JP5695924B2 - 欠陥推定装置および欠陥推定方法並びに検査装置および検査方法 - Google Patents

欠陥推定装置および欠陥推定方法並びに検査装置および検査方法 Download PDF

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JP5695924B2
JP5695924B2 JP2011017294A JP2011017294A JP5695924B2 JP 5695924 B2 JP5695924 B2 JP 5695924B2 JP 2011017294 A JP2011017294 A JP 2011017294A JP 2011017294 A JP2011017294 A JP 2011017294A JP 5695924 B2 JP5695924 B2 JP 5695924B2
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image
pattern
defect
mask
optical image
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Japanese (ja)
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JP2011221499A5 (enExample
JP2011221499A (ja
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阿部 隆幸
隆幸 阿部
土屋 英雄
英雄 土屋
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Nuflare Technology Inc
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Nuflare Technology Inc
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/82Auxiliary processes, e.g. cleaning or inspecting
    • G03F1/84Inspecting
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00Image analysis
    • G06T7/0002Inspection of images, e.g. flaw detection
    • G06T7/0004Industrial image inspection
    • G06T7/001Industrial image inspection using an image reference approach
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956Inspecting patterns on the surface of objects
    • G01N21/95607Inspecting patterns on the surface of objects using a comparative method
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605Workpiece metrology
    • G03F7/70616Monitoring the printed patterns
    • G03F7/7065Defects, e.g. optical inspection of patterned layer for defects
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00Image analysis
    • G06T7/0002Inspection of images, e.g. flaw detection
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06VIMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00Arrangements for image or video recognition or understanding
    • G06V10/40Extraction of image or video features
    • G06V10/42Global feature extraction by analysis of the whole pattern, e.g. using frequency domain transformations or autocorrelation
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00Indexing scheme for image analysis or image enhancement
    • G06T2207/30Subject of image; Context of image processing
    • G06T2207/30108Industrial image inspection
    • G06T2207/30148Semiconductor; IC; Wafer

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Multimedia (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
JP2011017294A 2010-02-01 2011-01-28 欠陥推定装置および欠陥推定方法並びに検査装置および検査方法 Expired - Fee Related JP5695924B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011017294A JP5695924B2 (ja) 2010-02-01 2011-01-28 欠陥推定装置および欠陥推定方法並びに検査装置および検査方法

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2010020584 2010-02-01
JP2010020584 2010-02-01
JP2010066559 2010-03-23
JP2010066559 2010-03-23
JP2011017294A JP5695924B2 (ja) 2010-02-01 2011-01-28 欠陥推定装置および欠陥推定方法並びに検査装置および検査方法

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JP2011221499A JP2011221499A (ja) 2011-11-04
JP2011221499A5 JP2011221499A5 (enExample) 2014-01-23
JP5695924B2 true JP5695924B2 (ja) 2015-04-08

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US20130094752A1 (en) 2013-04-18
US8737676B2 (en) 2014-05-27
US8781212B2 (en) 2014-07-15
US9177372B2 (en) 2015-11-03
US20130093878A1 (en) 2013-04-18
US20150131892A1 (en) 2015-05-14
US20110188734A1 (en) 2011-08-04
US8983113B2 (en) 2015-03-17
JP2011221499A (ja) 2011-11-04

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