JP5693583B2 - 連続プロセスでの真空蒸着技術による電極表面の活性化 - Google Patents
連続プロセスでの真空蒸着技術による電極表面の活性化 Download PDFInfo
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- 238000000034 method Methods 0.000 title claims description 32
- 238000010924 continuous production Methods 0.000 title description 4
- 230000004913 activation Effects 0.000 title 1
- 238000001771 vacuum deposition Methods 0.000 title 1
- 238000000151 deposition Methods 0.000 claims description 31
- 230000008021 deposition Effects 0.000 claims description 26
- 238000005240 physical vapour deposition Methods 0.000 claims description 16
- 229910052751 metal Inorganic materials 0.000 claims description 15
- 239000002184 metal Substances 0.000 claims description 15
- 239000000758 substrate Substances 0.000 claims description 15
- 230000003750 conditioning effect Effects 0.000 claims description 14
- 238000007740 vapor deposition Methods 0.000 claims description 11
- 229910000510 noble metal Inorganic materials 0.000 claims description 10
- 229910052707 ruthenium Inorganic materials 0.000 claims description 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 8
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims description 8
- 238000005229 chemical vapour deposition Methods 0.000 claims description 8
- 239000000126 substance Substances 0.000 claims description 8
- 238000007735 ion beam assisted deposition Methods 0.000 claims description 6
- 238000011068 loading method Methods 0.000 claims description 6
- 238000002294 plasma sputter deposition Methods 0.000 claims description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 6
- XKRFYHLGVUSROY-UHFFFAOYSA-N argon Substances [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 5
- 229910052786 argon Inorganic materials 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 239000000376 reactant Substances 0.000 claims description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 3
- 238000000605 extraction Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 230000001590 oxidative effect Effects 0.000 claims description 3
- 229910052697 platinum Inorganic materials 0.000 claims description 3
- 239000010936 titanium Substances 0.000 claims description 3
- 229910052719 titanium Inorganic materials 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 claims description 2
- 229910052741 iridium Inorganic materials 0.000 claims description 2
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 claims description 2
- 230000003647 oxidation Effects 0.000 claims 2
- 238000007254 oxidation reaction Methods 0.000 claims 2
- 229910000831 Steel Inorganic materials 0.000 claims 1
- 239000007800 oxidant agent Substances 0.000 claims 1
- 239000010959 steel Substances 0.000 claims 1
- 239000006260 foam Substances 0.000 description 7
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 238000005868 electrolysis reaction Methods 0.000 description 5
- -1 ruthenium ions Chemical class 0.000 description 5
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000005137 deposition process Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 238000010884 ion-beam technique Methods 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- 239000003570 air Substances 0.000 description 2
- 239000012080 ambient air Substances 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 239000000460 chlorine Substances 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000005672 electromagnetic field Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical group 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 238000009834 vaporization Methods 0.000 description 2
- 230000008016 vaporization Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 238000000541 cathodic arc deposition Methods 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 239000010431 corundum Substances 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010285 flame spraying Methods 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000007750 plasma spraying Methods 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 238000004549 pulsed laser deposition Methods 0.000 description 1
- 238000005546 reactive sputtering Methods 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
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- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
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- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
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- C23C14/08—Oxides
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- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
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- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/221—Ion beam deposition
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- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
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- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
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- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
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- C25B11/00—Electrodes; Manufacture thereof not otherwise provided for
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- C25B11/00—Electrodes; Manufacture thereof not otherwise provided for
- C25B11/04—Electrodes; Manufacture thereof not otherwise provided for characterised by the material
- C25B11/051—Electrodes formed of electrocatalysts on a substrate or carrier
- C25B11/073—Electrodes formed of electrocatalysts on a substrate or carrier characterised by the electrocatalyst material
- C25B11/075—Electrodes formed of electrocatalysts on a substrate or carrier characterised by the electrocatalyst material consisting of a single catalytic element or catalytic compound
- C25B11/081—Electrodes formed of electrocatalysts on a substrate or carrier characterised by the electrocatalyst material consisting of a single catalytic element or catalytic compound the element being a noble metal
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- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M4/00—Electrodes
- H01M4/86—Inert electrodes with catalytic activity, e.g. for fuel cells
- H01M4/88—Processes of manufacture
- H01M4/8825—Methods for deposition of the catalytic active composition
- H01M4/8867—Vapour deposition
- H01M4/8871—Sputtering
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- General Chemical & Material Sciences (AREA)
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Description
1000×500×0.89mmサイズの20枚組のチタングレード1のシートを18体積%のHCl中でエッチングし、アセトンで脱脂した。該シートを、連続製造のためにIBAD装置のコンディショニングチャンバーの各トレイに置き、その後130Paに減圧した。次に、シートを蒸着チャンバーに逐次供給し、そこで動的真空下、3.5.10−5Paの圧力で生成されたプラズマによる二段階のイオン照射に付した。第一段階では、シート表面を可能性ある残留物からクリーニングすることを目的として、シートを低エネルギー(200〜500eV)のアルゴンイオンで照射した。第二段階では、緻密コーティングの堆積を目的として、プラズマ相から抽出された1000〜2000eVのエネルギーの白金イオンによる照射を実行した。0.3mg/cm2のPtの蒸着完了後、シートを130Paに維持された次の減圧チャンバーに移した。全シートに対する処理が終了したら、減圧チャンバーを周囲空気で加圧し、その後シートを取り出した。
1000×500×0.3mmサイズの10枚組のニッケルシートを、70μmをわずかに下回るRz粗さ値が得られるまでコランダムでブラストし、20体積%のHCl中でエッチングし、アセトンで脱脂した。該シートを、実施例1に記載のIBADプロセスにより、同じ装置を使用し、第二段階ではプラズマ相から抽出された1000〜2000eVのエネルギーのルテニウムイオンによる照射を実施して0.1mg/cm2のルテニウム膜で被覆した。蒸着後、シートを取り出し、空気中400℃で1時間の熱的後処理に付すことによって、被覆されたルテニウムをRuO2に酸化した。このようにして得られた電極の一部から1cm2のサンプルを切り取り、標準条件における水素発生電位の測定を実施した。32重量%のNaOH中、90℃の温度、10kA/m2の電流密度で−968mV/NHEの値が得られた。
幅500mm及び厚さ0.36mmの20メートルのコイル状ニッケル発泡メッシュを熱的に脱脂し、約20μmのRz粗さ値が得られるまで20体積%のHCl中でエッチングした。該コイルを、連続ロール・ツー・ロール蒸着のために、マグネトロンプラズマスパッタリング(MPS)装置の供給部に装填し、10−3Paの圧力をかけた。該装置は0.2cm/sの線速度で運転された。蒸着部への移送中、シートを純Ar中でのスパッタリングによってさらにクリーニングした(基材とチャンバー壁間の公称電力200W及びバイアスゼロで5.10−5Paで生成されたプラズマを用いて)。次いで、反応性スパッタリングによって得られたRuO2層で被覆した(200W、20%Ar/O2混合物、約5.10−1Paの動的真空及び約450℃の蒸着温度を維持)。蒸着後、3μmの厚さに相当する0.3mg/cm2のRuO2で被覆された発泡シートを取出し部でコイル状に巻き戻し、装置を周囲空気で再加圧した後、そこから取り出した。このようにして活性化された発泡シートコイルを次に連続切断機に供給し、そこで長さ100cmの電極を得た。このようにして得られた電極の一部から1cm2のサンプルを切り取り、標準条件における水素発生電位の測定を実施した。32重量%のNaOH中、90℃の温度、10kA/m2の電流密度で−976mV/NHEの値が得られた。
Claims (10)
- 電解プロセス用の電極の製造法であって、化学又は物理蒸着技術によって金属基材上に貴金属又はその酸化物の緻密層を連続的に蒸着することを含み、前記方法は、
− 前記金属基材を予備形成品の状態で物理蒸着装置のコンディショニングチャンバーに装填し;
− 前記コンディショニングチャンバーを第一の圧力レベルに減圧し;
− 前記予備形成品に対して、蒸着チャンバーへの装填、前記第一の圧力レベルより低い第二の圧力レベルでの前記貴金属の緻密層の物理蒸着、取出しチャンバー又は大気中への逐次排出というサイクルを逐次自動実行する
ステップを含み、
前記減圧のステップが、相互に液圧接続された前記コンディショニングチャンバーと前記蒸着チャンバーと前記取出しチャンバーとで実施され、そして前記物理蒸着のステップが前記コンディショニングチャンバーと前記取出しチャンバーとから分離された前記蒸着チャンバーで実施される、
方法。 - 前記第一の圧力レベルが10−3〜1Paの範囲であり、前記第二の圧力レベルが10−6〜10−3Paの範囲である、請求項1に記載の方法。
- 酸化雰囲気中での熱処理という次なるステップを含む、請求項1又は2に記載の方法。
- 前記物理蒸着のステップが、ガス状反応物による前記貴金属の同時酸化を含む、請求項1又は2に記載の方法。
- 前記物理蒸着装置がIBAD装置であり、前記貴金属の緻密層の前記物理蒸着が、200〜500eVのアルゴンイオン照射による基材クリーニングステップ後に、プラズマ相から抽出された1000〜2000eVのエネルギーを有するイオンの照射によって実施される、請求項2〜4のいずれか1項に記載の方法。
- 請求項1に記載の電解プロセス用の電極の製造法であって、化学又は物理蒸着技術によって金属基材上に貴金属又はその酸化物の緻密層を連続的に蒸着することを含み、前記基材は、コイル状のメッシュ又はコイル状の発泡シートであり、ここで前記基材は、10−3〜1Paの第一の真空度に減圧された、そして10−6〜10−3Paの高真空に減圧できる蒸着部を備えたロール・ツー・ロール又はロール・ツー・シートタイプのマグネトロンプラズマスパッタリング装置又はDCプラズマスパッタリング装置中で実施される前記貴金属の緻密層の物理蒸着によって処理される方法。
- 酸化剤雰囲気中での熱処理という次なるステップを含む、請求項6に記載の方法。
- 前記物理蒸着が、ガス状反応物による前記貴金属の同時酸化を含む、請求項6に記載の方法。
- 前記金属基材が、ニッケル、スチール又はチタン製である、請求項1〜8のいずれかに記載の方法。
- 前記貴金属又はその酸化物が、白金、ルテニウム、イリジウム及びそれらの酸化物からなる群から選ばれる、請求項1〜9のいずれかに記載の方法。
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IT001531A ITMI20091531A1 (it) | 2009-09-03 | 2009-09-03 | Attivazione continua di strutture elettrodiche mediante tecniche di deposizione in vuoto |
ITMI2009A001531 | 2009-09-03 | ||
PCT/EP2010/062902 WO2011026914A1 (en) | 2009-09-03 | 2010-09-02 | Activation of electrode surfaces by means of vacuum deposition techniques in a continuous process |
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US9567681B2 (en) * | 2013-02-12 | 2017-02-14 | Treadstone Technologies, Inc. | Corrosion resistant and electrically conductive surface of metallic components for electrolyzers |
US20150056493A1 (en) * | 2013-08-21 | 2015-02-26 | GM Global Technology Operations LLC | Coated porous separators and coated electrodes for lithium batteries |
KR102491154B1 (ko) * | 2021-01-21 | 2023-01-26 | 주식회사 테크로스 | 전기분해용 이중코팅 촉매 전극 및 이의 제조방법 |
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US2405662A (en) * | 1941-08-30 | 1946-08-13 | Crown Cork & Seal Co | Coating |
US4331523A (en) * | 1980-03-31 | 1982-05-25 | Showa Denko Kk | Method for electrolyzing water or aqueous solutions |
US4544473A (en) * | 1980-05-12 | 1985-10-01 | Energy Conversion Devices, Inc. | Catalytic electrolytic electrode |
JPS6379955A (ja) * | 1986-09-20 | 1988-04-09 | Nippon Steel Corp | ろう付け性に優れたステンレス鋼帯の製造方法 |
JPS63204726A (ja) * | 1987-02-20 | 1988-08-24 | Anelva Corp | 真空処理装置 |
US5003428A (en) * | 1989-07-17 | 1991-03-26 | National Semiconductor Corporation | Electrodes for ceramic oxide capacitors |
US5236509A (en) * | 1992-02-06 | 1993-08-17 | Spire Corporation | Modular ibad apparatus for continuous coating |
GB9316926D0 (en) * | 1993-08-13 | 1993-09-29 | Ici Plc | Electrode |
US6673127B1 (en) * | 1997-01-22 | 2004-01-06 | Denora S.P.A. | Method of forming robust metal, metal oxide, and metal alloy layers on ion-conductive polymer membranes |
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JPH1129863A (ja) * | 1997-07-10 | 1999-02-02 | Canon Inc | 堆積膜製造方法 |
US5879827A (en) * | 1997-10-10 | 1999-03-09 | Minnesota Mining And Manufacturing Company | Catalyst for membrane electrode assembly and method of making |
US6866958B2 (en) * | 2002-06-05 | 2005-03-15 | General Motors Corporation | Ultra-low loadings of Au for stainless steel bipolar plates |
US7193934B2 (en) * | 2002-06-07 | 2007-03-20 | Carnegie Mellon University | Domain position detection magnetic amplifying magneto-optical system |
US8460841B2 (en) * | 2005-07-01 | 2013-06-11 | Basf Fuel Cell Gmbh | Gas diffusion electrodes, membrane-electrode assemblies and method for the production thereof |
JP4670530B2 (ja) * | 2005-08-01 | 2011-04-13 | アイテック株式会社 | 電解用の貴金属電極とその製造方法 |
DE102006057386A1 (de) * | 2006-12-04 | 2008-06-05 | Uhde Gmbh | Verfahren zum Beschichten von Substraten |
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US7806641B2 (en) * | 2007-08-30 | 2010-10-05 | Ascentool, Inc. | Substrate processing system having improved substrate transport system |
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BR112012004765A2 (pt) | 2016-03-15 |
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MX2012002713A (es) | 2012-04-19 |
WO2011026914A1 (en) | 2011-03-10 |
ITMI20091531A1 (it) | 2011-03-04 |
IL217803A0 (en) | 2012-03-29 |
AU2010291209B2 (en) | 2014-08-28 |
US20120164344A1 (en) | 2012-06-28 |
CA2769818A1 (en) | 2011-03-10 |
ZA201201432B (en) | 2013-05-29 |
CN102482770B (zh) | 2015-03-25 |
EA024663B1 (ru) | 2016-10-31 |
EP2473647A1 (en) | 2012-07-11 |
KR20120049380A (ko) | 2012-05-16 |
EG26695A (en) | 2014-06-11 |
JP2013503967A (ja) | 2013-02-04 |
CN102482770A (zh) | 2012-05-30 |
AR078328A1 (es) | 2011-11-02 |
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