KR101695434B1 - 웨이퍼를 다루기 위한 시스템 및 방법 - Google Patents

웨이퍼를 다루기 위한 시스템 및 방법 Download PDF

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Publication number
KR101695434B1
KR101695434B1 KR1020117025756A KR20117025756A KR101695434B1 KR 101695434 B1 KR101695434 B1 KR 101695434B1 KR 1020117025756 A KR1020117025756 A KR 1020117025756A KR 20117025756 A KR20117025756 A KR 20117025756A KR 101695434 B1 KR101695434 B1 KR 101695434B1
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South Korea
Prior art keywords
wafers
wafer
station
intermediate station
carrier
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Expired - Fee Related
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KR1020117025756A
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English (en)
Korean (ko)
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KR20120024568A (ko
Inventor
프레데릭 리볼리에
라이언 첩
Original Assignee
에이티에스 오토메이션 툴링 시스템즈 인코포레이티드
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Publication of KR20120024568A publication Critical patent/KR20120024568A/ko
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Publication of KR101695434B1 publication Critical patent/KR101695434B1/ko
Expired - Fee Related legal-status Critical Current
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781—Batch transfer of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67383—Closed carriers characterised by substrate supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020117025756A 2009-03-30 2010-03-30 웨이퍼를 다루기 위한 시스템 및 방법 Expired - Fee Related KR101695434B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US16463909P 2009-03-30 2009-03-30
US61/164,639 2009-03-30
PCT/CA2010/000487 WO2010111781A1 (en) 2009-03-30 2010-03-30 Systems and methods for handling wafers

Publications (2)

Publication Number Publication Date
KR20120024568A KR20120024568A (ko) 2012-03-14
KR101695434B1 true KR101695434B1 (ko) 2017-01-23

Family

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KR1020117025756A Expired - Fee Related KR101695434B1 (ko) 2009-03-30 2010-03-30 웨이퍼를 다루기 위한 시스템 및 방법

Country Status (9)

Country Link
US (1) US9184079B2 (enExample)
EP (1) EP2415074B1 (enExample)
JP (1) JP5696135B2 (enExample)
KR (1) KR101695434B1 (enExample)
CN (1) CN102369595B (enExample)
CA (1) CA2756831C (enExample)
MY (1) MY161955A (enExample)
TW (1) TW201044487A (enExample)
WO (1) WO2010111781A1 (enExample)

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US8571396B2 (en) * 2006-06-26 2013-10-29 Tp Solar, Inc. Rapid thermal firing IR conveyor furnace having high intensity heating section
US9301340B2 (en) 2006-06-26 2016-03-29 Tp Solar, Inc. IR conveyor furnace having single belt with multiple independently controlled processing lanes
US8828776B2 (en) 2009-04-16 2014-09-09 Tp Solar, Inc. Diffusion furnaces employing ultra low mass transport systems and methods of wafer rapid diffusion processing
CN102356458B (zh) * 2009-04-16 2014-10-15 Tp太阳能公司 利用极低质量运送系统的扩散炉及晶圆快速扩散加工处理的方法
US20120181265A1 (en) * 2010-07-15 2012-07-19 Despatch Industries Limited Partnership Firing furnace configuration for thermal processing system
US8829396B2 (en) 2010-11-30 2014-09-09 Tp Solar, Inc. Finger drives for IR wafer processing equipment conveyors and lateral differential temperature profile methods
CN103250230B (zh) 2010-12-13 2016-08-31 Tp太阳能公司 掺杂剂涂布系统以及涂布蒸气化掺杂化合物于光伏太阳能晶圆的方法
US8816253B2 (en) 2011-01-21 2014-08-26 Tp Solar, Inc. Dual independent transport systems for IR conveyor furnaces and methods of firing thin work pieces
BE1019301A5 (nl) * 2011-08-31 2012-05-08 Develop Mechanics Nv Inrichting voor het hanteren van halfgeleiderwafers.
CN103187347B (zh) * 2011-12-29 2016-10-05 中建材浚鑫科技股份有限公司 一种卸载电池硅片的方法
US10755960B2 (en) 2014-11-04 2020-08-25 Brooks Automation, Inc. Wafer aligner
CN104409403A (zh) * 2014-11-05 2015-03-11 江阴方艾机器人有限公司 光伏扩散工序中石英舟装载硅片工艺
DE102014224588B4 (de) * 2014-12-02 2019-08-01 Heraeus Deutschland GmbH & Co. KG Verfahren zum Herstellen eines plattenförmigen metallisierten Keramik-Substrats, Träger zum Herstellen des Substrats und Verwendung des Trägers
JP6688714B2 (ja) * 2016-09-29 2020-04-28 株式会社Ｓｃｒｅｅｎホールディングス 基板配列装置および基板配列方法
JP6811951B2 (ja) * 2017-02-03 2021-01-13 株式会社ディスコ 搬送機構
US10510573B2 (en) * 2017-11-14 2019-12-17 Taiwan Semiconductor Manufacturing Co., Ltd. Loading apparatus and operating method thereof
CN108382782B (zh) * 2018-01-09 2021-02-12 惠科股份有限公司 一种基板的仓储方法和仓储系统
TWI707753B (zh) * 2020-05-07 2020-10-21 鈦昇科技股份有限公司 自動化手臂更換機構
US20230012325A1 (en) * 2021-07-09 2023-01-12 Taiwan Semiconductor Manufacturing Company, Ltd. Robot magazine and tray load and unload system

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JP2008085025A (ja) 2006-09-27 2008-04-10 Shin Etsu Polymer Co Ltd 基板の取り扱い装置及び基板の取り扱い方法
WO2008061806A1 (de) * 2006-11-24 2008-05-29 Jonas & Redmann Automationstechnik Gmbh Verfahren zum bilden einer in einem prozessboot zu positionierenden back-to-back wafercharge und handhabungssystem zum bilden der btb-wafercharge

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JP2005123642A (ja) * 2004-12-06 2005-05-12 Dainippon Screen Mfg Co Ltd 搬送機構および搬送方法
WO2006070630A1 (ja) * 2004-12-28 2006-07-06 Tokyo Electron Limited 基板処理装置および基板搬送方法
JP2008085025A (ja) 2006-09-27 2008-04-10 Shin Etsu Polymer Co Ltd 基板の取り扱い装置及び基板の取り扱い方法
WO2008061806A1 (de) * 2006-11-24 2008-05-29 Jonas & Redmann Automationstechnik Gmbh Verfahren zum bilden einer in einem prozessboot zu positionierenden back-to-back wafercharge und handhabungssystem zum bilden der btb-wafercharge

Also Published As

Publication number Publication date
TW201044487A (en) 2010-12-16
US20100272544A1 (en) 2010-10-28
MY161955A (en) 2017-05-15
EP2415074A1 (en) 2012-02-08
CA2756831C (en) 2017-12-05
EP2415074B1 (en) 2018-10-24
EP2415074A4 (en) 2012-02-22
CN102369595B (zh) 2016-03-23
US9184079B2 (en) 2015-11-10
CN102369595A (zh) 2012-03-07
JP5696135B2 (ja) 2015-04-08
CA2756831A1 (en) 2010-10-07
KR20120024568A (ko) 2012-03-14
JP2012522385A (ja) 2012-09-20
WO2010111781A1 (en) 2010-10-07

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