HK1167691A1 - Activation of electrode surfaces by means of vacuum deposition techniques in a continuous process - Google Patents

Activation of electrode surfaces by means of vacuum deposition techniques in a continuous process

Info

Publication number
HK1167691A1
HK1167691A1 HK12108279.1A HK12108279A HK1167691A1 HK 1167691 A1 HK1167691 A1 HK 1167691A1 HK 12108279 A HK12108279 A HK 12108279A HK 1167691 A1 HK1167691 A1 HK 1167691A1
Authority
HK
Hong Kong
Prior art keywords
activation
vacuum deposition
continuous process
deposition techniques
electrode surfaces
Prior art date
Application number
HK12108279.1A
Other languages
English (en)
Chinese (zh)
Inventor
．安托齊
．古洛
．馬特利
．拉姆尼
．厄戈赫
．亞科佩蒂
Original Assignee
德諾拉工業有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 德諾拉工業有限公司 filed Critical 德諾拉工業有限公司
Publication of HK1167691A1 publication Critical patent/HK1167691A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/08—Oxides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
    • C23C14/165—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon by cathodic sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/221—Ion beam deposition
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
    • C25B11/00—Electrodes; Manufacture thereof not otherwise provided for
    • C25B11/04—Electrodes; Manufacture thereof not otherwise provided for characterised by the material
    • C25B11/051—Electrodes formed of electrocatalysts on a substrate or carrier
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
    • C25B11/00—Electrodes; Manufacture thereof not otherwise provided for
    • C25B11/04—Electrodes; Manufacture thereof not otherwise provided for characterised by the material
    • C25B11/051—Electrodes formed of electrocatalysts on a substrate or carrier
    • C25B11/052—Electrodes comprising one or more electrocatalytic coatings on a substrate
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
    • C25B11/00—Electrodes; Manufacture thereof not otherwise provided for
    • C25B11/04—Electrodes; Manufacture thereof not otherwise provided for characterised by the material
    • C25B11/051—Electrodes formed of electrocatalysts on a substrate or carrier
    • C25B11/073—Electrodes formed of electrocatalysts on a substrate or carrier characterised by the electrocatalyst material
    • C25B11/075—Electrodes formed of electrocatalysts on a substrate or carrier characterised by the electrocatalyst material consisting of a single catalytic element or catalytic compound
    • C25B11/081—Electrodes formed of electrocatalysts on a substrate or carrier characterised by the electrocatalyst material consisting of a single catalytic element or catalytic compound the element being a noble metal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00—Electrodes
    • H01M4/86—Inert electrodes with catalytic activity, e.g. for fuel cells
    • H01M4/88—Processes of manufacture
    • H01M4/8825—Methods for deposition of the catalytic active composition
    • H01M4/8867—Vapour deposition
    • H01M4/8871—Sputtering
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/30—Hydrogen technology
    • Y02E60/50—Fuel cells

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Electrochemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physical Vapour Deposition (AREA)
  • Electrodes For Compound Or Non-Metal Manufacture (AREA)
  • Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Electrolytic Production Of Metals (AREA)
HK12108279.1A 2009-09-03 2012-08-23 Activation of electrode surfaces by means of vacuum deposition techniques in a continuous process HK1167691A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
IT001531A ITMI20091531A1 (it) 2009-09-03 2009-09-03 Attivazione continua di strutture elettrodiche mediante tecniche di deposizione in vuoto
PCT/EP2010/062902 WO2011026914A1 (en) 2009-09-03 2010-09-02 Activation of electrode surfaces by means of vacuum deposition techniques in a continuous process

Publications (1)

Publication Number Publication Date
HK1167691A1 true HK1167691A1 (en) 2012-12-07

Family

ID=41650354

Family Applications (1)

Application Number Title Priority Date Filing Date
HK12108279.1A HK1167691A1 (en) 2009-09-03 2012-08-23 Activation of electrode surfaces by means of vacuum deposition techniques in a continuous process

Country Status (17)

Country Link
US (1) US20120164344A1 (xx)
EP (1) EP2473647A1 (xx)
JP (1) JP5693583B2 (xx)
KR (1) KR20120049380A (xx)
CN (1) CN102482770B (xx)
AR (1) AR078328A1 (xx)
AU (1) AU2010291209B2 (xx)
BR (1) BR112012004765A2 (xx)
CA (1) CA2769818A1 (xx)
EA (1) EA024663B1 (xx)
EG (1) EG26695A (xx)
HK (1) HK1167691A1 (xx)
IL (1) IL217803A0 (xx)
IT (1) ITMI20091531A1 (xx)
MX (1) MX2012002713A (xx)
WO (1) WO2011026914A1 (xx)
ZA (1) ZA201201432B (xx)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9567681B2 (en) * 2013-02-12 2017-02-14 Treadstone Technologies, Inc. Corrosion resistant and electrically conductive surface of metallic components for electrolyzers
US20150056493A1 (en) * 2013-08-21 2015-02-26 GM Global Technology Operations LLC Coated porous separators and coated electrodes for lithium batteries
KR102491154B1 (ko) * 2021-01-21 2023-01-26 주식회사 테크로스 전기분해용 이중코팅 촉매 전극 및 이의 제조방법

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US2405662A (en) * 1941-08-30 1946-08-13 Crown Cork & Seal Co Coating
US4331523A (en) * 1980-03-31 1982-05-25 Showa Denko Kk Method for electrolyzing water or aqueous solutions
US4544473A (en) * 1980-05-12 1985-10-01 Energy Conversion Devices, Inc. Catalytic electrolytic electrode
JPS6379955A (ja) * 1986-09-20 1988-04-09 Nippon Steel Corp ろう付け性に優れたステンレス鋼帯の製造方法
JPS63204726A (ja) * 1987-02-20 1988-08-24 Anelva Corp 真空処理装置
US5003428A (en) * 1989-07-17 1991-03-26 National Semiconductor Corporation Electrodes for ceramic oxide capacitors
US5236509A (en) * 1992-02-06 1993-08-17 Spire Corporation Modular ibad apparatus for continuous coating
GB9316926D0 (en) * 1993-08-13 1993-09-29 Ici Plc Electrode
US6673127B1 (en) * 1997-01-22 2004-01-06 Denora S.P.A. Method of forming robust metal, metal oxide, and metal alloy layers on ion-conductive polymer membranes
AU719341B2 (en) * 1997-01-22 2000-05-04 De Nora Elettrodi S.P.A. Method of forming robust metal, metal oxide, and metal alloy layers on ion-conductive polymer membranes
JPH1129863A (ja) * 1997-07-10 1999-02-02 Canon Inc 堆積膜製造方法
US5879827A (en) * 1997-10-10 1999-03-09 Minnesota Mining And Manufacturing Company Catalyst for membrane electrode assembly and method of making
US6866958B2 (en) * 2002-06-05 2005-03-15 General Motors Corporation Ultra-low loadings of Au for stainless steel bipolar plates
US7193934B2 (en) * 2002-06-07 2007-03-20 Carnegie Mellon University Domain position detection magnetic amplifying magneto-optical system
US8460841B2 (en) * 2005-07-01 2013-06-11 Basf Fuel Cell Gmbh Gas diffusion electrodes, membrane-electrode assemblies and method for the production thereof
JP4670530B2 (ja) * 2005-08-01 2011-04-13 アイテック株式会社 電解用の貴金属電極とその製造方法
DE102006057386A1 (de) * 2006-12-04 2008-06-05 Uhde Gmbh Verfahren zum Beschichten von Substraten
JP5189781B2 (ja) * 2007-03-23 2013-04-24 ペルメレック電極株式会社 水素発生用電極
US7806641B2 (en) * 2007-08-30 2010-10-05 Ascentool, Inc. Substrate processing system having improved substrate transport system

Also Published As

Publication number Publication date
AU2010291209A1 (en) 2012-03-01
BR112012004765A2 (pt) 2016-03-15
EA201270368A1 (ru) 2012-09-28
MX2012002713A (es) 2012-04-19
WO2011026914A1 (en) 2011-03-10
ITMI20091531A1 (it) 2011-03-04
IL217803A0 (en) 2012-03-29
AU2010291209B2 (en) 2014-08-28
US20120164344A1 (en) 2012-06-28
CA2769818A1 (en) 2011-03-10
ZA201201432B (en) 2013-05-29
CN102482770B (zh) 2015-03-25
EA024663B1 (ru) 2016-10-31
JP5693583B2 (ja) 2015-04-01
EP2473647A1 (en) 2012-07-11
KR20120049380A (ko) 2012-05-16
EG26695A (en) 2014-06-11
JP2013503967A (ja) 2013-02-04
CN102482770A (zh) 2012-05-30
AR078328A1 (es) 2011-11-02

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20190902