 에프 에스 아이 인터내셔날,인코포레이티드 초소형전자 기판을 처리하는 감소의 풋프린트 공구
US7367773B2 (en) * 2002-05-09 2008-05-06 Maxtor Corporation Apparatus for combining or separating disk pairs simultaneously
US7600359B2 (en) * 2002-05-09 2009-10-13 Seagate Technology Llc Method of merging two disks concentrically without gap between disks
US7083376B2 (en) * 2002-10-10 2006-08-01 Maxtor Corporation Automated merge nest for pairs of magnetic storage disks
JP2005123642A (ja) 2004-12-06 2005-05-12 Dainippon Screen Mfg Co Ltd 搬送機構および搬送方法
JP4791379B2 (ja) 2004-12-28 2011-10-12 東京エレクトロン株式会社 基板処理装置、基板搬送方法、制御プログラムおよびコンピュータ読取可能な記憶媒体
JP4688637B2 (ja) * 2005-10-28 2011-05-25 東京エレクトロン株式会社 基板処理装置及びバッチ編成装置並びにバッチ編成方法及びバッチ編成プログラム
JP4999414B2 (ja) * 2006-09-27 2012-08-15 信越ポリマー株式会社 基板の取り扱い装置及び基板の取り扱い方法
JP2008124091A (ja) 2006-11-09 2008-05-29 Fuji Electric Device Technology Co Ltd 半導体装置の処理装置および処理方法
PT1925577E (pt) 2006-11-24 2009-10-12 Jonas & Redmann Automationstec Processo para a formação de um conjunto de wafers costas com costas, a posicionar numa nacela, e sistema de manuseamento para a formação do conjunto de wafers costas com costas
JP4828503B2 (ja) * 2007-10-16 2011-11-30 東京エレクトロン株式会社 基板処理装置、基板搬送方法、コンピュータプログラムおよび記憶媒体

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