KR101695434B1 - 웨이퍼를 다루기 위한 시스템 및 방법 - Google Patents

웨이퍼를 다루기 위한 시스템 및 방법 Download PDF

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Publication number
KR101695434B1
KR101695434B1 KR1020117025756A KR20117025756A KR101695434B1 KR 101695434 B1 KR101695434 B1 KR 101695434B1 KR 1020117025756 A KR1020117025756 A KR 1020117025756A KR 20117025756 A KR20117025756 A KR 20117025756A KR 101695434 B1 KR101695434 B1 KR 101695434B1
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South Korea
Prior art keywords
wafers
wafer
station
intermediate station
carrier
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Expired - Fee Related
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KR1020117025756A
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English (en)
Korean (ko)
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KR20120024568A (ko
Inventor
프레데릭 리볼리에
라이언 첩
Original Assignee
에이티에스 오토메이션 툴링 시스템즈 인코포레이티드
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Publication of KR20120024568A publication Critical patent/KR20120024568A/ko
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H10P72/3412—Batch transfer of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1921—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by substrate supports
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7621—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting two or more semiconductor substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
KR1020117025756A 2009-03-30 2010-03-30 웨이퍼를 다루기 위한 시스템 및 방법 Expired - Fee Related KR101695434B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US16463909P 2009-03-30 2009-03-30
US61/164,639 2009-03-30
PCT/CA2010/000487 WO2010111781A1 (en) 2009-03-30 2010-03-30 Systems and methods for handling wafers

Publications (2)

Publication Number Publication Date
KR20120024568A KR20120024568A (ko) 2012-03-14
KR101695434B1 true KR101695434B1 (ko) 2017-01-23

Family

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Application Number Title Priority Date Filing Date
KR1020117025756A Expired - Fee Related KR101695434B1 (ko) 2009-03-30 2010-03-30 웨이퍼를 다루기 위한 시스템 및 방법

Country Status (9)

Country Link
US (1) US9184079B2 (enExample)
EP (1) EP2415074B1 (enExample)
JP (1) JP5696135B2 (enExample)
KR (1) KR101695434B1 (enExample)
CN (1) CN102369595B (enExample)
CA (1) CA2756831C (enExample)
MY (1) MY161955A (enExample)
TW (1) TW201044487A (enExample)
WO (1) WO2010111781A1 (enExample)

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US8571396B2 (en) * 2006-06-26 2013-10-29 Tp Solar, Inc. Rapid thermal firing IR conveyor furnace having high intensity heating section
US9301340B2 (en) 2006-06-26 2016-03-29 Tp Solar, Inc. IR conveyor furnace having single belt with multiple independently controlled processing lanes
US8039289B2 (en) * 2009-04-16 2011-10-18 Tp Solar, Inc. Diffusion furnaces employing ultra low mass transport systems and methods of wafer rapid diffusion processing
US8828776B2 (en) 2009-04-16 2014-09-09 Tp Solar, Inc. Diffusion furnaces employing ultra low mass transport systems and methods of wafer rapid diffusion processing
WO2012009636A1 (en) * 2010-07-15 2012-01-19 Despatch Industries Limited Partnership Firing furnace configuration for thermal processing system
US8829396B2 (en) 2010-11-30 2014-09-09 Tp Solar, Inc. Finger drives for IR wafer processing equipment conveyors and lateral differential temperature profile methods
US8742532B2 (en) 2010-12-13 2014-06-03 Tp Solar, Inc. Dopant applicator system and method of applying vaporized doping compositions to PV solar wafers
US8816253B2 (en) 2011-01-21 2014-08-26 Tp Solar, Inc. Dual independent transport systems for IR conveyor furnaces and methods of firing thin work pieces
BE1019301A5 (nl) * 2011-08-31 2012-05-08 Develop Mechanics Nv Inrichting voor het hanteren van halfgeleiderwafers.
CN103187347B (zh) * 2011-12-29 2016-10-05 中建材浚鑫科技股份有限公司 一种卸载电池硅片的方法
US10755960B2 (en) * 2014-11-04 2020-08-25 Brooks Automation, Inc. Wafer aligner
CN104409403A (zh) * 2014-11-05 2015-03-11 江阴方艾机器人有限公司 光伏扩散工序中石英舟装载硅片工艺
DE102014224588B4 (de) * 2014-12-02 2019-08-01 Heraeus Deutschland GmbH & Co. KG Verfahren zum Herstellen eines plattenförmigen metallisierten Keramik-Substrats, Träger zum Herstellen des Substrats und Verwendung des Trägers
JP6688714B2 (ja) * 2016-09-29 2020-04-28 株式会社Ｓｃｒｅｅｎホールディングス 基板配列装置および基板配列方法
JP6811951B2 (ja) * 2017-02-03 2021-01-13 株式会社ディスコ 搬送機構
US10510573B2 (en) * 2017-11-14 2019-12-17 Taiwan Semiconductor Manufacturing Co., Ltd. Loading apparatus and operating method thereof
CN108382782B (zh) * 2018-01-09 2021-02-12 惠科股份有限公司 一种基板的仓储方法和仓储系统
TWI707753B (zh) * 2020-05-07 2020-10-21 鈦昇科技股份有限公司 自動化手臂更換機構
US12528198B2 (en) 2021-07-09 2026-01-20 Taiwan Semiconductor Manufacturing Company, Ltd. Robot magazine and tray load and unload system

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WO2006070630A1 (ja) * 2004-12-28 2006-07-06 Tokyo Electron Limited 基板処理装置および基板搬送方法
JP2008085025A (ja) 2006-09-27 2008-04-10 Shin Etsu Polymer Co Ltd 基板の取り扱い装置及び基板の取り扱い方法
WO2008061806A1 (de) * 2006-11-24 2008-05-29 Jonas & Redmann Automationstechnik Gmbh Verfahren zum bilden einer in einem prozessboot zu positionierenden back-to-back wafercharge und handhabungssystem zum bilden der btb-wafercharge

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JP2005123642A (ja) * 2004-12-06 2005-05-12 Dainippon Screen Mfg Co Ltd 搬送機構および搬送方法
WO2006070630A1 (ja) * 2004-12-28 2006-07-06 Tokyo Electron Limited 基板処理装置および基板搬送方法
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Also Published As

Publication number Publication date
JP5696135B2 (ja) 2015-04-08
WO2010111781A1 (en) 2010-10-07
EP2415074B1 (en) 2018-10-24
EP2415074A4 (en) 2012-02-22
JP2012522385A (ja) 2012-09-20
EP2415074A1 (en) 2012-02-08
CN102369595B (zh) 2016-03-23
CA2756831C (en) 2017-12-05
KR20120024568A (ko) 2012-03-14
TW201044487A (en) 2010-12-16
CA2756831A1 (en) 2010-10-07
US9184079B2 (en) 2015-11-10
MY161955A (en) 2017-05-15
CN102369595A (zh) 2012-03-07
US20100272544A1 (en) 2010-10-28

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