JP5695924B2 - 欠陥推定装置および欠陥推定方法並びに検査装置および検査方法 - Google Patents
欠陥推定装置および欠陥推定方法並びに検査装置および検査方法 Download PDFInfo
- Publication number
- JP5695924B2 JP5695924B2 JP2011017294A JP2011017294A JP5695924B2 JP 5695924 B2 JP5695924 B2 JP 5695924B2 JP 2011017294 A JP2011017294 A JP 2011017294A JP 2011017294 A JP2011017294 A JP 2011017294A JP 5695924 B2 JP5695924 B2 JP 5695924B2
- Authority
- JP
- Japan
- Prior art keywords
- image
- pattern
- defect
- mask
- optical image
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
- G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
- G03F1/84—Inspecting
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
- G06T7/001—Industrial image inspection using an image reference approach
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
- G03F7/7065—Defects, e.g. optical inspection of patterned layer for defects
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V10/00—Arrangements for image or video recognition or understanding
- G06V10/40—Extraction of image or video features
- G06V10/42—Global feature extraction by analysis of the whole pattern, e.g. using frequency domain transformations or autocorrelation
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30148—Semiconductor; IC; Wafer
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Theoretical Computer Science (AREA)
- Quality & Reliability (AREA)
- Multimedia (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011017294A JP5695924B2 (ja) | 2010-02-01 | 2011-01-28 | 欠陥推定装置および欠陥推定方法並びに検査装置および検査方法 |
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010020584 | 2010-02-01 | ||
| JP2010020584 | 2010-02-01 | ||
| JP2010066559 | 2010-03-23 | ||
| JP2010066559 | 2010-03-23 | ||
| JP2011017294A JP5695924B2 (ja) | 2010-02-01 | 2011-01-28 | 欠陥推定装置および欠陥推定方法並びに検査装置および検査方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011221499A JP2011221499A (ja) | 2011-11-04 |
| JP2011221499A5 JP2011221499A5 (enExample) | 2014-01-23 |
| JP5695924B2 true JP5695924B2 (ja) | 2015-04-08 |
Family
ID=44341692
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011017294A Expired - Fee Related JP5695924B2 (ja) | 2010-02-01 | 2011-01-28 | 欠陥推定装置および欠陥推定方法並びに検査装置および検査方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (4) | US8737676B2 (enExample) |
| JP (1) | JP5695924B2 (enExample) |
Families Citing this family (42)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4476975B2 (ja) | 2005-10-25 | 2010-06-09 | 株式会社ニューフレアテクノロジー | 荷電粒子ビーム照射量演算方法、荷電粒子ビーム描画方法、プログラム及び荷電粒子ビーム描画装置 |
| JP4942800B2 (ja) * | 2009-08-18 | 2012-05-30 | 株式会社ニューフレアテクノロジー | 検査装置 |
| JP5764364B2 (ja) | 2011-03-31 | 2015-08-19 | 株式会社ニューフレアテクノロジー | 半導体装置の製造方法、描画装置、プログラム及びパターン転写装置 |
| US9128064B2 (en) | 2012-05-29 | 2015-09-08 | Kla-Tencor Corporation | Super resolution inspection system |
| JP6241120B2 (ja) * | 2012-09-14 | 2017-12-06 | 株式会社リコー | 画像検査装置、画像検査方法及び画像検査装置の制御プログラム |
| JP6318358B2 (ja) * | 2013-04-08 | 2018-05-09 | 株式会社ニューフレアテクノロジー | 照明装置および検査装置 |
| JP6259634B2 (ja) * | 2013-10-17 | 2018-01-10 | 株式会社日立ハイテクノロジーズ | 検査装置 |
| US9158884B2 (en) * | 2013-11-04 | 2015-10-13 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method and system for repairing wafer defects |
| KR101924487B1 (ko) * | 2013-12-17 | 2018-12-03 | 에이에스엠엘 네델란즈 비.브이. | 수율 추산 및 제어 |
| US9390884B2 (en) | 2014-05-09 | 2016-07-12 | Globalfoundries Inc. | Method of inspecting a semiconductor substrate |
| JP6307367B2 (ja) | 2014-06-26 | 2018-04-04 | 株式会社ニューフレアテクノロジー | マスク検査装置、マスク評価方法及びマスク評価システム |
| JP6251647B2 (ja) * | 2014-07-15 | 2017-12-20 | 株式会社ニューフレアテクノロジー | マスク検査装置及びマスク検査方法 |
| DE102014114864B4 (de) * | 2014-10-14 | 2016-06-02 | Carl Zeiss Sms Gmbh | Verfahren und Vorrichtung zum Ermitteln eines lateralen Versatzes eines Musters auf einem Substrat relativ zu einer Sollposition |
| JP6543070B2 (ja) * | 2015-04-01 | 2019-07-10 | 株式会社ニューフレアテクノロジー | 検査方法および検査装置 |
| US10012599B2 (en) * | 2015-04-03 | 2018-07-03 | Kla-Tencor Corp. | Optical die to database inspection |
| TWI627588B (zh) * | 2015-04-23 | 2018-06-21 | 日商思可林集團股份有限公司 | 檢查裝置及基板處理裝置 |
| US10304178B2 (en) * | 2015-09-18 | 2019-05-28 | Taiwan Semiconductor Manfacturing Company, Ltd. | Method and system for diagnosing a semiconductor wafer |
| JP6527808B2 (ja) | 2015-10-27 | 2019-06-05 | 株式会社ニューフレアテクノロジー | 検査方法および検査装置 |
| WO2017130477A1 (ja) * | 2016-01-29 | 2017-08-03 | 富士フイルム株式会社 | 欠陥検査装置、方法およびプログラム |
| JP6333871B2 (ja) * | 2016-02-25 | 2018-05-30 | ファナック株式会社 | 入力画像から検出した対象物を表示する画像処理装置 |
| US9940705B2 (en) * | 2016-05-04 | 2018-04-10 | Kla-Tencor Corporation | System, method and computer program product for detecting defects in a fabricated target component using consistent modulation for the target and reference components |
| JP6750966B2 (ja) * | 2016-06-01 | 2020-09-02 | 株式会社ニューフレアテクノロジー | パターン検査装置及びパターン検査方法 |
| JP6702807B2 (ja) * | 2016-06-14 | 2020-06-03 | 日本電子株式会社 | 電子顕微鏡および画像取得方法 |
| US10031997B1 (en) | 2016-11-29 | 2018-07-24 | Taiwan Semiconductor Manufacturing Co., Ltd. | Forecasting wafer defects using frequency domain analysis |
| DE112016007498B4 (de) * | 2016-12-06 | 2020-11-26 | Mitsubishi Electric Corporation | Untersuchungseinrichtung und untersuchungsverfahren |
| DE102017203879B4 (de) * | 2017-03-09 | 2023-06-07 | Carl Zeiss Smt Gmbh | Verfahren zum Analysieren einer defekten Stelle einer photolithographischen Maske |
| US10572990B2 (en) * | 2017-04-07 | 2020-02-25 | Nuflare Technology, Inc. | Pattern inspection apparatus, pattern position measurement apparatus, aerial image measurement system, method for measuring aerial image, pattern position repairing apparatus, method for repairing pattern position, aerial image data processing apparatus, method for processing aerial image data, pattern exposure apparatus, method for exposing pattern, method for manufacturing mask, and mask manufacturing system |
| US11268910B2 (en) | 2017-07-07 | 2022-03-08 | Koh Young Technology Inc. | Apparatus for optimizing inspection of exterior of target object and method thereof |
| TWI753152B (zh) * | 2018-04-12 | 2022-01-21 | 聯華電子股份有限公司 | 光罩以及形成圖案的方法 |
| KR102630568B1 (ko) | 2018-06-15 | 2024-01-29 | 삼성전자주식회사 | 반도체 소자의 제조 방법 |
| JP7110044B2 (ja) * | 2018-09-14 | 2022-08-01 | キオクシア株式会社 | 修正パターン生成装置、パターン欠陥修正システム、修正パターン生成方法、及び半導体装置の製造方法 |
| US10861726B2 (en) * | 2018-09-21 | 2020-12-08 | Advanced Semiconductor Engineering, Inc. | Apparatus and method for measuring warpage |
| US10762618B1 (en) * | 2019-02-14 | 2020-09-01 | United Microelectronics Corp. | Mask weak pattern recognition apparatus and mask weak pattern recognition method |
| US11276161B2 (en) * | 2019-02-26 | 2022-03-15 | KLA Corp. | Reference image generation for semiconductor applications |
| JP7437959B2 (ja) * | 2019-03-07 | 2024-02-26 | Hoya株式会社 | 修正フォトマスク、及び表示装置の製造方法 |
| CN111242896A (zh) * | 2019-12-31 | 2020-06-05 | 电子科技大学 | 一种彩色印刷标签缺陷检测与质量评级方法 |
| JP7431694B2 (ja) * | 2020-07-28 | 2024-02-15 | キヤノン株式会社 | 情報処理装置、膜形成装置、物品の製造方法、およびプログラム |
| TWI792135B (zh) * | 2020-12-30 | 2023-02-11 | 鴻海精密工業股份有限公司 | 缺陷檢測方法及裝置、電子裝置及電腦可讀存儲介質 |
| JP7443268B2 (ja) * | 2021-01-05 | 2024-03-05 | 株式会社ニューフレアテクノロジー | 欠陥検査方法 |
| KR20230028995A (ko) | 2021-08-23 | 2023-03-03 | 삼성전자주식회사 | 결함 예측 방법 및 장치 |
| US11727556B2 (en) * | 2021-09-29 | 2023-08-15 | KLA Corp. | Defect detection for multi-die masks |
| CN116559183B (zh) * | 2023-07-11 | 2023-11-03 | 钛玛科(北京)工业科技有限公司 | 一种提高缺陷判定效率的方法及系统 |
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| US3685129A (en) * | 1970-04-03 | 1972-08-22 | Automated Building Components | Method of fabricating wooden building wall frames |
| JP2856846B2 (ja) * | 1990-05-31 | 1999-02-10 | 株式会社東芝 | パターン欠陥検査方法とその装置 |
| JP3376082B2 (ja) * | 1994-03-31 | 2003-02-10 | 株式会社東芝 | パターン欠陥検査装置 |
| US6578188B1 (en) | 1997-09-17 | 2003-06-10 | Numerical Technologies, Inc. | Method and apparatus for a network-based mask defect printability analysis system |
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| JP2001066759A (ja) * | 1999-08-26 | 2001-03-16 | Toppan Printing Co Ltd | Opcマスク欠陥修正方法及び欠陥修正装置 |
| US6340084B1 (en) * | 1999-12-24 | 2002-01-22 | Terry E. Burcaw | Lumber staging device |
| US6873720B2 (en) * | 2001-03-20 | 2005-03-29 | Synopsys, Inc. | System and method of providing mask defect printability analysis |
| US7043071B2 (en) | 2002-09-13 | 2006-05-09 | Synopsys, Inc. | Soft defect printability simulation and analysis for masks |
| US7093226B2 (en) * | 2003-02-28 | 2006-08-15 | Synopsys, Inc. | Method and apparatus of wafer print simulation using hybrid model with mask optical images |
| US7221788B2 (en) * | 2003-07-01 | 2007-05-22 | Infineon Technologies Ag | Method of inspecting a mask or reticle for detecting a defect, and mask or reticle inspection system |
| US7558419B1 (en) * | 2003-08-14 | 2009-07-07 | Brion Technologies, Inc. | System and method for detecting integrated circuit pattern defects |
| US7003758B2 (en) | 2003-10-07 | 2006-02-21 | Brion Technologies, Inc. | System and method for lithography simulation |
| JP2005309140A (ja) * | 2004-04-22 | 2005-11-04 | Toshiba Corp | フォトマスク製造方法、フォトマスク欠陥修正箇所判定方法、及びフォトマスク欠陥修正箇所判定装置 |
| JP2006250845A (ja) * | 2005-03-14 | 2006-09-21 | Topcon Corp | パターン欠陥検査方法とその装置 |
| JP2007079551A (ja) * | 2005-08-19 | 2007-03-29 | Sii Nanotechnology Inc | 原子間力顕微鏡加工装置を用いたフォトマスク欠陥修正方法 |
| JP4185516B2 (ja) * | 2005-08-31 | 2008-11-26 | アドバンスド・マスク・インスペクション・テクノロジー株式会社 | 試料検査装置、試料検査方法及びプログラム |
| US7478360B2 (en) | 2005-12-06 | 2009-01-13 | Synopsys, Inc. | Approximating wafer intensity change to provide fast mask defect scoring |
| US7872745B2 (en) | 2007-08-08 | 2011-01-18 | Nuflare Technology, Inc. | Pattern inspection apparatus and pattern inspection method |
| JP5123630B2 (ja) | 2007-09-27 | 2013-01-23 | 株式会社ニューフレアテクノロジー | パターン検査装置及びパターン検査方法 |
| JP5305641B2 (ja) | 2007-11-21 | 2013-10-02 | 株式会社ニューフレアテクノロジー | パターン検査装置及びパターン検査方法 |
| JP2008112178A (ja) * | 2007-11-22 | 2008-05-15 | Advanced Mask Inspection Technology Kk | マスク検査装置 |
| US7673278B2 (en) * | 2007-11-29 | 2010-03-02 | Tokyo Electron Limited | Enhanced process yield using a hot-spot library |
| JP2009300426A (ja) | 2008-05-16 | 2009-12-24 | Nuflare Technology Inc | レチクル欠陥検査装置およびレチクル欠陥検査方法 |
| JP5350121B2 (ja) | 2008-09-11 | 2013-11-27 | 株式会社ニューフレアテクノロジー | パターン検査装置及びパターン検査方法 |
| JP4942800B2 (ja) | 2009-08-18 | 2012-05-30 | 株式会社ニューフレアテクノロジー | 検査装置 |
| JP4933601B2 (ja) | 2009-08-18 | 2012-05-16 | 株式会社ニューフレアテクノロジー | 検査装置および検査方法 |
| JP4918598B2 (ja) | 2010-01-18 | 2012-04-18 | 株式会社ニューフレアテクノロジー | 検査装置および検査方法 |
| JP5591675B2 (ja) | 2010-12-06 | 2014-09-17 | 株式会社ニューフレアテクノロジー | 検査装置および検査方法 |
| JP5753461B2 (ja) | 2011-08-18 | 2015-07-22 | 株式会社ニューフレアテクノロジー | パターン検査装置及びパターン検査方法 |
-
2011
- 2011-01-28 JP JP2011017294A patent/JP5695924B2/ja not_active Expired - Fee Related
- 2011-01-31 US US13/017,641 patent/US8737676B2/en active Active
-
2012
- 2012-12-05 US US13/705,618 patent/US8781212B2/en not_active Expired - Fee Related
- 2012-12-05 US US13/705,663 patent/US8983113B2/en not_active Expired - Fee Related
-
2015
- 2015-01-21 US US14/601,846 patent/US9177372B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| US20130094752A1 (en) | 2013-04-18 |
| US8737676B2 (en) | 2014-05-27 |
| US8781212B2 (en) | 2014-07-15 |
| US9177372B2 (en) | 2015-11-03 |
| US20130093878A1 (en) | 2013-04-18 |
| US20150131892A1 (en) | 2015-05-14 |
| US20110188734A1 (en) | 2011-08-04 |
| US8983113B2 (en) | 2015-03-17 |
| JP2011221499A (ja) | 2011-11-04 |
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